Patents by Inventor Ho Sik Ahn
Ho Sik Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8735931Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.Type: GrantFiled: October 19, 2010Date of Patent: May 27, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
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Patent number: 8721126Abstract: A backlight unit includes a flexible printed circuit board having a least one through hole perforated therein, and an LED package disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The LED package is directly bonded onto a bottom plate by a heat conductive adhesive.Type: GrantFiled: July 9, 2013Date of Patent: May 13, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Chul Hee Yoo, Ho Sik Ahn
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Publication number: 20130301276Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.Type: ApplicationFiled: July 9, 2013Publication date: November 14, 2013Inventors: Chul Hee YOO, Ho Sik AHN
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Patent number: 8508462Abstract: A dimming structure for an image display device further includes a contrast panel for altering contrast differences in a portion around an outputted image to achieve dimming effects on an image smaller than a light emitting lamp. In the dimming structure, a backlight unit has a plurality of light sources disposed therein. A display panel displays an image while the backlight unit is disposed to light the display panel. A contrast panel is disposed between the backlight unit and the display panel. The contrast panel has a light emitting window formed in a portion thereof corresponding to the image of the display panel to transmit light emitted from the backlight unit therethrough. The dimming structure assures uniform dimming effects on the portion around the image despite use of a light source bigger than the image to be outputted.Type: GrantFiled: December 29, 2006Date of Patent: August 13, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Chul Hee Yoo, Ho Sik Ahn
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Patent number: 8500306Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.Type: GrantFiled: February 2, 2011Date of Patent: August 6, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Chul Hee Yoo, Ho Sik Ahn
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Patent number: 8168453Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.Type: GrantFiled: February 13, 2009Date of Patent: May 1, 2012Assignee: Samsung LED Co., Ltd.Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
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Patent number: 7968894Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.Type: GrantFiled: August 27, 2009Date of Patent: June 28, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Sam Park, Seung Ick Lee, Hun Joo Hahm, Hyung Suk Kim, Bum Jin Kim, Young June Jeong, Ho Sik Ahn, Jung Kyu Park
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Publication number: 20110122600Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.Type: ApplicationFiled: February 2, 2011Publication date: May 26, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Chul Hee YOO, Ho Sik Ahn
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Patent number: 7887225Abstract: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.Type: GrantFiled: July 5, 2007Date of Patent: February 15, 2011Assignee: Samsung LED Co., Ltd.Inventors: Won Joon Lee, In Tae Yeo, Hun Joo Hahm, Young Sam Park, Kyung Taeg Han, Ho Sik Ahn, Chang Ho Song
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Publication number: 20110031526Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
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Publication number: 20090321773Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.Type: ApplicationFiled: August 27, 2009Publication date: December 31, 2009Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Sam PARK, Seung Ick Lee, Hun Joo Hahm, Hyung Suk Kim, Bum Jin Kim, Young June Jeong, Ho Sik Ahn, Jung Kyu Park
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Patent number: 7592631Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.Type: GrantFiled: December 28, 2005Date of Patent: September 22, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Sam Park, Seung Ick Lee, Hun Joo Hahm, Hyung Suk Kim, Bum Jin Kim, Young June Jeong, Ho Sik Ahn, Jung Kyu Park
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Publication number: 20090197360Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.Type: ApplicationFiled: February 13, 2009Publication date: August 6, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Taeg HAN, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na, Dae Yeon Kim, Ho Sik Ahn, Young Sam Park
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Patent number: 7513632Abstract: A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.Type: GrantFiled: September 24, 2007Date of Patent: April 7, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyung Suk Kim, Jung Kyu Park, Ho Sik Ahn, Young June Jeong, Young Sam Park, Hun Joo Hahm, Bum Jin Kim
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Patent number: 7473937Abstract: A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.Type: GrantFiled: December 28, 2005Date of Patent: January 6, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Sam Park, Hyung Suk Kim, Jung Kyu Park, Ho Sik Ahn, Young June Jeong, Hun Joo Hahm, Bum Jin Kim
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Patent number: 7414270Abstract: The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.Type: GrantFiled: March 8, 2006Date of Patent: August 19, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Bum Jin Kim, Hyung Suk Kim, Ho Sik Ahn, Young June Jeong, Sung Min Yang
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Publication number: 20080128736Abstract: The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.Type: ApplicationFiled: January 9, 2008Publication date: June 5, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Taeg Han, Hun Joo Hahm, Dae Yeon Kim, Ho Sik Ahn, Seong Yeon Han, Young Sam Park, Seon Goo Lee
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Patent number: 7338823Abstract: The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.Type: GrantFiled: June 1, 2006Date of Patent: March 4, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung Taeg Han, Hun Joo Hahm, Dae Yeon Kim, Ho Sik Ahn, Seong Yeon Han, Young Sam Park, Seon Goo Lee
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Publication number: 20080013315Abstract: A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.Type: ApplicationFiled: September 24, 2007Publication date: January 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Suk KIM, Jung Kyu Park, Ho-Sik Ahn, Young June Jeong, Young Sam Park, Hun Joo Hahm, Bum Jin Kim
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Publication number: 20080007939Abstract: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.Type: ApplicationFiled: July 5, 2007Publication date: January 10, 2008Inventors: Won Joon Lee, In Tae Yeo, Hun Joo Hahm, Young Sam Park, Kyung Taeg Han, Ho Sik Ahn, Chang Ho Song