Patents by Inventor Hong Hee Lee

Hong Hee Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Patent number: 11926591
    Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound of the present disclosure, an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifespan characteristics can be provided.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: March 12, 2024
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Hong-Se Oh, Jeong-Eun Yang, Tae-Jin Lee, Sang-Hee Cho
  • Publication number: 20240069875
    Abstract: Disclosed herein are a neural network model deployment method and apparatus for providing a deep learning service. The neural network model deployment method may include providing a specification wizard to a user, searching for and training a neural network based on a user requirement specification that is input through the specification wizard, generating a neural network template code based on the user requirement specification and the trained neural network, converting the trained neural network into a deployment neural network that is usable in a target device based on the user requirement specification, and deploying the deployment neural network to the target device.
    Type: Application
    Filed: June 14, 2023
    Publication date: February 29, 2024
    Inventors: Jae-Bok PARK, Chang-Sik CHO, Kyung-Hee LEE, Ji-Young KWAK, Seon-Tae KIM, Hong-Soog KIM, Jin-Wuk SEOK, Hyun-Woo CHO
  • Patent number: 6730277
    Abstract: There is provided a small and light ozone generating apparatus capable of producing ozone with much less consumption of electric power. The present invention comprises a pulse generator for generating high-voltage pulses and a discharge chamber for inducing electrical discharge in response to the high-voltage pulses. The pulse generator includes an LC circuit for compressing square wave signals and generating impulses. The use of impulse greatly reduces electric power consumption and volume of ozone generating apparatus. Electrical discharge takes place between an electrode plate and grounded chamber wall. A sheet of oxide dielectric covers the chamber wall to prevent corrosion of chamber wall.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: May 4, 2004
    Assignee: Smart Air, Inc.
    Inventors: Jae Shin Lee, Jae Seok Park, Lukanin Alexandrovich Alexander, Khasanov Leonidovich Oleg, Kwang Ho Kim, Hong Hee Lee, Young Deok Lee
  • Patent number: 6228294
    Abstract: A compression molding method reduces or removes adhesion property between a mold substrate and a high polymer material, which is to be imprinted with a pattern from the mold substrate. Accordingly, a pattern having increased granularity to tens of A can be obtained for application to fabrication processes of semiconductor devices and electronic products. The compression molding method can use a patterned mold and preferably a high polymer material to be imprinted with the pattern. The method can further include heating one of the mold and the high polymer material, compression-molding the mold and the high polymer material, cooling the heated one for a prescribed time and separating the high polymer material and the mold from each other.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: May 8, 2001
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Hong Hee Lee, Dal Young Kang
  • Patent number: 5899734
    Abstract: A method of fabricating a semiconductor device having a substrate includes the steps of simultaneously forming an A copolymer having a columnar shape, a B copolymer surrounding the A copolymer, and a C copolymer surrounding the B copolymer on the substrate, removing the A copolymer to form a first hole on the substrate, forming the semiconductor device in the first hole; removing the B copolymer to form a second hole, forming an electrode on the semiconductor device for controlling an electric potential, and removing the C copolymer from the substrate.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: May 4, 1999
    Assignee: LG Semicon Co., Ltd.
    Inventor: Hong Hee Lee