Patents by Inventor Hongzhou Shen

Hongzhou Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11351622
    Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 7, 2022
    Assignees: TE Connectivity Corporation, Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Qinglong Zeng
  • Patent number: 10955363
    Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: March 23, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity Corporation
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
  • Patent number: 10512172
    Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: December 17, 2019
    Assignees: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd., TE Connectivity Germany GmbH
    Inventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
  • Patent number: 10363581
    Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: July 30, 2019
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., TE Connectivity Corporation, Zhuhai Yingzhi Tech Co. Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
  • Patent number: 10350717
    Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: July 16, 2019
    Assignees: TE Connectivity Corporation, Tyco Electronics (Dongguan) Co. Ltd., Zhuhai Yingzhi Tech Co. Ltd., Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
  • Publication number: 20190187070
    Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity Corporation
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
  • Patent number: 9997886
    Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: June 12, 2018
    Assignees: TE Connectivity Corporation, Innogetic Technology Co., Ltd., Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Kok Wai Wong
  • Publication number: 20170118845
    Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.
    Type: Application
    Filed: October 27, 2016
    Publication date: April 27, 2017
    Applicants: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd, TE Connectivity Germany GmbH
    Inventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
  • Publication number: 20170056931
    Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co. Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
  • Publication number: 20170057026
    Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co., Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
  • Publication number: 20160346858
    Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
    Type: Application
    Filed: August 11, 2016
    Publication date: December 1, 2016
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation, Tyco Electronics (Dongguan) Ltd
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-yi Lu, George J. Dubniczki, Qinglong Zeng
  • Publication number: 20150325970
    Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.
    Type: Application
    Filed: March 19, 2015
    Publication date: November 12, 2015
    Applicants: TYCO ELECTRONICS (SHANGHAI) CO. LTD., TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS (DONGGUAN) LTD.
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Lu Yi, George J. Dubniczki, Kok Wai Wong