Patents by Inventor Hon Siu Wee

Hon Siu Wee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Strategic placement of plastic structures for EMI management of transceiver module
    Patent number: 10802232
    Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: October 13, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
  • STRATEGIC PLACEMENT OF PLASTIC STRUCTURES FOR EMI MANAGEMENT OF TRANSCEIVER MODULE
    Publication number: 20190346642
    Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
    Type: Application
    Filed: July 23, 2019
    Publication date: November 14, 2019
    Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
  • Strategic placement of plastic structures for EMI management of transceiver module
    Patent number: 10359586
    Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: July 23, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
  • STRATEGIC PLACEMENT OF PLASTIC STRUCTURES FOR EMI MANAGEMENT OF TRANSCEIVER MODULE
    Publication number: 20170097484
    Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
    Type: Application
    Filed: October 2, 2015
    Publication date: April 6, 2017
    Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang