Abstract: The invention relates to methods of processing a wafer, having on one side a device area with a plurality of devices. In particular, the invention relates to a method which comprises providing a protective film, and applying the protective film to the side of the wafer being opposite to the one side, so that at least a central area of a front surface of the protective film is in direct contact with the side of the wafer being opposite to the one side. The method further comprises applying an external stimulus to the protective film during and/or after applying the protective film to the side of the wafer being opposite to the one side, so that the protective film is attached to the side of the wafer being opposite to the one side, and processing the one side of the wafer and/or the side of the wafer being opposite to the one side.

Abstract: The second multi-dimensional feature vectors 92a of sample image data 34a having instruction signals that are converted by a feature converter 27 are read in (Step S10), two-dimensional graph data for model 36a is generated based on the read second multi-dimensional feature vectors 92a to be stored (Step S12), two-dimensional model graphs Og and Ng are generated based on the generated two-dimensional graph data for model 36a, to be displayed on the window 62 (Step S14). The second multi-dimensional feature vectors 92a are indicators appropriate for visualization of the trained state (individuality) of a trained model 35. Thus, it is possible to visually check and evaluate whether the trained model 35 is in an appropriately trained state (individuality) or not.

Abstract: The invention relates to a method of producing a substrate with a functional layer. The method comprises providing a workpiece having a first surface and a second surface opposite the first surface, and forming a modified layer inside the workpiece, the modified layer comprising a plurality of modified regions. Further, the method comprises, after forming the modified layer inside the workpiece, forming the functional layer on the first surface of the workpiece and, after forming the functional layer on the first surface of the workpiece, dividing the workpiece along the modified layer, thereby obtaining the substrate with the functional layer. Dividing the workpiece along the modified layer comprises applying an external stimulus to the workpiece. Moreover, the invention relates to a substrate producing system for performing this method.

Abstract: The invention relates to methods of processing a wafer, having on one side a device area with a plurality of devices. In particular, the invention relates to a method which comprises providing a protective film, and applying the protective film to the side of the wafer being opposite to the one side, so that at least a central area of a front surface of the protective film is in direct contact with the side of the wafer being opposite to the one side. The method further comprises applying an external stimulus to the protective film during and/or after applying the protective film to the side of the wafer being opposite to the one side, so that the protective film is attached to the side of the wafer being opposite to the one side, and processing the one side of the wafer and/or the side of the wafer being opposite to the one side.

Abstract: The invention relates to methods of processing a wafer, having on one side a device area with a plurality of devices. In particular, the invention relates to a method which comprises providing a protective film, and applying the protective film to the side of the wafer being opposite to the one side, so that at least a central area of a front surface of the protective film is in direct contact with the side of the wafer being opposite to the one side. The method further comprises applying an external stimulus to the protective film during and/or after applying the protective film to the side of the wafer being opposite to the one side, so that the protective film is attached to the side of the wafer being opposite to the one side, and processing the one side of the wafer and/or the side of the wafer being opposite to the one side.

Abstract: The invention relates to a method of processing a workpiece having a first surface, a second surface opposite the first surface, and a third surface extending between the first and second surfaces. The method comprises forming modified regions inside the workpiece so as to create openings in the workpiece. The openings extend to at least one of the first surface, the second surface and the third surface. The method further comprises, after forming the modified regions inside the workpiece, introducing a liquid medium into at least some of the openings and, after introducing the liquid medium into the at least some of the openings, applying an external stimulus to the liquid medium so as to increase the volume of the medium. Moreover, the invention relates to a workpiece processing system for performing this method.

Abstract: The invention relates to a method of producing a substrate with a functional layer. The method comprises providing a workpiece having a first surface and a second surface opposite the first surface, and forming a modified layer inside the workpiece, the modified layer comprising a plurality of modified regions. Further, the method comprises, after forming the modified layer inside the workpiece, forming the functional layer on the first surface of the workpiece and, after forming the functional layer on the first surface of the workpiece, dividing the workpiece along the modified layer, thereby obtaining the substrate with the functional layer. Dividing the workpiece along the modified layer comprises applying an external stimulus to the workpiece. Moreover, the invention relates to a substrate producing system for performing this method.

Abstract: An image generation device includes: a rasterizing portion generating, according string data, an element-blank image including a first element image indicating a first-type string element of a string and a blank image indicating a blank; an embedding portion identifying and embedding a second element image indicating a second-type string element of the string in the blank image; a first data storage portion in which a first data group used to generate the first element image is stored; and a second data storage portion in which a second data group including an image to be embedded as the second element image is stored. The rasterizing portion generates the first element image based on the first data group, and generates the blank image at a position where the second element image is to be embedded by identifying an embedding position of the second element image.

Abstract: A method of processing a wafer having on one side a device area with a plurality of devices includes providing a protective film and applying the protective film to the device side of the wafer or to the other side of the wafer, so that at least a central area of a front surface of the protective film is in direct contact with the device side or the other side of the wafer. The protective film is attached to the device side or to other side of the wafer, so that at least a part of a peripheral portion of the protective film is attached to at least a part of a lateral edge of the wafer along the entire circumference of the wafer. The lateral edge of the wafer extends from the device side of the wafer to the other side of the wafer.

Abstract: The invention relates to a method of processing a substrate. The substrate has on a first surface a device area with a plurality of devices partitioned by a plurality of division lines. A pulsed laser beam is applied to the substrate at least in a plurality of positions along each of the division lines, with a focal point located at a distance from the first surface in the direction from the first surface towards a second, opposite surface, so as to form a plurality of modified regions in the substrate along each of the division lines. The second surface of the substrate is then ground to adjust the substrate thickness. After forming modified regions and/or hole regions in the substrate, a plasma can be applied to the substrate so as to form a plurality of grooves extending along the division lines.

Abstract: A display control device includes an image creating unit, a display output unit, an update time measuring unit, and a blinking control unit. The blinking control unit determines a bright time and a dark time to be integral multiples of an update time so that a blinking frequency is within a tolerance frequency range. In a blinking control, the blinking control unit executes an on-display control to instruct the image creating unit to create a bright image for a number of times of a value obtained by dividing the bright time by the update time, and then executes an off-display control to instruct the image creating unit to create the dark image for a number of times of a value obtained by dividing the dark time by the update time, and repeats the on-display control and the off-display control until the blinking control ends.

Abstract: A method of processing a wafer having on one side a device area with a plurality of devices includes providing a protective film and applying the protective film to the device side of the wafer or to the other side of the wafer, so that at least a central area of a front surface of the protective film is in direct contact with the device side or the other side of the wafer. The protective film is attached to the device side or to other side of the wafer, so that at least a part of a peripheral portion of the protective film is attached to at least a part of a lateral edge of the wafer along the entire circumference of the wafer. The lateral edge of the wafer extends from the device side of the wafer to the other side of the wafer.

Abstract: The invention relates to methods of processing a wafer, having on one side a device area with a plurality of devices. In particular, the invention relates to a method which comprises providing a protective film, and applying the protective film to the side of the wafer being opposite to the one side, so that at least a central area of a front surface of the protective film is in direct contact with the side of the wafer being opposite to the one side. The method further comprises applying an external stimulus to the protective film during and/or after applying the protective film to the side of the wafer being opposite to the one side, so that the protective film is attached to the side of the wafer being opposite to the one side, and processing the one side of the wafer and/or the side of the wafer being opposite to the one side.

Abstract: A display control device includes an image creating unit, a display output unit, an update time measuring unit, and a blinking control unit. The blinking control unit determines a bright time and a dark time to be integral multiples of an update time so that a blinking frequency is within a tolerance frequency range. In a blinking control, the blinking control unit executes an on-display control to instruct the image creating unit to create a bright image for a number of times of a value obtained by dividing the bright time by the update time, and then executes an off-display control to instruct the image creating unit to create the dark image for a number of times of a value obtained by dividing the dark time by the update time, and repeats the on-display control and the off-display control until the blinking control ends.

Abstract: A method of processing a wafer having a plurality of devices partitioned by division lines, including attaching the wafer to an adhesive tape supported by a first annular frame, dividing the wafer along the division lines into a plurality of dies, and placing the wafer (and the adhesive tape) on a support surface of a support member before or after dividing the wafer, wherein an outer diameter of the support member in the plane of the support surface is smaller than an inner diameter of the first annular frame. The method also includes moving the first annular frame and at least a peripheral part of the support member relative to each other to radially expand the adhesive tape, thereby moving the dies away from each other, and attaching a second annular frame to a portion of the expanded adhesive tape arranged at the peripheral part of the support member.

Abstract: Disclosed herein is a wafer processing method for removing an annular reinforcing portion from a wafer having a device area, the annular reinforcing portion being formed around the device area. The wafer processing method includes the steps of supporting the wafer through an adhesive tape to an annular frame, forming a mark corresponding to a notch at a position radially inside a boundary portion between the annular reinforcing portion and the device area, cutting the boundary portion together with the adhesive tape to thereby separate the annular reinforcing portion from the device area, and moving the annular reinforcing portion supported through the adhesive tape to the annular frame away from a holding table to thereby remove the annular reinforcing portion from the wafer.

Abstract: The invention relates to a method of processing a substrate. The substrate has on a first surface a device area with a plurality of devices partitioned by a plurality of division lines. A pulsed laser beam is applied to the substrate at least in a plurality of positions along each of the division lines, with a focal point located at a distance from the first surface in the direction from the first surface towards a second, opposite surface, so as to form a plurality of modified regions in the substrate along each of the division lines. The second surface of the substrate is then ground to adjust the substrate thickness. After forming modified regions and/or hole regions in the substrate, a plasma can be applied to the substrate so as to form a plurality of grooves extending along the division lines.

Abstract: A method of processing a wafer having a plurality of devices partitioned by division lines, including attaching the wafer to an adhesive tape supported by a first annular frame, dividing the wafer along the division lines into a plurality of dies, and placing the wafer (and the adhesive tape) on a support surface of a support member before or after dividing the wafer, wherein an outer diameter of the support member in the plane of the support surface is smaller than an inner diameter of the first annular frame. The method also includes moving the first annular frame and at least a peripheral part of the support member relative to each other to radially expand the adhesive tape, thereby moving the dies away from each other, and attaching a second annular frame to a portion of the expanded adhesive tape arranged at the peripheral part of the support member.

Abstract: An image generation device includes: a rasterizing portion generating, according string data, an element-blank image including a first element image indicating a first-type string element of a string and a blank image indicating a blank; an embedding portion identifying and embedding a second element image indicating a second-type string element of the string in the blank image; a first data storage portion in which a first data group used to generate the first element image is stored; and a second data storage portion in which a second data group including an image to be embedded as the second element image is stored. The rasterizing portion generates the first element image based on the first data group, and generates the blank image at a position where the second element image is to be embedded by identifying an embedding position of the second element image.

Abstract: A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. A modified region is formed in the wafer along the division lines by a laser. The wafer is placed on a support member whose outer diameter is smaller than an inner diameter of the first annular frame. After applying the laser beam, the adhesive tape is expanded thereby dividing the wafer along the division lines. A second annular frame is attached to a portion of the expanded adhesive tape. An inner diameter of the second annular frame is smaller than the outer diameter of the support member and smaller than the inner diameter of the first annular frame.