Patents by Inventor Hitoshi Morinaga
Hitoshi Morinaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084170Abstract: Provided is a polishing composition that enables polishing a resin object to be polished at a high polishing removal rate and enables polishing the surface of a resin object to be polished into a flat and smooth surface. The polishing composition includes abrasives, a surfactant, and water, and the surfactant includes an acetylene compound having a carbon-carbon triple bond and represented by Chemical Formula (1). In Chemical Formula (1), R1, R2, R3, and R4 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 or more and 20 or less carbon atoms; R5 and R6 are each independently a substituted or unsubstituted alkylene group having 1 or more and 5 or less carbon atoms; m is an integer of 1 or more; n is an integer of 0 or more; and m+n is 50 or less. The polishing composition is used to polish a resin object to be polished.Type: ApplicationFiled: January 26, 2022Publication date: March 14, 2024Inventors: Hiroyuki Ishida, Hitoshi Morinaga
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Patent number: 11498182Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.Type: GrantFiled: February 20, 2017Date of Patent: November 15, 2022Assignee: FUJIMI INCORPORATEDInventors: Toru Kamada, Koji Katayama, Hitoshi Morinaga, Takashi Horibe
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Patent number: 11446784Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).Type: GrantFiled: May 15, 2019Date of Patent: September 20, 2022Assignees: EBARA CORPORATION, FUJIMI INCORPORATEDInventors: Yu Ishii, Kenya Ito, Hitoshi Morinaga, Kazusei Tamai, Shingo Ohtsuki, Hiroshi Asano
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Patent number: 10920104Abstract: Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an ?-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 ?m or more to 0.35 ?m or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.Type: GrantFiled: January 27, 2017Date of Patent: February 16, 2021Assignee: FUJIMI INCORPORATEDInventors: Hitoshi Morinaga, Kazusei Tamai, Maiko Asai, Yuuichi Ito, Kyosuke Tenko, Toru Kamada
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Patent number: 10882157Abstract: To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.Type: GrantFiled: May 18, 2016Date of Patent: January 5, 2021Assignee: FUJIMI INCORPORATEDInventors: Hitoshi Morinaga, Kazusei Tamai, Muneaki Tahara, Maiko Asai, Yuuichi Ito
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Patent number: 10835805Abstract: Provided are a sliding instrument having a low frictional resistance to the snow surface, the ice surface, or the water surface and having excellent sliding performance and a method for manufacturing the sliding instrument. A sliding instrument to slide on snow, ice, or water includes a sliding surface (1) to come into contact with the snow surface, the ice surface, or the water surface, and the sliding surface (1) has a surface roughness Ra of 1.0 ?m or less. A method for manufacturing the sliding instrument includes polishing a sliding surface (1) using a polishing composition slurry containing abrasives to make the sliding surface (1) have a surface roughness Ra of 1.0 ?m or less.Type: GrantFiled: June 2, 2017Date of Patent: November 17, 2020Assignee: FUJIMI INCORPORATEDInventors: Hitoshi Morinaga, Hiroyuki Ishida, Naoto Miyamoto
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Patent number: 10450651Abstract: Provided is an article having a novel surface with a texture different from conventional kinds. The article having a metal oxide-containing coating provided by the present invention comprises a substrate and a metal oxide-containing coating provided to the substrate surface. The metal oxide-containing coating has a Vickers hardness of 350 or higher, a surface roughness Ra of 300 nm or less, and a 20° gloss value of 50 or higher.Type: GrantFiled: November 27, 2013Date of Patent: October 22, 2019Assignee: FUJIMI INCORPORATEDInventors: Hitoshi Morinaga, Kazusei Tamai, Maiko Asai, Hiroaki Mizuno, Kyohei Ota
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Patent number: 10434622Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.Type: GrantFiled: July 30, 2015Date of Patent: October 8, 2019Assignee: FUJIMI INCORPORATEDInventors: Yutaka Niwano, Hitoshi Morinaga, Keigo Ohashi, Kazusei Tamai
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Publication number: 20190262968Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).Type: ApplicationFiled: May 15, 2019Publication date: August 29, 2019Inventors: Yu ISHII, Kenya ITO, Hitoshi MORINAGA, Kazusei TAMAI, Shingo OHTSUKI, Hiroshi ASANO
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Publication number: 20190153263Abstract: Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an ?-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 ?m or more to 0.35 ?m or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.Type: ApplicationFiled: January 27, 2017Publication date: May 23, 2019Applicant: FUJIMI INCORPORATEDInventors: Hitoshi MORINAGA, Kazusei TAMAI, Maiko ASAI, Yuuichi ITO, Kyosuke TENKO, Toru KAMADA
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Publication number: 20190126130Abstract: Provided are a sliding instrument having a low frictional resistance to the snow surface, the ice surface, or the water surface and having excellent sliding performance and a method for manufacturing the sliding instrument. A sliding instrument to slide on snow, ice, or water includes a sliding surface (1) to come into contact with the snow surface, the ice surface, or the water surface, and the sliding surface (1) has a surface roughness Ra of 1.0 ?m or less. A method for manufacturing the sliding instrument includes polishing a sliding surface (1) using a polishing composition slurry containing abrasives to make the sliding surface (1) have a surface roughness Ra of 1.0 ?m or less.Type: ApplicationFiled: June 2, 2017Publication date: May 2, 2019Applicant: FUJIMI INCORPORATEDInventors: Hitoshi MORINAGA, Hiroyuki ISHIDA, Naoto MIYAMOTO
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Publication number: 20190119523Abstract: Provided are a polishing composition, in which oxidation of magnetic particles hardly occurs, and a magnetic polishing method. The polishing composition (1) contains magnetic particles, an antioxidant for suppressing oxidation of the magnetic particles, and water. A magnetic field is applied to the polishing composition (1) to form a magnetic cluster (3) that contains the magnetic particles, and the magnetic cluster (3) is brought into contact with an object (5) to be polished, to polish the object (5) to be polished.Type: ApplicationFiled: March 23, 2017Publication date: April 25, 2019Applicant: FUJIMI INCORPORATEDInventors: Shuichi TAMADA, Hitoshi MORINAGA, Shota HISHIDA, Daisuke YASUI
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Publication number: 20190070707Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.Type: ApplicationFiled: February 20, 2017Publication date: March 7, 2019Applicant: FUJIMI INCORPORATEDInventors: Toru KAMADA, Koji KATAYAMA, Hitoshi MORINAGA, Takashi HORIBE
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Publication number: 20190010357Abstract: To provide a polishing composition in which abrasives are less likely to precipitate and precipitated and agglomerated abrasives easily redisperse. A polishing composition has abrasives, a liquid medium, metal oxide particles, and a water-soluble polymer. The average primary particle diameter of the metal oxide particles is 1/10 or less of the average primary particle diameter of the abrasives and the weight average molecular weight of the water-soluble polymer is 200 or more and 1000 or less.Type: ApplicationFiled: May 18, 2016Publication date: January 10, 2019Applicant: FUJIMI INCORPORATEDInventors: Toru KAMADA, Hitoshi MORINAGA
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Publication number: 20180200861Abstract: To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.Type: ApplicationFiled: May 18, 2016Publication date: July 19, 2018Applicant: FUJIMI INCORPORATEDInventors: Hitoshi MORINAGA, Kazusei TAMAI, Muneaki TAHARA, Maiko ASAI, Yuuichi ITO
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Patent number: 9994748Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.Type: GrantFiled: July 17, 2014Date of Patent: June 12, 2018Assignee: FUJIMI INCORPORATEDInventors: Hiroshi Asano, Maiko Asai, Hitoshi Morinaga, Kazusei Tamai
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Patent number: 9879156Abstract: Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate. The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m2/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.Type: GrantFiled: February 7, 2014Date of Patent: January 30, 2018Assignee: FUJIMI INCORPORATEDInventors: Jun Ito, Kazutoshi Hotta, Hiroyasu Sugiyama, Hitoshi Morinaga
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Publication number: 20170355882Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives made of carbide, and is used for polishing ceramic.Type: ApplicationFiled: November 26, 2015Publication date: December 14, 2017Applicant: FUJIMI INCORPORATEDInventors: Shingo OTSUKI, Tomoya IKEDO, Shota HISHIDA, Hitoshi MORINAGA, Maiko ASAI, Yuuichi ITO
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Publication number: 20170312880Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).Type: ApplicationFiled: October 30, 2015Publication date: November 2, 2017Inventors: Yu ISHII, Kenya ITO, Hitoshi MORINAGA, Kazusei TAMAI, Shingo OHTSUKI, Hiroshi ASANO
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Publication number: 20170252890Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.Type: ApplicationFiled: July 30, 2015Publication date: September 7, 2017Applicant: FUJIMI INCORPORATEDInventors: Yutaka NIWANO, Hitoshi MORINAGA, Keigo OHASHI, Kazusei TAMAI