Patents by Inventor Holger Doepke

Holger Doepke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10600690
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: March 24, 2020
    Assignee: Infineon Technologies AG
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Patent number: 10332814
    Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 25, 2019
    Assignee: Infineon Technologies AG
    Inventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski
  • Publication number: 20180350683
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 6, 2018
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Publication number: 20180350780
    Abstract: An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric layer.
    Type: Application
    Filed: July 27, 2018
    Publication date: December 6, 2018
    Inventors: Edward Fuergut, Holger Doepke, Olaf Hohlfeld, Michael Juerss
  • Patent number: 10056295
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: August 21, 2018
    Assignee: Infineon Technologies AG
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Patent number: 10043782
    Abstract: A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: August 7, 2018
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Holger Doepke, Olaf Hohlfeld, Michael Juerss
  • Publication number: 20170287880
    Abstract: A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 5, 2017
    Inventors: Edward Fuergut, Holger Doepke, Olaf Hohlfeld, Michael Juerss
  • Publication number: 20160247739
    Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.
    Type: Application
    Filed: February 18, 2016
    Publication date: August 25, 2016
    Applicant: Infineon Technologies AG
    Inventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski
  • Publication number: 20160218039
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 28, 2016
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt