Patents by Inventor Hitoshi Kouno
Hitoshi Kouno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11348819Abstract: An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, an electrostatic attraction electrode; a base part configured to cool the electrostatic chuck part; a heater disposed in a layered manner between the electrostatic chuck part and the base part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the insulator located on the electrostatic chuck part side is separated from the electrostatic chuck part with a space interposed therebetween.Type: GrantFiled: December 11, 2018Date of Patent: May 31, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yuuki Kinpara, Ryuuji Hayahara, Kazunori Ishimura, Hitoshi Kouno
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Patent number: 11024528Abstract: An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the placing surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.Type: GrantFiled: October 21, 2016Date of Patent: June 1, 2021Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yoshiaki Moriya, Keigo Maki, Hitoshi Kouno, Kazuto Ando, Yuuki Kinpara
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Patent number: 10923381Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.Type: GrantFiled: January 18, 2017Date of Patent: February 16, 2021Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru Kosakai, Yukio Miura, Kazunori Ishimura, Keisuke Maeda, Hitoshi Kouno, Yuuki Kinpara, Shinichi Maeta, Tomomi Ito
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Publication number: 20200343125Abstract: An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, and provided with an electrostatic attraction electrode; a base part which is disposed on a side opposite to the mounting surface with respect to the electrostatic chuck part and is configured to cool the electrostatic chuck part; a heater which is disposed in a layered manner between the electrostatic chuck part and the base part or in an interior of the electrostatic chuck part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the iType: ApplicationFiled: December 11, 2018Publication date: October 29, 2020Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yuuki KINPARA, Ryuuji HAYAHARA, Kazunori ISHIMURA, Hitoshi KOUNO
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Patent number: 10502639Abstract: A plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature. In such plate-shaped body for temperature measurement (1), an insulating adhesive (3) is bonded to the entirety of a surface (2a) of a wafer (2), a heater element (4) is provided on the insulating adhesive (3), a temperature measurement region (5) is provided used to measure the temperature of the surface (2a) of the wafer (2) in a region excluding the heater element (4) on the surface (3a) of the insulating adhesive (3), and the heater element (4) and the temperature measurement region (5) are coated with an insulating film (6).Type: GrantFiled: August 22, 2012Date of Patent: December 10, 2019Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru Kosakai, Kazunori Ishimura, Takeshi Watanabe, Hitoshi Kouno, Ryuuji Hayahara
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Patent number: 10262886Abstract: Disclosed is an electrostatic chuck device for increasing electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In such a device, a mounting table has a holder in the periphery of a placing surface along the circumferential direction of a focus ring, the holder has a pair of banks in the circumferential direction, and an annular groove formed between these banks, and in at least a bank on an outer circumferential position of the focus ring among the pair of the banks, a micro-protruding part including a plurality of micro-protrusions is on a surface facing the focus ring, or convex parts are on a bottom of the groove. The convex parts do not contact the focus ring, and the pair of banks or plurality of micro-protrusions contacts the focus ring and electrostatically adsorbs the focus ring in coordination with the convex parts.Type: GrantFiled: September 24, 2015Date of Patent: April 16, 2019Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Hitoshi Kouno, Kentaro Takahashi, Fumihiro Gobou
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Publication number: 20190019714Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.Type: ApplicationFiled: January 18, 2017Publication date: January 17, 2019Inventors: Mamoru KOSAKAI, Yukio MIURA, Kazunori ISHIMURA, Keisuke MAEDA, Hitoshi KOUNO, Yuuki KINPARA, Shinichi MAETA, Tomomi ITO
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Patent number: 10153192Abstract: An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like sample is placed; a base portion for temperature adjustment disposed in opposition to the side of the electrostatic chuck portion on the opposite side from the placement surface; a bonding portion for bonding the electrostatic chuck portion and the base portion for temperature adjustment together; and an annular focus ring surrounding the periphery of the placement surface, in which the volume of a space surrounded by the electrostatic chuck portion, the focus ring, the bonding portion, and a dam portion of the base portion for temperature adjustment is greater than the amount of volume expansion of the bonding portion at the working temperature.Type: GrantFiled: September 13, 2016Date of Patent: December 11, 2018Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Shinichi Maeta, Yukio Miura, Mamoru Kosakai, Hitoshi Kouno
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Publication number: 20180308737Abstract: An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the mounting surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.Type: ApplicationFiled: October 21, 2016Publication date: October 25, 2018Applicant: Sumitomo Osaka Cement Co., Ltd.Inventors: Yoshiaki MORIYA, Keigo MAKI, Hitoshi KOUNO, Kazuto ANDO, Yuuki KINPARA
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Publication number: 20180269097Abstract: An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like sample is placed; a base portion for temperature adjustment disposed in opposition to the side of the electrostatic chuck portion on the opposite side from the placement surface; a bonding portion for bonding the electrostatic chuck portion and the base portion for temperature adjustment together; and an annular focus ring surrounding the periphery of the placement surface, in which the volume of a space surrounded by the electrostatic chuck portion, the focus ring, the bonding portion, and a dam portion of the base portion for temperature adjustment is greater than the amount of volume expansion of the bonding portion at the working temperature.Type: ApplicationFiled: September 13, 2016Publication date: September 20, 2018Inventors: Shinichi MAETA, Yukio MIURA, Mamoru KOSAKAI, Hitoshi KOUNO
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Patent number: 10068790Abstract: An electrostatic chuck device that adsorbs a plate-like specimen with an electrostatic adsorption electrode and cools the plate-like specimen, including an electrostatic chuck portion, a forming material of which is a ceramic sintered body, and that has one main surface that is a placement surface on which the plate-like specimen is placed, in which a plurality of protrusions supporting the plate-like specimen are provided on the placement surface, the protrusion has a top surface that is in contact with the plate-like specimen and supports the plate-like specimen, and has a cross-sectional area that gradually increases vertically downward from a height position of the top surface, and a cross-sectional area at a distance 0.6 ?m vertically downward from a lower end of the top surface of the protrusion is 110% or less of a cross-sectional area of a lower end of the top surface.Type: GrantFiled: September 9, 2015Date of Patent: September 4, 2018Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Hitoshi Kouno, Fumihiro Gobou
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Publication number: 20170287764Abstract: The present invention provides an electrostatic chuck device capable of increasing the electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In an electrostatic chuck device (10) of the present invention, a mounting table (11) has a holder (15) being provided in the periphery of a placing surface (24a) along the circumferential direction of a focus ring (12) and electrostatically adsorbing the focus ring (12), the holder (15) has a pair of banks (16) being provided in the circumferential direction and being for placing the focus ring (12) thereon, and an annular groove (17) formed between these banks, and, in at least a bank (16A) on an outer circumferential position of the focus ring (12) among the pair of the banks (16), a micro-protruding part including a plurality of micro-protrusions is formed on a surface facing the focus ring (12), or convex parts (18) are provided on a bottom (17a) of the groove (17).Type: ApplicationFiled: September 24, 2015Publication date: October 5, 2017Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Hitoshi KOUNO, Kentaro TAKAHASHI, Fumihiro GOBOU
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Publication number: 20170243778Abstract: An electrostatic chuck device that adsorbs a plate-like specimen with an electrostatic adsorption electrode and cools the plate-like specimen, including an electrostatic chuck portion, a forming material of which is a ceramic sintered body, and that has one main surface that is a placement surface on which the plate-like specimen is placed, in which a plurality of protrusions supporting the plate-like specimen are provided on the placement surface, the protrusion has a top surface that is in contact with the plate-like specimen and supports the plate-like specimen, and has a cross-sectional area that gradually increases vertically downward from a height position of the top surface, and a cross-sectional area at a distance 0.6 ?m vertically downward from a lower end of the top surface of the protrusion is 110% or less of a cross-sectional area of a lower end of the top surface.Type: ApplicationFiled: September 9, 2015Publication date: August 24, 2017Inventors: Hitoshi KOUNO, Fumihiro GOBOU
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Patent number: 9721822Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: GrantFiled: March 6, 2015Date of Patent: August 1, 2017Assignees: Tokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Publication number: 20150179492Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: ApplicationFiled: March 6, 2015Publication date: June 25, 2015Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Patent number: 8981263Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: GrantFiled: December 8, 2010Date of Patent: March 17, 2015Assignees: Tokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Publication number: 20140204975Abstract: There are provided a plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself which is a product, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature, and a temperature measuring apparatus provided with the same.Type: ApplicationFiled: August 22, 2012Publication date: July 24, 2014Applicant: Sumitomo Osaka Cement Co., Ltd.Inventors: Mamoru Kosakai, Kazunori Ishimura, Takeshi Watanabe, Hitoshi Kouno, Ryuuji Hayahara
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Publication number: 20120281334Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: ApplicationFiled: December 8, 2010Publication date: November 8, 2012Applicants: SUMITOMO OSAKA CEMENT CO., LTD., TOKYO ELECTRON LIMITEDInventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Patent number: 8130499Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.Type: GrantFiled: November 28, 2008Date of Patent: March 6, 2012Assignee: Panasonic CorporationInventors: Tohru Ohnishi, Hitoshi Kouno, Toshiyuki Taniguchi, Koji Nakashima, Toshiyuki Nakata, Tsunetsugu Imanishi, Keiichi Nakao
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Publication number: 20100091464Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.Type: ApplicationFiled: November 28, 2008Publication date: April 15, 2010Applicant: PANASONIC CORPORATIONInventors: Tohru Ohnishi, Hitoshi Kouno, Toshiyuki Taniguchi, Koji Nakashima, Toshiyuki Nakata, Tsunetsugu Imanishi, Keiichi Nakao