Abstract: The present invention relates to compounds of formula (I), wherein R1, R2, R3, R4 and X are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.

Abstract: A dental self-adhesive resin cement is provided comprising a two-component system. A first catalyst component includes one or more acidic monomers. A second base component includes one or more basic fillers. The mixture of the first and second components is polymerizable and has an initial pH that is acidic immediately after mixing and a pH of at least about pH 8 after polymerization.

Abstract: Filter capsules for showers and sinks used in surgical settings, clean rooms and other contaminant-sensitive settings having modified outlets for improved splash control. Flat, concave, convex, asymmetric concave and asymmetric convex outlet inserts have pluralities of fluid bores with varying orientations to permit enhanced fluid flow control out of the filter capsules including divergent, convergent and mixed divergent/convergent fluid flows. An inlet with an axis offset at an angle to the longitudinal axis of the filter capsule body permits user control over the fluid flow strike point in a sink or shower stall via rotation of the capsule about the inlet connection point. A recessed outlet improves the prevention of contaminant dispersal by recessing the outlet away from contact points and potential contaminant sources.

Abstract: The present disclosure relates to a user equipment in a wireless communication system. The user equipment according to the present disclosure comprises a processing circuit and is configured to: send first data by using a first transmission power during a first time period; and send differential data of the first data by using a second transmission power during a second time period, the differential data being the difference between the first data and second data that is expected to be sent during the second time period.

Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: The present invention relates to compounds of formula (I), wherein R1 to R3, A and Q are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: Dies (110) with integrated circuits are attached to a wiring substrate (120), possibly an interposer, and are protected by a protective substrate (410) attached to a wiring substrate. The dies are located in cavities in the protective substrate (the dies may protrude out of the cavities). In some embodiments, each cavity surface puts pressure on the die to strengthen the mechanical attachment of the die the wiring substrate, to provide good thermal conductivity between the dies and the ambient (or a heat sink), to counteract the die warpage, and possibly reduce the vertical size. The protective substrate may or may not have its own circuitry connected to the dies or to the wiring substrate. Other features are also provided.

Abstract: The present invention relates to compounds of formula (I), wherein R1 to R6, m and n are I a described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to compounds of formula (I), wherein R1, R2, R3 and R4 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to compounds of the formula (I), or pharmaceutically acceptable salts, enantiomer or diastereomer thereof, wherein R1 to R4 are as described above. The compounds may be useful for the treatment or prophylaxis of hepatitis B virus infection.

Abstract: The present invention relates to compounds of formula (I), wherein R1, R2 and R3 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds as antagonist of TLR7 and/or TLR8 and/or TLR9 in the treatment of autoimmune diseases as well as auto-inflammation diseases.

Abstract: The present invention relates to compounds of formula (I) wherein R1, R2, R3 and R4 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to novel compounds of formula (I), wherein R1, R2, R3, R4, R5 and R6 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to novel compounds of formula (I), wherein R1 to R7 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to novel compounds of formula (I), wherein R1, R2, R3, R4, R5 and R6 are as described herein, and their prodrugs or pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to novel compounds of formula (I), wherein R1, R2, R3, R4, R5 and R6 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to a compound of formula (I) wherein R4 is C1-6alkyl, halogen or cyano; R5 is halogen; R2 is 4,5,6,7-tetrahydropyrazolo[3,4-c]pyridinyl which is unsubstituted or substituted by C1-6alkyl or haloC1-6alkyl; 4,5,6,7-tetrahydropyrazolo[4,3-c]pyridinyl which is unsubstituted or substituted one or two times by C1-6alkyl; or 5,6-dihydro-4H-pyrrolo[3,4-c]pyrazolyl; R3 is C1-6alkyl; L is azetidinyl or piperidinyl; or a pharmaceutically acceptable salt thereof, for use as a TLR7, TLR8 and/or TLR9 antagonist for the treatment or prophylaxis of autoimmune diseases, such as e.g. systemic lupus erythematosus or lupus nephritis.

Abstract: The present invention relates to compounds of formula (I), ab (I), wherein R1 to R3 and L are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: Systems and methods for providing 3D wafer assembly with known-good-dies are provided. An example method compiles an index of dies on a semiconductor wafer and removes the defective dies to provide a wafer with dies that are all operational. Defective dies on multiple wafers may be removed in parallel, and resulting wafers with all good dies stacked in 3D wafer assembly. In an implementation, the spaces left by removed defective dies may be filled at least in part with operational dies or with a fill material. Defective dies may be replaced either before or after wafer-to-wafer assembly to eliminate production of defective stacked devices, or the spaces may be left empty. A bottom device wafer may also have its defective dies removed or replaced, resulting in wafer-to-wafer assembly that provides 3D stacks with no defective dies.