Abstract: An interference wave signal frequency is highly accurate and the interference wave signal is surely removed. A controller of an interference wave signal remover detects the interference wave signal based on a frequency scanning result by an entire-range frequency scanner, and sets a notch filter to attenuate the interference wave signal frequency. A local scan frequency band BWfL of a local frequency scanner is set by having the interference wave signal frequency as its central frequency, and local scan frequencies BINL are set so that frequency bands overlap with each other between adjacent frequency BINA. The local frequency scanner frequency-scans input signals to the notch filter. The controller calculates a frequency error ?f of the interference wave signal frequency from the local frequency scanner, corrects the interference wave signal frequency which is from the entire-range frequency scanner by the frequency error ?f, and updates the setting of the notch filter.

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Abstract: A wiring board includes a single-layer insulating layer, and a single-layer interconnect layer embedded in the insulating layer, wherein an entirety of a first surface of the interconnect layer is exposed in a recessed position relative to a first surface of the insulating layer, and a second surface of the interconnect layer is partially exposed in a recessed position relative to a second surface of the insulating layer.

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Abstract: An interference wave signal removing device that can surely remove an interference wave signal is provided. An interference wave signal remover includes a controller, a notch filter, an entire-range frequency scanner, and a local frequency scanner. The controller detects the interference wave signal based on a frequency scanning result by the entire-range frequency scanner, and sets the notch filter to attenuate the interference wave signal frequency. Based on input signals to the notch filter, the local frequency scanner frequency-scans in a local frequency band including an attenuation band of the notch filter. The controller detects a frequency drift of the interference wave signal frequency based on the frequency scanning result by the local frequency scanner, and updates the setting of the notch filter to attenuate the interference wave signal frequency after the frequency drift.

Abstract: A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer.

Abstract: A liquefied gas reliquefier reliquefies boil-off gas resulting from evaporation of liquefied gas in a liquefied-gas storage tank to prevent a rise in the internal pressure of the liquefied-gas storage tank. The liquefied gas reliquefier includes a cooling unit for liquefying a secondary refrigerant, a liquefied-secondary-refrigerant feeding unit for feeding the liquefied secondary refrigerant, and a heat exchange unit disposed in the secondary-refrigerant circulating channel to condense the BOG by heat exchange between the BOG and the liquefied secondary refrigerant. The heat exchange unit is disposed near the liquefied-gas storage tank. The cooling unit includes a plurality of pulse-tube refrigerators. The number of pulse-tube refrigerators in operation and/or the cooling capacities of the individual pulse-tube refrigerators are controlled based on a measurement result from at least one of a thermometer, a pressure gauge, and a pump discharge flow meter installed in the liquefied-gas storage tank.

Abstract: An interference wave signal removing device that can surely remove an interference wave signal is provided. An interference wave signal remover includes a controller, a notch filter, an entire-range frequency scanner, and a local frequency scanner. The controller detects the interference wave signal based on a frequency scanning result by the entire-range frequency scanner, and sets the notch filter to attenuate the interference wave signal frequency. Based on input signals to the notch filter, the local frequency scanner frequency-scans in a local frequency band including an attenuation band of the notch filter. The controller detects a frequency drift of the interference wave signal frequency based on the frequency scanning result by the local frequency scanner, and updates the setting of the notch filter to attenuate the interference wave signal frequency after the frequency drift.

Abstract: An interference wave signal frequency is highly accurate and the interference wave signal is surely removed. A controller of an interference wave signal remover detects the interference wave signal based on a frequency scanning result by an entire-range frequency scanner, and sets a notch filter to attenuate the interference wave signal frequency. A local scan frequency band BWfL of a local frequency scanner is set by having the interference wave signal frequency as its central frequency, and local scan frequencies BINL are set so that frequency bands overlap with each other between adjacent frequency BINA. The local frequency scanner frequency-scans input signals to the notch filter. The controller calculates a frequency error ?f of the interference wave signal frequency from the local frequency scanner, corrects the interference wave signal frequency which is from the entire-range frequency scanner by the frequency error ?f, and updates the setting of the notch filter.

Abstract: A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.

Abstract: A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.

Abstract: A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer.

Abstract: A power unit for a motorcycle having a continuously variable transmission, which is housed in a transmission chamber inside a engine body and which accomplishes stepless changes in the transmission of power from a drive pulley shaft to a driven pulley shaft by changing the effective diameter with which a belt actually wraps around each of the drive and the driven pulleys. An input clutch is set between a crankshaft and a drive pulley and is provided on the drive pulley shaft. A starter clutch is set between a driven pulley shaft and a rear wheel and is provided on the driven pulley shaft. The switching between the engagement and disengagement of one of the input clutch and the starter clutch is hydraulically controlled. Meanwhile, the switching between the engagement and disengagement of the other one of the input clutch and the starter clutch is mechanically controlled.

Abstract: An aerator includes a ventilating member that opposes a heat generating object and through which air flows, and an inlet device that takes in air from an outside and sends the air to the ventilating member. The ventilating member includes a discharging portion that discharges the air flowing through the ventilating member to the outside, an opening through which heat generated by the heat generating object enters the ventilating member, and a restraining portion that restrains the air taken in by the inlet device from flowing to the heat generating object through the opening.

Abstract: A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.

Abstract: A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.

Abstract: A wiring substrate includes a plurality of insulating layers; and a plurality of wiring layers being alternately laminated, wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside, a cross-sectional shape of a sidewall of the opening portion is concaved and curved, and the outermost wiring layer has a recess on a side exposed to the outside.

Abstract: A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue.

Abstract: A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the opening portion by an electroplating, removing the plating resist, wet-etching the seed layer using the copper plating layer as a mask to obtain the wiring layer, roughening a surface of the wiring layer by a blackening process, and forming an insulating layer on the wiring layer, wherein a surface of the copper plating layer is soft-etched simultaneously in the step of etching the seed layer, whereby a soft etching step of the wiring layer carried out prior to the step of the blackening process is omitted.

Abstract: An azo compound of the present invention is represented by the general formula (1): (wherein, R1 and R2 each independently represents a hydroxy group, or a polymerizable functional group selected from the group consisting of a (meth)acryloyl group, a (meth)acryloyloxy group, a (meth)acrylamide group, a vinyl group, a vinyloxy group, and a maleimide group; X1 represents single bond when R1 is a hydroxy group and represents a linking group represented by -(A1-B1)m- when R1 is a polymerizable functional group; X2 represents a single bond when R2 is a hydroxy group and represents a linking group represented by -(A2-B2)n- when R2 is a polymerizable functional group; R3 and R4 each independently represents —OR7, a hydroxyalkyl group having 1 to 4 carbon atoms, or —CONR8R9; and R5 and R6 each independently represents a carboxy group, a sulfo group, a nitro group, amino group, or a hydroxy group).