Patents by Inventor Holly A. Sawyer

Holly A. Sawyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200098727
    Abstract: A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor package substrate. The wire-bond memory die is stacked on the processor and the redistribution layer overhangs the processor to contact the series of pillars.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Debendra Mallik, Robert L. Sankman, Sanka Ganesan, George Vakanas, Omkar Karhade, Sri Chaitra Jyotsna Chavali, Zhaozhi George Li, Holly A. Sawyer