Patents by Inventor Hitoshi Onozeki

Hitoshi Onozeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10893616
    Abstract: Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 ?m or less and ? or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 ?m or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circui
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: January 12, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hitoshi Onozeki, Tsubasa Inoue, Katsuji Yamagishi, Hiroshi Shimizu
  • Publication number: 20200273837
    Abstract: Provided is a semiconductor element mounting structure, including: a semiconductor element including an element electrode, and a substrate including a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, the semiconductor element and the substrate being connected via the element electrode and the substrate electrode, in which: one of the element electrode or the substrate electrode is a first protruding electrode including a solder layer at a tip portion thereof, the other of the element electrode or the substrate electrode is a first electrode pad including one or more metal protrusions on a surface thereof, the one or more metal protrusions of the first electrode pad extend into the solder layer of the first protruding electrode, and a bottom area of each of the one or more metal protrusions of the first electrode pad is 70% or less with respect to an area of the first electrode pad, or 75% or less with respect to a maximum cross-sect
    Type: Application
    Filed: September 14, 2018
    Publication date: August 27, 2020
    Inventors: Hitoshi ONOZEKI, Shizu FUKUZUMI, Naoya SUZUKI, Toshihisa NONAKA
  • Publication number: 20180340056
    Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
    Type: Application
    Filed: August 26, 2016
    Publication date: November 29, 2018
    Inventors: Yuta Koseki, Daisuke Fujimoto, Kumpei Yamada, Naoya Suzuki, Hitoshi Onozeki, Hiroshi Takahashi
  • Publication number: 20180235090
    Abstract: Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 ?m or less and ? or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 ?m or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circui
    Type: Application
    Filed: August 10, 2016
    Publication date: August 16, 2018
    Inventors: Hitoshi ONOZEKI, Tsubasa INOUE, Katsuji YAMAGISHI, Hiroshi SHIMIZU
  • Patent number: 10051743
    Abstract: Provided are a metal foil single-clad two-ply laminate which comprises two pairs of structures each comprising one prepreg or a laminate of two or more prepregs cladded with a metal foil on one surface thereof, wherein the two pairs of structures are laminated on each other through thermal compression via a release material put therebetween so that each prepreg faces inward, and wherein the release material is a film of a resin material or the like and its thickness is from 10 to 200 ?m, and the thermal shrinkage of the release material at the temperature of the thermal compression treatment is at most 1.5%; and a method for producing the laminate. Also disclosed are a single-sided printed wiring board and its production method using the metal foil single-clad two-ply laminate.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: August 14, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hitoshi Onozeki, Takahiro Tanabe, Kiyoshi Saitou
  • Publication number: 20110108310
    Abstract: Provided are a metal foil single-clad two-ply laminate which comprises two pairs of structures each comprising one prepreg or a laminate of two or more prepregs cladded with a metal foil on one surface thereof, wherein the two pairs of structures are laminated on each other through thermal compression via a release material put therebetween so that each prepreg faces inward, and wherein the release material is a film of a resin material or the like and its thickness is from 10 to 200 ?m, and the thermal shrinkage of the release material at the temperature of the thermal compression treatment is at most 1.5%; and a method for producing the laminate. Also disclosed are a single-sided printed wiring board and its production method using the metal foil single-clad two-ply laminate.
    Type: Application
    Filed: April 4, 2008
    Publication date: May 12, 2011
    Inventors: Hitoshi Onozeki, Takahiro Tanabe, Kiyoshi Saitou
  • Patent number: 7740936
    Abstract: Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 ?m on a metal whose surface has a ten-point average roughness Rz of 2.0 ?m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: June 22, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Nobuyuki Ogawa, Hitoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike, Shin Takanezawa, Takako Ejiri, Toshihisa Kumakura
  • Publication number: 20080145689
    Abstract: Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 ?m on a metal whose surface has a ten-point average roughness Rz of 2.0 ?m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
    Type: Application
    Filed: November 10, 2005
    Publication date: June 19, 2008
    Inventors: Nobuyuki Ogawa, HItoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike, Shin Takanezawa, Takako (Formerly Watanabe) Ejiri, Toshihisa Kumakura