Abstract: Disclosed is a mobile communication system including a network constituted of at least one switching center and a plurality of base stations, and a mobile station which communicates with the base stations simultaneously. The system permits varying transmission delay between the switching center and the base stations according to the type of services available to the mobile station. The object of the present invention is to propose a communication which permits varying transmission delay according to the type of service currently employed, and to promptly recover a synchronization state even if an out-of-sync state happens. To attain the object, a memory means (mobile switching center processor 32) stores transmission delay characteristics corresponding to services which are available to the mobile station.

Abstract: Disclosed is a mobile communication system including a network constituted of at least one switching center and a plurality of base stations, and a mobile station which communicates with the base stations simultaneously. The system permits varying transmission delay between the switching center and the base stations according to the type of services available to the mobile station. The object of the present invention is to propose a communication which permits varying transmission delay according to the type of service currently employed, and to promptly recover a synchronization state even if an out-of-sync state happens. To attain the object, a memory means (mobile switching center processor 32) stores transmission delay characteristics corresponding to services which are available to the mobile station.

Abstract: A support member 1 is previously molded, a hybrid integrated circuit substrate 45 is placed thereon, and the support member 1 on which the hybrid integrated circuit substrate 45 is placed is placed in a metal mold, then again molded of a thermoplastic resin 2. The poured high-temperature thermoplastic resin 2 strikes on the support member 1 whose bottom surface is directly contacted on the metal mold and the surface of the striking portion is melted and integrated without being deformed . Therefore, full mold substantially covering an entire surface of the substrate is enabled. Epoxy potting is applied to a semiconductor chip and a coil derivation part.

Abstract: A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through electrically connecting means; an outer read which is electrically connected to the conductor patterns and is extended to the outside; and a sealing member of thermoplastic resin so as to be molded and cover at least the surface of the substrate.

Abstract: A support member 1 is previously molded, a hybrid integrated circuit substrate 45 is placed thereon, and the support member 1 on which the hybrid integrated circuit substrate 45 is placed is placed in a metal mold, then again molded of a thermoplastic resin 2. The poured high-temperature thermoplastic resin 2 strikes on the support member 1 whose bottom surface is directly contacted on the metal mold and the surface of the striking portion is melted and integrated without being deformed. Therefore, full mold substantially covering an entire surface of the substrate is enabled. Epoxy potting is applied to a semiconductor chip and a coil derivation part.

Abstract: Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

Abstract: Novel fluorine-modified acid anhydrides of formula (1) are useful curing agents typically in epoxy resin compositions for encapsulating semiconductor devices. ##STR1## R.sup.1 is a hydrogen atom, substituted or unsubstituted monovalent hydrocarbon group, hydroxyl group, alkoxy group or alkenyloxy group. Rf is a divalent perfluoroalkylene or perfluoropolyether group of the general formula (2): ##STR2## wherein l is an integer of 0 to 8, k and m are integers of 0 to 15, j and n are 0 or 1, with the proviso that j, k, l, m and n are not equal to 0 at the same time.

Abstract: A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

Abstract: Disclosed is a hybrid integrated circuit device provided with an active filter. The active filter is constructed mainly from a rectifier circuit, a reactor with one terminal connected with an output terminal of the rectifier, a switching element connected with one terminal of the reactor and a smoothing condenser connected with the other terminal of the reactor. The active filter is mounted on an insulating metal substrate and has, other than the above feature, a specific circuit structure wherein the substrate is divided by a ground pattern or power supply pattern into two blocks. One block is for a large current circuit such as the rectifier circuit, the switching element, and a diode and another block for a small signal circuit such as a control circuit. The hybrid integrated circuit device is of remarkably compact size.

Abstract: Fluorine-modified thermosetting reins are available as phenolic or epoxy resins having trifluoromethyl groups and a naphthalene skeleton in a molecule. They are useful as components of resin compositions or resin modifiers and cure to products having low water pickup, low coefficient of thermal expansion, and adhesion as well as heat resistance and mechanical strength. Thermosetting resin compositions having such a thermosetting resin blended therein are useful in semiconductor element packaging.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.

Abstract: A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.

Abstract: A naphthalene derivative of the following general formula (1) having at least one allyl or propenyl group is described. ##STR1## In the formula, each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom, an allyl group or a propenyl group provided that at least one or R.sup.1 's is an allyl group or a propenyl group, and R.sup.2 's independently represent a hydrogen atom, an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, or a halogen atom. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.

Abstract: In a carriage for conveying an article such as an automobile body on a coating line, a sprocket on the carriage engages an endless chain running along the path of carriage movement. The sprocket causes the article to rotate on an axis parallel to the direction of movement of the carriage. A pendulum weight is provided to cause the article normally to assume an upright condition. A lever on the sprocket shaft engages a cam as the sprocket approaches engagement with the endless chain, and causes the weight to swing in one direction. When the lever clears the cam, the weight returns by gravity, causing the sprocket to begin rotating so that it smoothly engages the chain without shock. The operation of the lever, cam and weight also impart rotation to article to be painted before the sprocket engages the chain, thereby eliminating shocks in the rotating movement of the article, which could otherwise cause sagging or running of the paint.

Abstract: In a coating line conveyor for an automobile body, in which the body is movable along a path and rotated on an axis parallel to the path, the article is stopped in its erect attitude without impact force. The article is supported so that the combined center of gravity of the article and its supports is located directly below the axis of rotation of the article when the article is erect. Rotation is stopped by removing rotating power from the article supports in response to a signal generated by a sensor when the article is in its erect condition. The article then rocks back and forth under its own inertia and rapidly approaches a stable erect condition by a naturally damped oscillating motion.