Patents by Inventor Hong-Mei Zhang

Hong-Mei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190179933
    Abstract: Provided are a computer program product, system, and method for generating sub-indexes from an index to compress the index. An index has levels of nodes for a composite key comprised of component keys. Each node includes at least one composite key value comprised of component key values. A plurality of sub-indexes is generated including one sub-index for each component key of the composite key. Nodes are generated in each sub-index corresponding to nodes in the index. In each node of the nodes of the sub-index, a component key value is generated, for the component key for which the sub-index was generated, from at least one composite key value in the corresponding node of the index. The sub-indexes are used to search for a record matching a search composite key value in the database using component key values of the search composite key value.
    Type: Application
    Filed: December 12, 2017
    Publication date: June 13, 2019
    Inventors: Xiaobo Wang, Shuo Li, Hong Mei Zhang, Shu Hua Liu
  • Publication number: 20180113902
    Abstract: A system optimizes performance of parallel queries by dividing a query into a plurality of sub queries. The query is divided according to a plurality of data ranges associated with the query. The system creates an available queue, and a defer queue. The system assigns the plurality of sub queries into the available queue. The system then processes, in parallel, the plurality of sub queries in the available queue. During the processing, if the system determines that a data range associated with a sub query comprises unavailable data, the system assigns the sub query to the defer queue as a defer range sub query. After completing the processing of the plurality of sub queries in the available queue, the system processes a plurality of defer range sub queries in the defer queue.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 26, 2018
    Inventors: Xiao Xiao CHEN, Shuo LI, Heng LIU, Liu WANG, Hong Mei ZHANG
  • Patent number: 9568962
    Abstract: An expansion card securing mechanism is configured to secure different kinds of expansion cards. The expansion card securing mechanism includes a base and a plurality of securing members which are secured on the base. The base includes a latch portion. The latch portion defines a plurality of latch holes, the securing member can be secured in the latch hole. Each securing member defines a cavity, the latch hole and the cavity can receive different kinds of expansion cards to secure the expansion cards.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: February 14, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wen-Hsiang Hung, Jun-Bo Yang, Chun-Bao Gu, Hong-Mei Zhang
  • Publication number: 20160308288
    Abstract: A fastening mechanism is used to fix a plurality of data cables on an electronic component. The electronic component includes a circuit board. The fastening mechanism includes a latch portion and a sliding portion connected with the latch portion. The latch portion defines a latch groove. The sliding portion defines a plurality of sliding grooves. The data cables are received in the sliding grooves and are connected with the circuit board. The latch groove is configured to receive the circuit board to fix the data cables on the electronic component.
    Type: Application
    Filed: May 18, 2015
    Publication date: October 20, 2016
    Inventors: WEN-HSIANG HUNG, CHUN-BAO GU, HONG-MEI ZHANG
  • Patent number: 9466899
    Abstract: A connector includes an insulation body, a first pin row, a second pin row, a first connection terminal row and a second connection terminal row. The insulation body includes a division portion and defines a first receiving groove and a second receiving groove positioned at two opposite sides of the division portion. The first pin row and the second pin row are attached to two opposite sides of the division portion. One of the ends of the first connection terminal row electrically connect to a motherboard, the other one of the ends of the first connection terminal row connect to the first pin row. One of the ends of the second connection terminal row electrically connect to the motherboard, the other one of the ends of the second connection terminal row connect to the second pin row. The disclosure also provides a data cable to connect the connector.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 11, 2016
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ching-Jou Chen, Wen-Hsiang Hung, Chun-Bao Gu, Hong-Mei Zhang
  • Publication number: 20160295720
    Abstract: An electronic module includes a case and a connecting member. The case includes a top panel and a side panel coupled to the top panel and substantially perpendicular to the top panel. The top panel includes two opposite elastic pieces. The connecting member includes a cable extending from the side panel and a connector coupled to the cable. The connector is attached to the top panel, and the two opposite elastic pieces are deformable to engage with the connector to prevent the connector from disengaging from the top panel.
    Type: Application
    Filed: April 20, 2015
    Publication date: October 6, 2016
    Inventors: CHING-JOU CHEN, WEN-HSIANG HUNG, CHUN-BAO GU, HONG-MEI ZHANG
  • Publication number: 20160285183
    Abstract: A connector includes an insulation body, a first pin row, a second pin row, a first connection terminal row and a second connection terminal row. The insulation body includes a division portion and defines a first receiving groove and a second receiving groove positioned at two opposite sides of the division portion. The first pin row and the second pin row are attached to two opposite sides of the division portion. One of the ends of the first connection terminal row electrically connect to a motherboard, the other one of the ends of the first connection terminal row connect to the first pin row. One of the ends of the second connection terminal row electrically connect to the motherboard, the other one of the ends of the second connection terminal row connect to the second pin row. The disclosure also provides a data cable to connect the connector.
    Type: Application
    Filed: April 24, 2015
    Publication date: September 29, 2016
    Inventors: CHING-JOU CHEN, WEN-HSIANG HUNG, CHUN-BAO GU, HONG-MEI ZHANG
  • Patent number: 9414505
    Abstract: An electronic device includes an enclosure, a circuit board mounted in the enclosure, an electronic component attached to the circuit board, an antenna module mounted to the electronic component, and a mounting apparatus configured to mount the antenna module. The mounting apparatus includes a pressing member mounted on the circuit board. The mounting apparatus includes a pressing panel, a pressing block extending from the pressing panel, a positioning piece extending from the pressing panel, and a pressing piece extending from the pressing block. The pressing piece has a back wall. The pressing block presses the electronic component, the pressing panel presses the antenna module, and the back wall and the positioning piece abut against two adjacent sidewalls of the electronic component.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: August 9, 2016
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wen-Hsiang Hung, Chun-Bao Gu, Hong-Mei Zhang
  • Publication number: 20160205795
    Abstract: An electronic device includes an enclosure, a circuit board mounted in the enclosure, an electronic component attached to the circuit board, an antenna module mounted to the electronic component, and a mounting apparatus configured to mount the antenna module. The mounting apparatus includes a pressing member mounted on the circuit board. The mounting apparatus includes a pressing panel, a pressing block extending from the pressing panel, a positioning piece extending from the pressing panel, and a pressing piece extending from the pressing block. The pressing piece has a back wall. The pressing block presses the electronic component, the pressing panel presses the antenna module, and the back wall and the positioning piece abut against two adjacent sidewalls of the electronic component.
    Type: Application
    Filed: February 3, 2015
    Publication date: July 14, 2016
    Inventors: WEN-HSIANG HUNG, CHUN-BAO GU, HONG-MEI ZHANG
  • Publication number: 20160187939
    Abstract: An expansion card securing mechanism is configured to secure different kinds of expansion cards. The expansion card securing mechanism includes a base and a plurality of securing members which are secured on the base. The base includes a latch portion. The latch portion defines a plurality of latch holes, the securing member can be secured in the latch hole. Each securing member defines a cavity, the latch hole and the cavity can receive different kinds of expansion cards to secure the expansion cards.
    Type: Application
    Filed: April 30, 2015
    Publication date: June 30, 2016
    Inventors: WEN-HSIANG HUNG, JUN-BO YANG, CHUN-BAO GU, HONG-MEI ZHANG
  • Publication number: 20160104987
    Abstract: An electronic system includes a main control device, a display device, and a coupling device. The coupling device includes a first connector secured to the display device and a second connector secured to the main control device. The first connector has a plurality of coupling ports, the second connector has a plurality of connecting ports. The coupling ports are electronically coupled to the connecting ports, and the first connector is secured to the second connector, to secure the display device to the main control device. A coupling device used in the electronic system is further disclosed.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 14, 2016
    Inventors: WEN-HSIANG HUNG, CHUN-BAO GU, HUA XIAO, HONG-MEI ZHANG
  • Patent number: 8076005
    Abstract: High density oxide films are deposited by a pulsed-DC, biased, reactive sputtering process from a titanium containing target to form high quality titanium containing oxide films. A method of forming a titanium based layer or film according to the present invention includes depositing a layer of titanium containing oxide by pulsed-DC, biased reactive sputtering process on a substrate. In some embodiments, the layer is TiO2. In some embodiments, the layer is a sub-oxide of Titanium. In some embodiments, the layer is TixOy wherein x is between about 1 and about 4 and y is between about 1 and about 7. In some embodiments, the layer can be doped with one or more rare-earth ions. Such layers are useful in energy and charge storage, and energy conversion technologies.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: December 13, 2011
    Assignee: SpringWorks, LLC
    Inventors: Richard E. Demaray, Hong Mei Zhang, Mukundan Narasimhan, Vassiliki Milonopoulou
  • Patent number: 7238628
    Abstract: High density oxide films are deposited by a pulsed-DC, biased, reactive sputtering process from a titanium containing target to form high quality titanium containing oxide films. A method of forming a titanium based layer or film according to the present invention includes depositing a layer of titanium containing oxide by pulsed-DC, biased reactive sputtering process on a substrate. In some embodiments, the layer is TiO2. In some embodiments, the layer is a sub-oxide of Titanium. In some embodiments, the layer is TixOy wherein x is between about 1 and about 4 and y is between about 1 and about 7. In some embodiments, the layer can be doped with one or more rare-earth ions. Such layers are useful in energy and charge storage, and energy conversion technologies.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: July 3, 2007
    Assignee: Symmorphix, Inc.
    Inventors: Richard E. Demaray, Hong Mei Zhang, Mukundan Narasimhan, Vassiliki Milonopoulou
  • Publication number: 20040259305
    Abstract: High density oxide films are deposited by a pulsed-DC, biased, reactive sputtering process from a titanium containing target to form high quality titanium containing oxide films. A method of forming a titanium based layer or film according to the present invention includes depositing a layer of titanium containing oxide by pulsed-DC, biased reactive sputtering process on a substrate. In some embodiments, the layer is TiO2. In some embodiments, the layer is a sub-oxide of Titanium. In some embodiments, the layer is TixOy wherein x is between about 1 and about 4 and y is between about 1 and about 7. In some embodiments, the layer can be doped with one or more rare-earth ions. Such layers are useful in energy and charge storage, and energy conversion technologies.
    Type: Application
    Filed: May 20, 2004
    Publication date: December 23, 2004
    Inventors: Richard E. Demaray, Hong Mei Zhang, Mukundan Narasimhan, Vassiliki Milonopoulou
  • Patent number: 6613199
    Abstract: A hollow cathode magnetron comprises an open top target within a hollow cathode. The open top target can be biased to a negative potential so as to form an electric field within the cathode to generate a plasma. The magnetron uses at least one electromagnetic coil to shape and maintain a density of the plasma within the cathode. The magnetron also has an anode located beneath the cathode. The open top target can have one of several different geometries including flat annular, conical and cylindrical, etc.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: September 2, 2003
    Assignee: Novellus Systems, Inc.
    Inventors: Jeffrey A. Tobin, Jean Qing Lu, Thomas Mountsier, Hong Mei Zhang
  • Patent number: 6500762
    Abstract: We have discovered a method of improving step coverage of a copper seed layer deposited over a semiconductor feature surface which is particularly useful for small size features having a high aspect ratio. We have demonstrated that it is possible to increase the copper seed layer coverage simultaneously at the bottom of a high aspect ratio contact via and on the walls of the via by increasing the percentage of the depositing copper species which are ions. The percentage of species ionization which is necessary to obtain sufficient step coverage for the copper seed layer is a function of the aspect ratio of the feature. An increase in the percentage of copper species which are ionized can be achieved using techniques known in the art, including but not limited to applicants' preferred technique, an inductively coupled RF ion metal plasma.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: December 31, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Imran Hashim, Hong-Mei Zhang, John C. Forster
  • Publication number: 20020068449
    Abstract: We have discovered a method of improving step coverage of a copper seed layer deposited over a semiconductor feature surface which is particularly useful for small size features having a high aspect ratio. Using a contact via as an example of a high aspect ratio feature, we have demonstrated that despite previously-held views, it is possible to increase the copper seed layer coverage simultaneously at the bottom of the via and on the wall of the via by increasing the percentage of the depositing copper species which are ions. The percentage of species ionization which is necessary to obtain sufficient step coverage for the copper seed layer is a function of the aspect ratio of the feature. For features having a 0.25 &mgr;m or smaller feature size, an aspect ratio of about 3:1 requires that about 50% or more of the copper species be ions at the time of deposition on the substrate.
    Type: Application
    Filed: January 24, 2002
    Publication date: June 6, 2002
    Inventors: Imran Hashim, Hong-Mei Zhang, John C. Forster
  • Patent number: 6391776
    Abstract: A method of improving step coverage of a copper seed layer deposited over a semiconductor feature surface which is particularly useful for small size features having a high aspect ratio. Using a contact via as an example of a high aspect ratio feature, we have demonstrated that it is possible to increase the copper seed layer coverage simultaneously at both the bottom of the via and on the wall of the via . This increase is achieved by increasing the percentage of the depositing copper species which are ions. The percentage of species ionization which is necessary to obtain sufficient step coverage for the copper seed layer is a function of the aspect ratio of the feature. For features having a 0.25 &mgr;m or smaller feature size, an aspect ratio of about 3:1 requires that about 50% or more of the copper species be ions at the time of deposition on the substrate.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: May 21, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Imran Hashim, Hong-Mei Zhang, John C. Forster