Patents by Inventor Hongzhou Shen
Hongzhou Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11351622Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.Type: GrantFiled: August 11, 2016Date of Patent: June 7, 2022Assignees: TE Connectivity Corporation, Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. LtdInventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Qinglong Zeng
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Patent number: 10955363Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.Type: GrantFiled: February 22, 2019Date of Patent: March 23, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity CorporationInventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
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Patent number: 10512172Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.Type: GrantFiled: October 27, 2016Date of Patent: December 17, 2019Assignees: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd., TE Connectivity Germany GmbHInventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
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Patent number: 10363581Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.Type: GrantFiled: November 14, 2016Date of Patent: July 30, 2019Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., TE Connectivity Corporation, Zhuhai Yingzhi Tech Co. Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
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Patent number: 10350717Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.Type: GrantFiled: November 14, 2016Date of Patent: July 16, 2019Assignees: TE Connectivity Corporation, Tyco Electronics (Dongguan) Co. Ltd., Zhuhai Yingzhi Tech Co. Ltd., Tyco Electronics (Shanghai) Co. Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
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Publication number: 20190187070Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.Type: ApplicationFiled: February 22, 2019Publication date: June 20, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity CorporationInventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
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Patent number: 9997886Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.Type: GrantFiled: March 19, 2015Date of Patent: June 12, 2018Assignees: TE Connectivity Corporation, Innogetic Technology Co., Ltd., Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Kok Wai Wong
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Publication number: 20170118845Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.Type: ApplicationFiled: October 27, 2016Publication date: April 27, 2017Applicants: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd, TE Connectivity Germany GmbHInventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
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Publication number: 20170056931Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.Type: ApplicationFiled: November 14, 2016Publication date: March 2, 2017Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co. Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
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Publication number: 20170057026Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.Type: ApplicationFiled: November 14, 2016Publication date: March 2, 2017Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co., Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
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Publication number: 20160346858Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.Type: ApplicationFiled: August 11, 2016Publication date: December 1, 2016Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation, Tyco Electronics (Dongguan) LtdInventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-yi Lu, George J. Dubniczki, Qinglong Zeng
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Publication number: 20150325970Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.Type: ApplicationFiled: March 19, 2015Publication date: November 12, 2015Applicants: TYCO ELECTRONICS (SHANGHAI) CO. LTD., TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS (DONGGUAN) LTD.Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Lu Yi, George J. Dubniczki, Kok Wai Wong