Abstract: The present disclosure discloses a flexible antenna structure and an electronic device having the same. The flexible antenna structure includes a flexible printed circuit board, a mm-Wave antenna disposed on the flexible printed circuit board and conformal with the flexible printed circuit board, and a non-mm-Wave antenna disposed on the flexible printed circuit board and conformal with the flexible printed circuit board. Compared with the existing art, by means of the flexible antenna structure provided with the mm-Wave antenna and the non-mm-Wave antenna on the flexible printed circuit board, the present disclosure realizes integration of the mm-Wave antenna and the non-mm-Wave antenna, solves a challenge of numerous antennas in the electronic device, and realizes conformation with a bent part of a shell 1, thereby increasing the space utilization rate in a limited space. Furthermore, the overall size and cost cannot be increased, thus improving the competitiveness of a product.

Abstract: A crossbeam for measuring deformation velocities of a surface of a material under a dynamic load includes a crossbeam body, a first type of velocimeter and a second type of velocimeter-mounted on the crossbeam body. The crossbeam body is mounted on a measurement carrier. The measurement carrier is configured to move along the surface of the material and apply a dynamic load to the surface. The first type of velocimeter is configured to measure the vertically resilient deformation velocity of the surface behind an action force of the dynamic load. The second type of velocimeter is configured to measure the vertical downward deformation velocity of the surface in front of the action force of the dynamic load. The vertically resilient deformation velocity and the vertically downward deformation velocity of the surface can be simultaneously and quickly obtained by the first and second types of velocimeters.

Abstract: A method comprises: patterning a substrate, including a conductive region, with photoresist exposed by lithography, where the substrate is mounted on a handle substrate; forming a comb structure with conductive fingers on the substrate by at least removing a portion of the conductive region of the substrate; removing the photoresist; forming, one atomic layer at a time, at least one atomic layer of at least one conductor over at least one sidewall of each conductive finger; attaching at least one insulator layer to the comb structure, and the substrate from which the comb structure is formed; and removing the handle substrate.

Abstract: The disclosure is directed to compounds of Formula I, Formula II, Formula III, Formula IV, Formula V, or Formula VI: Methods of their use in inhibiting a protein arginine methyltransferase 5 (PRMT5) enzyme and treating disease, as well as methods of their preparation are also described.

Abstract: The disclosure is directed to compounds of Formula I Pharmaceutical compositions comprising compounds of Formula I, as well as methods of their use and preparation, are also described.

Abstract: Examples described herein include multiple control systems for medical devices, such as medical ventilators. Examples of multiple control of a medical ventilator in an isolation room are described.

Abstract: The disclosure is directed to compounds of Formula (I) and Formula (II). Formula (I) and Formula (II) and pharmaceutically acceptable salts or solvates thereof. Pharmaceutical compositions comprising compounds of Formula (I) or Formula (II), as well as methods of their use and preparation, are also described.

Abstract: The present disclosure discloses an antenna structure and an electronic device having the same. The antenna structure comprises a first antenna, a second antenna and a three-dimensional decoupling structure located on at least two planes, wherein the three-dimensional decoupling structure comprises a conductor, and at least part of the three-dimensional decoupling structure is located in a space between the first antenna and the second antenna. Compared with the prior art, the antenna structure and the electronic device having the same disclosed by the present disclosure can effectively achieve the antenna decoupling effect through the three-dimensional decoupling structure, so that the degradation degree of antenna performance due to coupling can be reduced, and meanwhile, the three-dimensional space of the system can be better utilized.

Abstract: The disclosure is directed to compounds of Formula I Pharmaceutical compositions comprising compounds of Formula I, as well as methods of their use and preparation, are also described.

Abstract: An automatic powering device includes a dielectric layer, a driving layer, a plurality of electrodes and a droplet. The dielectric layer includes a first surface and a second surface opposite to the first surface. The driving layer faces toward the dielectric layer thereby forming a channel between the driving layer and the dielectric layer. The driving layer includes a plurality of hydrophilic surfaces facing toward the first surface and a plurality of hydrophobic surfaces facing toward the first surface. Each of the hydrophilic surfaces is staggered from each of the hydrophobic surfaces. The electrodes are disposed at the second surfaces. The electrodes each are electrically connected to and spaced from each other. The droplet is flowable within the channel. The droplet is affected by the hydrophilic surfaces and the hydrophobic surfaces so as to flow in the channel.

Abstract: A diaphragm pump includes a valve seat, a head cover covered on the valve seat, and a pair of valve plates. A surface of the valves seat is formed concavely with a first receiving trough with a first flow passage, and a second receiving trough with a second flow passage. One of the valve plates is disposed in the first receiving trough, and the other one is disposed in the second receiving trough. The first and second receiving troughs respectively have a geometric shape corresponding with that of the valve plate. The valve plate has a sealing part, and at least one extending arm extended outwardly from the sealing part. The sealing part has a geometric shape being bilaterally symmetrical. The extending arm has an arced end. A gap is existed between an edge of the valves plate and the first receiving trough or the second receiving trough.

Abstract: A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A haptic feedback module with a touch panel and a piezoelectric haptic feedback module is disclosed. The piezoelectric haptic feedback module contacts with the touch panel and has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board has a plurality of first electrode areas and each first electrode area has a first length. Each of the piezoelectric units is respectively configured below each of the first electrode areas. Each of the piezoelectric units has a second length, wherein the first length is 10% to 20% of the second length.

Abstract: A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.

Abstract: A memory device includes a transistor, an anti-fuse element, a first gate via, a second gate via, and a bit line. The transistor includes a fin structure and a first gate structure across the fin structure. The anti-fuse element includes the fin structure and a second gate structure across the fin structure. The first gate via is connected to the first gate structure of the transistor and is spaced apart from the fin structure in a top view. The second gate via is connected to the second gate structure of the anti-fuse element and is directly above the fin structure. The bit line is connected to the fin structure and the transistor.

Abstract: An approach is provided in which an information handling system creates a set of first containers from a container image that each includes a set of shareable files. The information handling system creates a second container from the container image that is devoid of the set of shared files and includes a pointer that points to a selected one of the first containers. In turn, the second container mounts to the first container and utilizes the shared files included the first container.

Abstract: An approach is provided in which an information handling system creates a set of first containers from a container image that each includes a set of shareable files. The information handling system creates a second container from the container image that is devoid of the set of shared files and includes a pointer that points to a selected one of the first containers. In turn, the second container mounts to the first container and utilizes the shared files included the first container.

Abstract: The embodiment of the present disclosure provides an antenna structure and an antenna array. The antenna structure comprises a first antenna component which comprises: a first three-dimensional antenna with one end grounded or connected with a reference potential; a single antenna port connected with the other end of the first three-dimensional antenna; and a first parasitic structure provided adjacent to the first three-dimensional antenna. In the antenna structure, the first three-dimensional antenna is only connected with a single antenna port, so that the number of ports required by the antenna can be reduced, that is, the power consumption can be reduced from the antenna dimension, thereby simultaneously reducing heat generation and maintaining stable overall wireless performance.

Abstract: A method for manufacturing a semiconductor device including an upper-channel implant transistor is provided. The method includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is shallowly implanted in an upper portion of the first region of the fins but not in the second regions and not in a lower portion of the first region of the fins. A gate structure extending in a second direction perpendicular to the first direction is formed overlying the first region of the fins, and source/drains are formed overlying the second regions of the fins, thereby forming an upper-channel implant transistor.