Patents by Inventor Hong-Cheng Yang

Hong-Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100236764
    Abstract: A heat dissipation device includes a heat sink, a fan placed on the heat sink and two wire clips securing the fan on the heat sink. The heat sink has two grooves defined in two flanks thereof. The fan has a frame with a plurality of holes defined therein. Each clip includes an engaging arm received in a corresponding groove of the heat sink, two tensile parts extending upwardly from two opposite ends of the engaging arm, two hooks formed at free ends of the tensile parts and inserted into the holes of the fan, and a handle protruding from a middle of the engaging arm.
    Type: Application
    Filed: July 14, 2009
    Publication date: September 23, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG KONG, HONG-CHENG YANG
  • Publication number: 20100220447
    Abstract: A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.
    Type: Application
    Filed: May 5, 2009
    Publication date: September 2, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Wei-Cheng Nie, Hong-Cheng Yang
  • Publication number: 20100172094
    Abstract: A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.
    Type: Application
    Filed: April 3, 2009
    Publication date: July 8, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng Kong, Hong-Cheng Yang
  • Publication number: 20100147491
    Abstract: A heat dissipation device includes a heat sink, a fan and a fan holder attaching the fan to the heat sink. The heat sink includes a base and a plurality of fins. The fan includes a frame and four engaging flanges at a periphery thereof. The fan holder includes a supporting board supporting the fan thereon, a plurality of spaced retaining plates extending downwardly from a periphery edge of the supporting board and clasping the fins, two locking sheets extending upwardly from two diagonal corners of the supporting board and two locking poles extending upwardly from another two diagonal corners of the supporting board. The locking sheets abut against lateral sides of two engaging flanges of the fan. The locking poles are engagingly received in another two engaging flanges of the fan.
    Type: Application
    Filed: April 14, 2009
    Publication date: June 17, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, HONG-CHENG YANG, HE-PING LIU
  • Publication number: 20100101758
    Abstract: A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink and an engaging member mounted on the heat sink. The engaging member includes an engaging portion and an elastic member. The engaging portion includes an extending portion and a pressing portion extending from an end of extending portion. The extending portion is slidably mounted on a fin of the heat sink. The elastic member is positioned around the extending portion and sandwiched between the fin and the pressing portion. The elastic member is compressed and offers a resilient force pushing the pressing portion to move towards the fan and press a side of the fan.
    Type: Application
    Filed: May 27, 2009
    Publication date: April 29, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG KONG, HONG-CHENG YANG
  • Patent number: 7697297
    Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: April 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxcomm Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Min Li, Hong-Cheng Yang
  • Publication number: 20100053904
    Abstract: A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
    Type: Application
    Filed: September 1, 2008
    Publication date: March 4, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (Shen Zhen) Co., Ltd., FOXCONN TECHNOLOGY Co., Ltd.
    Inventors: CHUN-CHI CHEN, HONG-CHENG YANG, JIN-BIAO LIU, HE-PING LIU
  • Publication number: 20090279251
    Abstract: A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIN-BIAO LIU, HONG-CHENG YANG, CHUN-CHI CHEN
  • Patent number: 7613001
    Abstract: A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jin-Biao Liu, Hong-Cheng Yang, Chun-Chi Chen
  • Publication number: 20090166010
    Abstract: A heat dissipation device includes a heat sink, a fan holder and a fan secured on a front side of the fan holder. The heat sink includes a base having two first fixing ears at its two lateral sides and a plurality of fins on the base. At least an engaging notch is defined in top ends of the fins. The fan holder includes a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has at least an inserting protrusion at a bottom surface thereof. The two sidewalls have two fixing flanges at lower ends thereof. The top panel is partially placed on front portion of the top ends of the fins and the inserting protrusion is inserted into the engaging notch of the fins, the two sidewalls abut against two lateral sides of the heat sink and the two fixing flanges are disposed on the two first fixing ears.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, HONG-CHENG YANG, HE-PING LIU
  • Publication number: 20090159245
    Abstract: A heat dissipation device includes a heat sink, a fan holder and a fan secured on a front side of the fan holder. The heat sink comprises a base and a plurality of fins on the base. An engaging groove is defined in top ends of the fins. The fan holder comprises a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on front portion of the top ends of the fins and the inserting protrusion is inserted into the engaging groove of the fins, the two sidewalls abut against two lateral sides of the heat sink and the two latching legs fasten to two lateral sides of the base of the heat sink.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, HONG-CHENG YANG, HE-PING LIU
  • Publication number: 20090151896
    Abstract: A heat dissipation device includes a heat sink and a wire clip. The heat sink has a base plate and a plurality of parallel fins arranged on the base plate. The heat sink defining a plurality lengthways channels between every two neighboring fins and a plurality of transverse channels perpendicular to the lengthways channels. The clip comprises a main body spanning on the base plate of the heat sink and two latching legs extending contrary from two opposite ends of the main body. The main body comprises a pressing section received in the lengthways channels and two pivoting sections extending from two opposite ends of the pressing section and received in the transverse channels. The two latching legs are located at the two opposite sides of the heat sink.
    Type: Application
    Filed: December 12, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, MIN LI, HONG-CHENG YANG
  • Publication number: 20090141453
    Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 4, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, MIN LI, HONG-CHENG YANG
  • Patent number: 7515419
    Abstract: A locking device used for locking a heat sink to an electronic device, includes two clips each having a clamping portion. The clamping portion of each has a first pressing portion, a second pressing portion spaced from and in alignment with the first pressing portion, and a catch depending between the first and second pressing portions. An operating portion extends from the second pressing portion of the clamping portion. The retention module includes a bottom with an opening defined therein, and two pairs of first and second clasps extending from the bottom for locking the two clips. When the retention module and the clips are in a locked position, the catches of the clips engage with the first clasps of the retention module, the operating portions engage with the second clasps of the retention module.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: April 7, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang
  • Patent number: 7382622
    Abstract: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes a main body (23) and a pair of legs (25). The main body includes a retaining portion (230) and a first pressing portion (232). The main body is received in the receiving groove and the first pressing portion is accommodated in the positioning slot. The retaining portion is offset from the first pressing portion. The legs can be pressed to securely connect with a printed circuit board (3), whereby the heat sink can have an intimate contact with a CPU (4).
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 3, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang
  • Publication number: 20080101030
    Abstract: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes a main body (23) and a pair of legs (25). The main body includes a retaining portion (230) and a first pressing portion (232). The main body is received in the receiving groove and the first pressing portion is accommodated in the positioning slot. The retaining portion is offset from the first pressing portion. The legs can be pressed to securely connect with a printed circuit board (3), whereby the heat sink can have an intimate contact with a CPU (4).
    Type: Application
    Filed: October 26, 2006
    Publication date: May 1, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang
  • Patent number: 7301769
    Abstract: A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending perpendicularly from the pivot shaft. The pivot shaft includes a pivot section (1422) and a pressing section (1426) offsetting from the pivot section and spaced from the base, wherein the handle is capable of rotating about an axis of the pivot shaft to lock with the base and to cause the pressing section to exert a force against the fan toward the base to securely attach the fan to the base.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: November 27, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang, Hong-Bo Shi
  • Publication number: 20070103870
    Abstract: A locking device used for locking a heat sink to an electronic device, includes two clips each having a clamping portion. The clamping portion of each has a first pressing portion, a second pressing portion spaced from and in alignment with the first pressing portion, and a catch depending between the first and second pressing portions. An operating portion extends from the second pressing portion of the clamping portion. The retention module includes a bottom with an opening defined therein, and two pairs of first and second clasps extending from the bottom for locking the two clips. When the retention module and the clips are in a locked position, the catches of the clips engage with the first clasps of the retention module, the operating portions engage with the second clasps of the retention module.
    Type: Application
    Filed: March 13, 2006
    Publication date: May 10, 2007
    Applicant: Foxconn Technology Co.,Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang
  • Patent number: 7100676
    Abstract: A fan duct includes an immovable cylinder and a movable cylinder. The movable cylinder is capable of sliding in an axial direction of the immovable cylinder. One of the immovable cylinder and the movable cylinder defines at least one groove in an axial direction thereof. Each groove defines at least two locating slots communicating with the respective groove. The other of the immovable cylinder and the movable cylinder forms at least one pin corresponding to the groove, the pin being capable of selectively sliding into any one of the locating slots. A related heat dissipation assembly including the fan duct is also disclosed.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: September 5, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang, Hong-Bo Shi
  • Publication number: 20060056152
    Abstract: A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending perpendicularly from the pivot shaft. The pivot shaft includes a pivot section (1422) and a pressing section (1426) offsetting from the pivot section and spaced from the base, wherein the handle is capable of rotating about an axis of the pivot shaft to lock with the base and to cause the pressing section to exert a force against the fan toward the base to securely attach the fan to the base.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 16, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang, Hong-Bo Shi