Abstract: According to an embodiment, a color filter array includes a plurality of color filters of multiple colors. The color filters are arranged so that each of the color filter of each color corresponds to any one of a plurality of microlenses included in a microlens array. Each microlens is configured to irradiate a plurality of pixels with light.

Abstract: According to an embodiment, a microlens array for a solid-state image sensing device includes a plurality of microlenses and a state detector. The plurality of microlenses are disposed in an imaging microlens area and is configured to form two-dimensional images. The state detector is disposed on a periphery of the imaging microlens area and is configured to, on an image forming surface of the microlenses, generate images having a smaller diameter than images formed by the microlenses.

Abstract: A compound of the embodiment includes the structure represented by the following general formula (1). In the general formula (1), R1 to R4 respectively independently represent a hydrogen atom, a linear or branched alkyl group, a fluoroalkyl group, or an aryl group.

Abstract: According to one embodiment, a solid state imaging device includes a first imaging device, a second imaging device, and a calculating unit. The first imaging device includes a first optical system, a first imaging unit, and a second optical system provided between the first optical system and the first imaging unit. The second imaging device includes a third optical system, a second imaging unit, and a fourth optical system provided between the third optical system and the second imaging unit. The calculating unit is configured to perform a first calculation and a second calculation. The first calculation includes deriving a first distance from stereo disparity. The second calculation includes deriving a second distance from a parallax image. The calculating unit is configured to estimate a target distance based on at least one selected from the first distance and the second distance.

Abstract: A solid state imaging device according to an embodiment includes: a liquid crystal optical element including a first electrode having a first recess and a projecting portion surrounding the first recess on a first surface, a second electrode facing the first surface of the first electrode, a filling film located between the first recess of the first electrode and the second electrode, and a liquid crystal layer located between the filling film and the second electrode; an imaging lens facing the second electrode to form an image of a subject on an imaging plane; and an imaging element facing the first recess, the imaging element having a pixel block having a plurality of pixels.

Abstract: An optical device includes a light-shielding layer and a microlens array. The light-shielding layer includes a plurality of openings. The microlens array is divided into a plurality of microlenses corresponding to the respective plurality of openings. A refractive index of the microlens array is variable so that light is incident on the microlenses is focused on the respective plurality of openings. A portion where light is focused includes a central position of the corresponding opening.

Abstract: According to an embodiment, an imaging system includes an image sensor, an imaging lens, a microlens array, an irradiator, a distance information acquiring unit, and a controller. The microlens array includes multiple microlenses arranged with a predetermined pitch, the microlenses being respectively associated with pixel blocks. The irradiator emits light to project a pattern onto an object. The distance information acquiring unit acquires information on the distance in the depth direction to the object on the basis of a signal resulting from photoelectric conversion performed by the image sensor. The controller controls the irradiator so that images contained in a pattern that is reflected by the object and scaled down on the image sensor by the imaging lens and the microlenses are smaller than the arrangement pitch of images each formed on the image sensor by each microlens and larger than twice the pixel.

Abstract: A radiation detection apparatus according to an embodiment includes: a scintillator; a photon detection device array including a plurality of cells each being a photon detection device with an avalanche photodiode configured to detect visible radiation photons emitted from the scintillator and a resistor disposed along a part of a periphery of an active region of the avalanche photodiode; and a reflector configured to reflect a visible radiation photon and disposed in a region that does not include the active regions and the resistors of the cells, on a face including the active regions.

Abstract: A display device includes: a mirror part which includes a reflective film formed at one surface of a transparent flat plate, and a plurality of micro-windows formed at the reflective film; a flat display part which emits non-parallel light whose light emission angle distribution is skewed in a normal direction toward the mirror part; and a microlens array part which is disposed between the mirror part and the flat display part, and includes a plurality of microlenses converging the non-parallel light emitted from the flat display part to the plurality of micro-windows individually.

Abstract: A solid state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and including pixel blocks each having pixels; a main lens forming an image of a subject on an imaging plane; a microlens array including microlenses corresponding to the pixel blocks, the microlens array reducing an image to be formed on the imaging plane by Nf times or less and forming reduced images on the pixel blocks corresponding to the respective microlenses; and an image processing unit enlarging and synthesizing the reduced images formed by the microlenses, the solid state imaging device meeting conditions of an expression MTFMain(u)?MTFML(u)?MTFMain(u×Nf) where u denotes an image spatial frequency, MTFML(u) denotes an MTF function of the microlenses, and MTFMain(u) denotes an MTF function of the main lens.

Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, and first, second, and third lenses. The first lens is provided between the aperture stop and the microlens array, and has a positive refractive power. The second lens is provided between the first lens and the microlens array, and has a negative refractive power. The third lens is provided between the second lens and the microlens array, and has a positive refractive power.

Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, a first lens, a second lens, a third lens, and a fourth lens. The first lens is provided between the aperture stop and the microlens array. The second lens is provided between the first lens and the microlens array. The third lens is provided between the second lens and the microlens array. The fourth lens is provided between the third lens and the microlens array.

Abstract: An imaging device according to an embodiment includes: a semiconductor substrate; a reference pixel with a first concave portion disposed in a first portion of a surface of the semiconductor substrate; and one or more infrared detection pixels each configured to detect light with a second concave portion disposed in a second portion of the surface of the semiconductor substrate, the reference pixel being directly connected to the semiconductor substrate at a position where the first concave portion is not present, and including a first thermoelectric conversion unit configured to convert heat to an electric signal, the first thermoelectric conversion unit being disposed in the first concave portion and including a first thermoelectric conversion element, each infrared detection pixel including a second thermoelectric conversion unit being disposed in the second concave portion and including a second thermoelectric conversion element.

Abstract: A solid-state imaging device according to an embodiment includes: an imaging element including an imaging area formed with a plurality of pixel blocks each including pixels; a first optical system forming an image of an object on an imaging surface; and a second optical system re-forming the image, which has been formed on the imaging surface, on the pixel blocks corresponding to microlenses, the second optical system including a microlens array formed with the microlenses provided in accordance with the pixel blocks. The microlenses are arranged in such a manner that an angle ? between a straight line connecting center points of adjacent microlenses and one of a row direction and a column direction in which the pixels are aligned is expressed as follows: ?>sin?1(2dp/Dml), where Dml represents microlens pitch, and dp represents pixel pitch.

Abstract: According to an embodiment, an image processing method is implemented in an imaging device that includes a microlens array including microlenses, a main lens configured to guide light from a photographic subject to the microlens array, and an image sensor configured to receive the light after passing through the main lens and the microlens array. The method includes: obtaining an image captured by the image sensor; setting, according to an image height, an arrangement of a microlens image of interest and comparison-target microlens images from among microlens images that are included in the image and that are formed by the microlenses; detecting an amount of image shift between the microlens image of interest and each of the comparison-target microlens images by comparing the microlens image of interest with the comparison-target microlens images; and calculating a distance corresponding to the microlens image of interest using the amounts of image shift.

Abstract: In a liquid crystal optical element, a first substrate includes a first main surface. A second substrate includes a second main surface opposed to the first main surface. First electrodes are provided on the first main surface. Common electrodes are provided on the second main surface. A liquid crystal layer is formed between the first main surface and the second main surface. A first alignment layer is formed between the first substrate and the liquid crystal layer. A second alignment layer is formed between the second substrate and the liquid crystal layer. The first alignment layer has an anchoring force that is weaker than an anchoring force of the second alignment layer.

Abstract: A liquid crystal optical element includes a first electrode, a second electrode, a first alignment film, a second alignment film, spacers and a liquid crystal layer. The first electrode includes a plurality of lens parts. The second electrode opposes the first electrode. The first alignment film is formed between the first electrode and the second electrode. The second alignment film is formed between the first alignment film and the second electrode. The spacers are provided between the first electrode and the second electrode. The spacers are regularly arranged, each at edges of the lens parts. The liquid crystal layer is provided between the first alignment film and the second alignment film.

Abstract: According to an embodiment, an imaging system includes an image sensor, an imaging lens, a microlens array, an irradiator, a distance information acquiring unit, and a controller. The microlens array includes multiple microlenses arranged with a predetermined pitch, the microlenses being respectively associated with pixel blocks. The irradiator emits light to project a pattern onto an object. The distance information acquiring unit acquires information on the distance in the depth direction to the object on the basis of a signal resulting from photoelectric conversion performed by the image sensor. The controller controls the irradiator so that images contained in a pattern that is reflected by the object and scaled down on the image sensor by the imaging lens and the microlenses are smaller than the arrangement pitch of images each formed on the image sensor by each microlens and larger than twice the pixel.

Abstract: According to an embodiment, a filter-array-equipped microlens includes a filter array and a microlens array. The filter array includes a plurality of first optical filters for selectively transmitting light of an infrared region and a plurality of second optical filters for selectively transmitting light of a first visible wavelength region. The microlens array includes a plurality of microlenses each corresponding to any one of the first optical filters and the second optical filters.

Abstract: According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.