Patents by Inventor Holger Woerner

Holger Woerner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8659135
    Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: February 25, 2014
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Hermann Vllsmeler, Holger Woerner, Bernhard Zuhr
  • Patent number: 7893532
    Abstract: An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: February 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Bernd Rakow, Peter Strobel, Holger Woerner
  • Patent number: 7883993
    Abstract: The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: February 8, 2011
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Hermann Vilsmeier, Holger Woerner
  • Patent number: 7772105
    Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: August 10, 2010
    Assignee: Infineon Technologies AG
    Inventors: Ulrich Bachmaier, Michael Bauer, Robert Christian Hagen, Jens Pohl, Rainer Steiner, Peter Strobel, Hermann Vilsmeier, Holger Woerner, Bernhard Zuhr
  • Patent number: 7700956
    Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: April 20, 2010
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Patent number: 7692283
    Abstract: A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: April 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Holger Woerner, Simon Jerebic
  • Patent number: 7638418
    Abstract: A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: December 29, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Rainer Steiner, Holger Woerner
  • Patent number: 7622733
    Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: November 24, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski
  • Patent number: 7575173
    Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: August 18, 2009
    Assignee: Infineon Technologies, AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Patent number: 7566968
    Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: July 28, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Michael Bauer, Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner
  • Patent number: 7545047
    Abstract: A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: June 9, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Edward Fuergut, Simon Jerebic, Holger Woerner
  • Patent number: 7528054
    Abstract: A semiconductor component includes a thin semiconductor chip and a wiring substrate that carries the semiconductor chip on its upper side and includes external contacts on its underside and/or its edge sides. The semiconductor chip is preferably produced from monocrystalline silicon having a thickness d?25 ?m.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: May 5, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Holger Woerner
  • Patent number: 7524699
    Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: April 28, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Publication number: 20090102044
    Abstract: A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.
    Type: Application
    Filed: November 12, 2007
    Publication date: April 23, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Holger Woerner, Simon Jerebic
  • Patent number: 7516543
    Abstract: A semiconductor component includes a media channel and at least the following components: a semiconductor chip on a wiring substrate, electric connecting elements disposed between the semiconductor chip and the wiring substrate, and a plastic housing mass that embeds these components. The media channel is impressed into the plastic housing mass and extends along the interfaces between the plastic housing mass and the components. The media channel is produced by applying a sacrificial polymer including a media channel structure to the components before embedding the components in the plastic housing mass. The sacrificial polymer is then destroyed after the components are embedded, thereby forming the media channel.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: April 14, 2009
    Assignee: Infineon Technologies AG
    Inventor: Holger Woerner
  • Patent number: 7517722
    Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: April 14, 2009
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner
  • Patent number: 7514273
    Abstract: The invention relates to a method for applying rewiring to a panel. For this purpose, a panel is provided which has a coplanar overall upper side of an upper side of a plastic compound and the upper sides of semiconductor chips. The method provides a rewiring layer with implementation of external contacts and rewiring lines which, by means of a two-stage exposure step, compensates for position errors of the semiconductor chips in the component positions of the panel.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: April 7, 2009
    Assignee: Qimonda AG
    Inventors: Harry Hedler, Jens Pohl, Holger Woerner
  • Patent number: 7482198
    Abstract: A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: January 27, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Edward Fuergut, Simon Jerebic, Holger Woerner
  • Patent number: 7456495
    Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: November 25, 2008
    Assignee: Infineon Technologies AG
    Inventors: Jens Pohl, Bernd Roemer, Bernhard Schaetzler, Christian Stuempfl, Herman Vilsmeier, Holger Woerner, Bernhard Zuhr
  • Patent number: 7408241
    Abstract: A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their respective center region, the outer contact connection surfaces have at least one recess which has a dovetail-like profile, the areal extent of the recess being smaller than the maximum cross section of an outer contact. In a one process, the recess in the center region is achieved by selective deposition of correspondingly patterned metal layers.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: August 5, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Irmgard Escher-Poeppel, Edward Fuergut, Simon Jerebic, Holger Woerner