Patents by Inventor Hitoshi Odajima

Hitoshi Odajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6585471
    Abstract: A method and an apparatus wherein the thin semiconductor wafer is cut into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet. A group of the semiconductor elements are removed from the adhesive sheet at high speed without incurring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: July 1, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Odajima, Kazuyuki Futagi, Makoto Matsuoka
  • Patent number: 6544819
    Abstract: A method and an apparatus wherein the thin semiconductor wafer is cut into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet. A group of the semiconductor elements are removed from the adhesive sheet at high speed without incurring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: April 8, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Odajima, Kazuyuki Futagi, Makoto Matsuoka
  • Publication number: 20010029064
    Abstract: For providing a method and an apparatus thereof, wherein a thin semiconductor wafer is cut out into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet, a group of the semiconductor elements are removed from the adhesive sheet at high speed without injuring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit, according to the present invention, the separating method comprising: a separation step for holding on a chuck a group of semiconductor elements with positioning objects, being stuck on an adhesive sheet fixed on a frame at periphery thereof under condition of a semiconductor wafer and cut into a unit of a semiconductor element, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held; and a storing step for storing into a tr
    Type: Application
    Filed: June 11, 2001
    Publication date: October 11, 2001
    Inventors: Hitoshi Odajima, Kazuyuki Futagi, Makoto Matsuoka
  • Publication number: 20010029088
    Abstract: For providing a method and an apparatus thereof, wherein a thin semiconductor wafer is cut out into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet, a group of the semiconductor elements are removed from the adhesive sheet at high speed without injuring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit, according to the present invention, the separating method comprising: a separation step for holding on a chuck a group of semiconductor elements with positioning objects, being stuck on an adhesive sheet fixed on a frame at periphery thereof under condition of a semiconductor wafer and cut into a unit of a semiconductor element, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held; and a storing step for storing into a tr
    Type: Application
    Filed: June 11, 2001
    Publication date: October 11, 2001
    Inventors: Hitoshi Odajima, Kazuyuki Futagi, Makoto Matsuoka
  • Patent number: 6297075
    Abstract: For providing a method and an apparatus thereof, wherein a thin semiconductor wafer is cut out into a unit of a thin semiconductor element under the condition of being stuck on an adhesive sheet, a group of the semiconductor elements are removed from the adhesive sheet at high speed without injuring and breaking each semiconductor element thereof, and the semiconductor elements are picked up from the removed group of the semiconductor elements by a predetermined unit, according to the present invention, the separating method comprising: a separation step for holding on a chuck a group of semiconductor elements with positioning objects, being stuck on an adhesive sheet fixed on a frame at periphery thereof under condition of a semiconductor wafer and cut into a unit of a semiconductor element, for cutting the adhesive sheet around the group of semiconductor elements being held, and for striping the cut adhesive sheet from said group of semiconductor elements being held; and a storing step for storing into a tr
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: October 2, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Odajima, Kazuyuki Futagi, Makoto Matsuoka