Patents by Inventor Hong-Da Chang

Hong-Da Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150325556
    Abstract: A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement.
    Type: Application
    Filed: September 16, 2014
    Publication date: November 12, 2015
    Inventors: Chieh-Lung Lai, Hsien-Wen Chen, Hong-Da Chang, Mao-Hua Yeh
  • Patent number: 9133021
    Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: September 15, 2015
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Hong-Da Chang, Hsin-Yi Liao, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen
  • Publication number: 20150162264
    Abstract: A package structure is provided, which includes: a wafer having a surface with a groove, a thin film closing an open end of the groove and electrical contacts; a chip having a surface with a conductive layer and an opposite surface with a concave portion and a seal ring located at a periphery of the concave portion, the chip being disposed on the wafer with the seal ring surrounding the thin film and the electrical contacts located outside the seal ring; an encapsulant formed on the wafer for encapsulating the chip and the electrical contacts; a plurality of sub-conductive wires embedded in the encapsulant with one ends exposed from a top surface of the encapsulant and the other ends in electrical connection with the electrical contacts; and a through hole penetrating the wafer and communicating with the concave portion, thereby reducing the fabrication cost and size of the package structure.
    Type: Application
    Filed: May 9, 2014
    Publication date: June 11, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Shih-Kuang Chiu
  • Publication number: 20150041969
    Abstract: A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a semiconductor structure having a carrier, a circuit portion formed on the carrier and a plurality of semiconductor elements disposed on the circuit portion; disposing a lamination member on the semiconductor elements; forming an insulating layer on the circuit portion for encapsulating the semiconductor elements; and removing the carrier. The lamination member increases the strength between adjacent semiconductor elements so as to overcome the conventional cracking problem caused by a CTE mismatch between the semiconductor elements and the insulating layer when the carrier is removed.
    Type: Application
    Filed: November 7, 2013
    Publication date: February 12, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Yi-Che Lai, Chi-Hsin Chiu, Shih-Kuang Chiu
  • Patent number: 8878356
    Abstract: A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: November 4, 2014
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Hong-Da Chang, Cheng-Hsiang Liu, Kuang-Wei Huang, Chun-Hung Lin, Hsin-Yi Liao
  • Patent number: 8633048
    Abstract: A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: January 21, 2014
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Han Lin, Hong-Da Chang, Cheng-Hsiang Liu, Hsin-Yi Liao, Shih-Kuang Chiu
  • Publication number: 20130341739
    Abstract: A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.
    Type: Application
    Filed: October 25, 2012
    Publication date: December 26, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Cheng-Hsiang Liu, Kuang-Wei Huang, Chun-Hung Lin, Hsin-Yi Liao
  • Publication number: 20130320463
    Abstract: A package structure includes: a substrate having a plurality of first conductive pads and a plurality of second conductive pads; an MEMS element disposed on the substrate; a cover member disposed on the MEMS element and having a metal layer formed thereon; a plurality of bonding wires electrically connected to the MEMS element and the second conductive pads of the substrate; a plurality of first wire segments, each having one end electrically connected to a corresponding one of the first conductive pads; and an encapsulant formed on the substrate and encapsulating the MEMS element, the cover member, the first wire segments and the bonding wires, wherein the other end of each of the first wire segments is exposed from the encapsulant. Compared with the prior art, the package structure of the present invention has improved overall yield and functionality.
    Type: Application
    Filed: August 17, 2012
    Publication date: December 5, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Cheng-Hsiang Liu, Kuang-Wei Huang, Chun-Hung Lin, Hsin-Yi Liao
  • Patent number: 8525324
    Abstract: A semiconductor package is provided, which includes: a micro electro mechanical system (MEMS) chip; a cap provided on the MEMS chip; an electronic element provided on the cap including a plurality of first conductive pads and second conductive pads; a plurality of first conductive elements electrically connected to the first conductive pads and the MEMS chip; a plurality of second conductive elements formed on the second conductive pads, respectively; and an encapsulant formed on the MEMS chip covering the cap, the electronic element, the first conductive elements and the second conductive elements, with the second conductive elements being exposed from the encapsulant. Thus, the size of the semiconductor package is reduced. A method of fabricating the semiconductor package is also disclosed.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: September 3, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Hong-Da Chang, Hsin-Yi Liao
  • Publication number: 20130075888
    Abstract: A semiconductor package is provided, which includes: a micro electro mechanical system (MEMS) chip; a cap provided on the MEMS chip; an electronic element provided on the cap including a plurality of first conductive pads and second conductive pads; a plurality of first conductive elements electrically connected to the first conductive pads and the MEMS chip; a plurality of second conductive elements formed on the second conductive pads, respectively; and an encapsulant formed on the MEMS chip covering the cap, the electronic element, the first conductive elements and the second conductive elements, with the second conductive elements being exposed from the encapsulant. Thus, the size of the semiconductor package is reduced. A method of fabricating the semiconductor package is also disclosed.
    Type: Application
    Filed: July 5, 2012
    Publication date: March 28, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Hsin-Yi Liao
  • Patent number: 8399940
    Abstract: A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: March 19, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Han Lin, Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu
  • Publication number: 20130017643
    Abstract: A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.
    Type: Application
    Filed: December 8, 2011
    Publication date: January 17, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chen-Han LIN, Hong-Da CHANG, Cheng-Hsiang LIU, Hsin-Yi LIAO, Shih-Kuang CHIU
  • Publication number: 20120292722
    Abstract: A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
    Type: Application
    Filed: September 23, 2011
    Publication date: November 22, 2012
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chen-Han Lin, Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu
  • Patent number: 8172632
    Abstract: A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: May 8, 2012
    Assignee: Touch Micro-System Technology Corp.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20120001274
    Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.
    Type: Application
    Filed: April 20, 2011
    Publication date: January 5, 2012
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hong-Da Chang, Hsin-Yi Liao, Chun-An Huang, Shih-Kuang Chiu, Chien-An Chen
  • Patent number: 7821094
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: October 26, 2010
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Patent number: 7741772
    Abstract: A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: June 22, 2010
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20100047942
    Abstract: A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures.
    Type: Application
    Filed: November 5, 2009
    Publication date: February 25, 2010
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Patent number: 7510892
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: March 31, 2009
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20090032832
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Application
    Filed: October 8, 2008
    Publication date: February 5, 2009
    Inventors: Hung-Yi Lin, Hong-Da Chang