Patents by Inventor Hong Sun NA

Hong Sun NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11820931
    Abstract: The present disclosure relates to a liquid crystal polyester resin composition and an electronic component material comprising the same with low dust characteristics. Specifically, the present disclosure relates to a liquid crystal polyester resin composition for preventing dust generation comprising 65% by weight or more and 85% by weight or less of a liquid crystal polyester resin; more than 0.5% by weight and less than 10% by weight of a transition metal compound containing a Group 6 element of the periodic table; 2% by weight or more and 10% by weight or less of a barium compound; 2% by weight or more and 10% by weight or less of an organic filler; and 12% by weight or more and 30% by weight or less of a filler.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: November 21, 2023
    Assignee: SEYANG POLYMER
    Inventors: Tae-Young Ha, Hyuk Jin Kim, Soo Min Park, Hong Sun Na, Sun Hwa Jang, Youn Eung Lee, Jin Kyu Lee
  • Publication number: 20220204852
    Abstract: The present disclosure relates to a liquid crystal polyester resin composition and an electronic component material comprising the same with low dust characteristics. Specifically, the present disclosure relates to a liquid crystal polyester resin composition for preventing dust generation comprising 65% by weight or more and 85% by weight or less of a liquid crystal polyester resin; more than 0.5% by weight and less than 10% by weight of a transition metal compound containing a Group 6 element of the periodic table; 2% by weight or more and 10% by weight or less of a barium compound; 2% by weight or more and 10% by weight or less of an organic filler; and 12% by weight or more and 30% by weight or less of a filler.
    Type: Application
    Filed: July 6, 2021
    Publication date: June 30, 2022
    Inventors: Tae-Young HA, Hyuk Jin KIM, Soo Min PARK, Hong Sun NA, Sun Hwa JANG, Youn Eung LEE, Jin Kyu LEE