Abstract: Disclosed is a method for manufacturing a 3D printing structure, the method including: producing a molded body by performing 3D printing on paste including printing powder in a coagulation bath including a hydrogel; hardening the molded body produced in the coagulation bath; and removing the hydrogel in the coagulation bath. A method for manufacturing a 3D printing structure, which is provided according to an aspect of the disclosure, does not require printing of a separate support, and thus it is possible to save time and costs. A post-processing process for removing a support is not required. Thus, a process is further simplified, and there is no risk of damage to a structure.

Abstract: A glass panel processing method includes a first deformed portion formation step in which, in order to form a via-hole in a glass substrate, a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam along a planned via-hole line, a second deformed portion formation step in which, in order to cut the glass substrate into unit cells, a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam along a planned cutting line, and an etching step in which, the glass substrate with the first deformed portion and the second deformed portion formed therein is etched such that etching of the glass substrate along the planned cutting line is completed before completion of etching of the glass substrate along the planned via-hole line.

Abstract: A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

Abstract: A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.

Abstract: Disclosed herein is a foldable display apparatus which can reduce occurrence of marks on a folding section thereof, wherein the display apparatus includes a display panel, a mid-frame, and an adhesive layer, the mid-frame is disposed on one surface of the display panel, the adhesive layer is interposed between the display panel and the mid-frame to bond the display panel to the mid-frame and the mid-frame is formed of glass.

Abstract: A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.

Abstract: A through-glass via hole formation method, includes: an internal deformation region formation step in which an internal deformation region is formed inside a glass substrate at a predetermined distance from a surface of the glass substrate; a surface etching step in which the glass substrate is thinned by immersing the glass substrate in an etching solution such that a portion of the surface of the glass substrate, at which the internal deformation region is not formed, is etched and removed at a first etching rate; and a through-glass via hole formation step in which, with the glass substrate immersed in the etching solution, the internal deformation region is etched and removed at a second etching rate higher than the first etching rate such that a through-glass via hole is formed in the glass substrate along the internal deformation region.

Abstract: A crack-free glass substrate cutting and thinning method, includes: an internal deformation line formation step in which an internal deformation line is formed inside a glass substrate at a predetermined distance from a surface of the glass substrate; a surface etching step in which the glass substrate is thinned by immersing the glass substrate in an etching solution such that a portion of the surface of the glass substrate, at which the internal deformation line is not formed, is etched and removed at a first etching rate; and an etch-cutting step in which, with the glass substrate immersed in the etching solution, the internal deformation line is etched and removed at a second etching rate higher than the first etching rate such that the glass substrate is cut along the internal deformation line.