Patents by Inventor Hitoshi Miwa

Hitoshi Miwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10775431
    Abstract: A duty cycle measurement circuit obtains differential duty cycle measurements corresponding to the duty cycle of a signal at two or more different locations along a propagation path. The differential duty cycle measurements may include measurements of an input duty cycle and measurements of an output duty cycle. The duty cycle measurements may be acquired by use of duty-cycle-to-voltage converter circuitry. The duty cycle measurements may be used to determine a measure of the duty cycle deterioration of the propagation path, and an adjustment factor to compensate for the measured duty cycle deterioration.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: September 15, 2020
    Assignee: SanDisk Technologies LLC
    Inventor: Hitoshi Miwa
  • Publication number: 20200287452
    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200286678
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10756589
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 25, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20200161919
    Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20200083769
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075223
    Abstract: A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075224
    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200076263
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200030906
    Abstract: Provided is a seam welding device capable of seam welding various shapes of objects to be welded. A seam welding device which performs seam welding by causing electricity to be conducted between a first electrode wheel and a second electrode wheel comprises a first motor which drives the first electrode wheel, a second motor which drives the second electrode wheel, and a first belt provided between the first electrode wheel and the first motor. If a direction joining the axes of the first electrode wheel and the second electrode wheel is defined as a vertical direction, the direction from the first electrode wheel toward the second electrode wheel is upward, and the direction from the second electrode wheel toward the first electrode wheel is downward, then the first motor is disposed further upward than a point of contact of the first electrode wheel and the second electrode wheel.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 30, 2020
    Inventors: Hitoshi Yoshimichi, Hiroshi Miwa
  • Publication number: 20190245401
    Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 8, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20190115130
    Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20190074745
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 7, 2019
    Applicant: IBIDEN CO. , LTD.
    Inventors: Haruhiko MORITA, Shinobu KATO, Hitoshi MIWA, Hisashi KATO, Toshihiko YOKOMAKU
  • Publication number: 20190004111
    Abstract: A duty cycle measurement circuit obtains differential duty cycle measurements corresponding to the duty cycle of a signal at two or more different locations along a propagation path. The differential duty cycle measurements may include measurements of an input duty cycle and measurements of an output duty cycle. The duty cycle measurements may be acquired by use of duty-cycle-to-voltage converter circuitry. The duty cycle measurements may be used to determine a measure of the duty cycle deterioration of the propagation path, and an adjustment factor to compensate for the measured duty cycle deterioration.
    Type: Application
    Filed: June 28, 2017
    Publication date: January 3, 2019
    Inventor: Hitoshi Miwa
  • Publication number: 20180374630
    Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
    Type: Application
    Filed: June 27, 2018
    Publication date: December 27, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 9646708
    Abstract: An input/output interface circuit is provided for a memory device. The input/output interface circuit receives a first control signal and a second control signal, and provides an output clock signal. The input/output interface circuit includes a plurality of circuit blocks coupled in series, the a plurality of circuit blocks including an input terminal coupled to the first control signal and the second control signal, and an output terminal providing the output clock signal, a plurality of power switch transistors, each power switch transistor including a control terminal and coupled between a corresponding one of the circuit blocks and a power supply terminal, and a plurality of switch control circuits, each switch control circuit coupled to the control terminal of a corresponding one of the power switch transistors. The switch control circuits are configured to activate the circuit blocks in a first predetermined order and deactivate the circuit blocks in a second predetermined order.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: May 9, 2017
    Assignee: SanDisk Technologies LLC
    Inventor: Hitoshi Miwa
  • Patent number: 9531382
    Abstract: A non-volatile storage system includes an impedance code calibration circuit. The device has a first variable impedance circuit and a second variable impedance circuit coupled to a calibration node. The device has a control circuit configured to access a previous impedance code for a previous impedance calibration and to divide the previous impedance code into a main impedance code and a remainder impedance code. The control circuit is configured to perform a search for a new impedance code starting with the main impedance code applied to the first variable impedance circuit while maintaining the remainder impedance code to the second variable impedance circuit. The control circuit is configured to add the final impedance code for the first variable impedance circuit with the remainder impedance code to produce a new impedance code for the impedance calibration.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: December 27, 2016
    Assignee: SanDisk Technologies LLC
    Inventors: Hitoshi Miwa, Sravanti Addepalli, Sridhar Yadala
  • Publication number: 20160329106
    Abstract: An input/output interface circuit is provided for a memory device. The input/output interface circuit receives a first control signal and a second control signal, and provides an output clock signal. The input/output interface circuit includes a plurality of circuit blocks coupled in series, the a plurality of circuit blocks including an input terminal coupled to the first control signal and the second control signal, and an output terminal providing the output clock signal, a plurality of power switch transistors, each power switch transistor including a control terminal and coupled between a corresponding one of the circuit blocks and a power supply terminal, and a plurality of switch control circuits, each switch control circuit coupled to the control terminal of a corresponding one of the power switch transistors. The switch control circuits are configured to activate the circuit blocks in a first predetermined order and deactivate the circuit blocks in a second predetermined order.
    Type: Application
    Filed: May 7, 2015
    Publication date: November 10, 2016
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventor: Hitoshi Miwa
  • Publication number: 20160254812
    Abstract: An impedance calibration circuit is provided for off-chip driver/on-die termination circuits. The impedance calibration circuit includes a first circuit that includes first PMOS transistors coupled in parallel between a power supply terminal and a first output terminal, second PMOS transistors coupled in parallel between the power supply terminal and a second output terminal, first NMOS transistors coupled in parallel between the second output terminal and a GROUND terminal, a third PMOS transistor coupled in parallel with the first PMOS transistors between a power supply terminal and a first output terminal, and a second NMOS transistor coupled in parallel with the first NMOS transistors between the second output terminal and a GROUND terminal.
    Type: Application
    Filed: February 26, 2015
    Publication date: September 1, 2016
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventor: Hitoshi Miwa
  • Patent number: 9312209
    Abstract: A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x?1 switch circuits to connect x?1 data circuits to through silicon vias 1 to x?1 in the group of n adjacent through silicon vias, activating n?x switch circuits to connect n?x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: April 12, 2016
    Assignee: PS4 LUXCO S.A.R.L.
    Inventors: Kayoko Shibata, Hitoshi Miwa, Yoshihiko Inoue