Patents by Inventor Hoon Ahn

Hoon Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363550
    Abstract: Disclosed is a method of manufacturing a fan-out packaging device using wafer or panel level packaging including forming a temporary adhesive layer on a carrier substrate, attaching a die to the temporary adhesive layer, attaching a preformer, molding the die and the preformer on the temporary adhesive layer, separating the fan-out packaging substrate from the carrier substrate and the temporary adhesive layer, forming a temporary protective layer, forming a rear metal layer connected to the metal via, and removing the temporary protective layer and then forming a re-distribution line structure, and a bump structure connected to the re-distribution line structure.
    Type: Application
    Filed: April 26, 2024
    Publication date: October 31, 2024
    Applicant: SILICON BOX PTE. LTD.
    Inventors: Byung Joon HAN, Byung Hoon AHN
  • Patent number: 12126133
    Abstract: A femtosecond laser source according to an embodiment of the present invention includes: a pulse generator that converts a continuous wave laser into an optical pulse train; a burst generator that separates the optical pulse train into a plurality of burst pulses; a pulse amplification and spectral broadening unit that expands the spectrum by amplifying a plurality of burst pulses; and a pulse compressor that compresses a plurality of amplified burst pulses to generate a femtosecond laser with a pulse width of 1 picosecond (10?12 s) or less.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 22, 2024
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kwangyun Jung, Sang Hoon Ahn, Jiyeon Choi, Dohyun Kim, Ji-Whan Noh, Hee-shin Kang
  • Publication number: 20240272084
    Abstract: The present disclosure relates to a color gas sensor module including an optical measurement device, a housing having an interior space therein and a gas movement passage allowing a gas to move from outside to the interior space, wherein the optical measurement device is provided in the housing and includes a light emitter that emit light and a light receiver that receives reflected light, and a gas sensor included in the housing and changing color by reacting with gas, wherein the light emitter emits light to the gas sensor, and the light receiver receives light reflected from the gas sensor.
    Type: Application
    Filed: May 27, 2021
    Publication date: August 15, 2024
    Inventors: Sung Hoon AHN, Young Gyun KIM
  • Patent number: 12043953
    Abstract: The present disclosure relates to a method of controlling a garment folding machine having a plurality of folding layers configured to perform a function of folding a garment or a function of conveying the garment using at least one conveyor, and the method includes a wrinkle removing step of operating a conveyor motor to allow the conveyor to drop one end of the garment from the conveyor, thereby removing wrinkles of the garment using a weight of the garment.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: July 23, 2024
    Assignee: LG Electronics Inc.
    Inventors: Kyosoon Chae, Keun Joo Kim, Sung Hoon Ahn, Choongho Lim
  • Publication number: 20240234490
    Abstract: A semiconductor device includes a semiconductor substrate including a connection region, a pair of epitaxial patterns provided at the semiconductor substrate, a capacitor disposed between the pair of epitaxial patterns, a middle connection layer on the capacitor, an interconnection layer on the middle connection layer, and a through-via provided under the interconnection layer and penetrating the connection region of the semiconductor substrate. The capacitor includes an upper portion of the semiconductor substrate between the pair of epitaxial patterns, a metal electrode on the upper portion of the semiconductor substrate, and a dielectric pattern disposed between the upper portion of the semiconductor substrate and the metal electrode. The through-via is connected to the capacitor through the interconnection layer and the middle connection layer.
    Type: Application
    Filed: March 21, 2024
    Publication date: July 11, 2024
    Inventors: SHAOFENG DING, JEONG HOON AHN, YUN KI CHOI
  • Publication number: 20240218347
    Abstract: The present disclosure relates to a polymer in which bovine serum albumin (BSA) is conjugated to a polysaccharide, a method of preparing the same, an enzyme-stabilizing composition including the same, and a method of amplifying or detecting a target nucleic acid molecule in a biological sample by using the same. The polymer is used to prevent the hydrolysis, oxidation, or reduction of an enzyme, such as a nucleic acid polymerase, in a composition, thereby maintaining the stability of the composition. Even when stored at room temperature and high temperature, a composition including the polymer can stably maintain enzymatic activity equivalent to that of a composition kept frozen. Accordingly, the polymer of the present disclosure and a composition including the same efficiently detect a target nucleic acid molecule associated with the onset of infectious diseases and/or cancer, and thus can be usefully applied to the diagnosis of diseases.
    Type: Application
    Filed: October 7, 2022
    Publication date: July 4, 2024
    Applicant: SML GENETREE CO., LTD.
    Inventors: Yo Han Jeong, Jeong Ju Lee, So Hyeon Park, Kyung Ah Hwang, Ji Hoon Ahn
  • Publication number: 20240217092
    Abstract: A building exterior wall cleaning robot is disclosed. The building exterior wall cleaning robot comprises: a robot body which cleans a building exterior wall while being suspended on ropes and has a predetermined weight; an LM guide which is coupled to the robot body and provided to have a predetermined length; and a moving unit which is connected to the ropes and moves along the LM guide to move the point on which the tension of the ropes is acting.
    Type: Application
    Filed: May 9, 2022
    Publication date: July 4, 2024
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Tae Won SEO, Kyung Ook LEE, Ho Byeong CHAE, Ye Cheol MOON, Myeong Jin CHOI, Sa Hoon AHN, Kyoung Wook LEE, Kyung Min KIM
  • Publication number: 20240207362
    Abstract: Described herein is a method of preventing or treating a neurodegenerative disease including administering an agent to a person in which the agent causes increase in outflow of cerebrospinal fluid through nasopharyngeal lymphatic plexus (NPLP), or an agent that causes contraction and relaxation of the circular smooth muscles covering the deep cervical lymphatic vessels (dcLVs).
    Type: Application
    Filed: October 25, 2023
    Publication date: June 27, 2024
    Applicants: Institute for Basic Science (IBS), Korea Advanced Institute of Science & Technology
    Inventors: Jin-Hui Yoon, Hokyung Jin, Ji Hoon Ahn, Seon Pyo Hong, Myung Jin Yang, Gou Young Koh
  • Publication number: 20240212154
    Abstract: A system may access a source image of the subject. A system may execute an image segmentation model that uses the source image to distinguish the target object from among other objects in the source image. A system may generate a binary image of the target object based on execution of the image segmentation model. A system may generate, based on the binary image, a size estimate of the target object. A system may execute a machine learning-based model that uses the size estimate and one or more covariates to predict a future size of the target object. A system may determine a risk classification for the subject based on the predicted growth rate, the risk classification being based on a probability that the target object of the subject will result in a disease state, the risk classification to be used to determine a treatment regimen to treat or prevent the disease state.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 27, 2024
    Applicant: OTSUKA PHARMACEUTICAL DEVELOPMENT & COMMERCIALIZATION, INC.
    Inventors: Akshay VASHIST, Hossain SABOONCHI, Jong-Hoon AHN
  • Patent number: 12016905
    Abstract: Disclosed is a pharmaceutical composition for the prevention or treatment of preterm birth, comprising, as an active ingredient, an agent that inhibits the differentiation of fibroblasts into myofibroblasts in cervix.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: June 25, 2024
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Ki Hoon Ahn, Eun Jin Wang
  • Patent number: 12014935
    Abstract: The method of manufacturing an interposer includes providing a substrate including a first region and a second region adjacent to the first region, forming a first mold structure on the substrate, forming a photoresist layer on the first mold structure, forming a first transfer pattern over the photoresist layer on the first region, using a first photomask, forming a second transfer pattern over the photoresist layer on the second region, using the first photomask, forming a mask pattern on the first mold structure, using the first transfer pattern and the second transfer pattern and forming a first trench and a second trench in the first mold structure, using the mask pattern, the first trench being formed in the first region, and the second trench being formed in the second region.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: June 18, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng Ding, Jeong Hoon Ahn, Yun Ki Choi
  • Publication number: 20240164081
    Abstract: A semiconductor device includes a substrate including a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer on the dummy transistor, the intermediate connection layer including a connection pattern electrically connected to the dummy transistor, a first metal layer on the intermediate connection layer, an etch stop layer between the intermediate connection layer and the first metal layer, the etch stop layer covering a top surface of the connection pattern, and a penetration contact extended from the first metal layer toward a bottom surface of the substrate penetrating the connection region.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng DING, Jeong Hoon AHN, Yun Ki CHOI
  • Publication number: 20240151554
    Abstract: The present disclosure provides a method and an apparatus for quickly and accurately evaluating a trajectory of a projectile such as a satellite launching rocket or a missile by comparing the trajectory with a reference trajectory. The trajectory evaluation method includes: acquiring time series positioning data for a target and predetermined reference trajectory information; and mapping points representing the time series positioning data on a graph into corresponding points on a reference trajectory representing the predetermined reference trajectory information while relocating each mapped point onto a relocatable section taking into account a movable range dependent on a speed of the target, and determining a maximum value of distances moved by the points while the points are mapped and relocated as a similarity between the time series positioning data and the reference trajectory.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Applicant: POSTECH Research and Business Development Foundation
    Inventors: Hee Kap AHN, Tae Hoon AHN, Ji Woo PARK, Seung Jun LEE
  • Patent number: 11978668
    Abstract: Integrated circuit devices including a via and methods of forming the same are provided. The methods may include forming a conductive wire structure on a substrate. The conductive wire structure may include a first insulating layer and a conductive wire stack in the first insulating layer, and the conductive wire stack may include a conductive wire and a mask layer stacked on the substrate. The method may also include forming a recess in the first insulating layer by removing the mask layer, the recess exposing the conductive wire, forming an etch stop layer and then a second insulating layer on the first insulating layer and in the recess of the first insulating layer, and forming a conductive via extending through the second insulating layer and the etch stop layer and contacting the conductive wire.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: May 7, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ming He, Harsono Simka, Anthony Dongick Lee, Seowoo Nam, Sang Hoon Ahn
  • Patent number: 11961413
    Abstract: The present invention relates to a method, system and non-transitory computer-readable recording medium for assisting listening study. According to one aspect of the invention, there is provided a method for assisting listening study, comprising the steps of: determining a plurality of weak study sentences that a user who is provided with assessment study sentences by speech fails to understand, with reference to feedback from the user; determining at least some of pronunciations or pronunciation combinations commonly included in the plurality of weak study sentences as weak pronunciations or pronunciation combinations that the user fails to understand; and determining a compensatory study course to be provided to the user, with reference to the determined weak pronunciations or pronunciation combinations.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 16, 2024
    Assignee: VITRUV INC.
    Inventors: Se Hoon Gihm, Myung Hoon Ahn, Tae Hyoung Oh, Du Seop Jung
  • Patent number: 11961882
    Abstract: A semiconductor device includes a semiconductor substrate including a connection region, a pair of epitaxial patterns provided at the semiconductor substrate, a capacitor disposed between the pair of epitaxial patterns, a middle connection layer on the capacitor, an interconnection layer on the middle connection layer, and a through-via provided under the interconnection layer and penetrating the connection region of the semiconductor substrate. The capacitor includes an upper portion of the semiconductor substrate between the pair of epitaxial patterns, a metal electrode on the upper portion of the semiconductor substrate, and a dielectric pattern disposed between the upper portion of the semiconductor substrate and the metal electrode. The through-via is connected to the capacitor through the interconnection layer and the middle connection layer.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng Ding, Jeong Hoon Ahn, Yun Ki Choi
  • Publication number: 20240103055
    Abstract: Provided is a modular sensor platform apparatus. The modular sensor platform apparatus includes at least one first terminal capable of being coupled to a power sensor, a plurality of second terminals capable of being coupled to an external sensor module and a communication module, and a micro-control unit (MCU) configured to execute a predefined algorithm.
    Type: Application
    Filed: October 14, 2021
    Publication date: March 28, 2024
    Inventors: Sung-Hoon AHN, Seung-Gi KIM, Guyeop JUNG
  • Publication number: 20240105556
    Abstract: A semiconductor device includes a substrate provided with an integrated circuit and a contact, an interlayer dielectric layer covering the integrated circuit and the contact, a through electrode penetrating the substrate and the interlayer dielectric layer, a first intermetal dielectric layer on the interlayer dielectric layer, and first and second wiring patterns in the first intermetal dielectric layer. The first wiring pattern includes a first conductive pattern on the through electrode, and a first via penetrating the first intermetal dielectric layer and connecting the first conductive pattern to the through electrode. The second wiring pattern includes a second conductive pattern on the contact, and a second via penetrating the first intermetal dielectric layer and connecting the second conductive pattern to the contact. A first width in a first direction of the first via is greater than a second width in the first direction of the second via.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Inventors: SHAOFENG DING, JEONG HOON AHN, YUN KI CHOI
  • Publication number: 20240089859
    Abstract: An electronic device is provided. The electronic device includes a first communication circuit, a second communication circuit, a processor configured to be electrically connected with the first communication circuit and the second communication circuit, and a memory configured to be electrically connected with the processor. The memory includes instructions, when executed by the processor, cause the processor to obtain location information of the electronic device, transmit a first message for requesting to change a state of the electronic device to a network, receive a first response message to the transmitted first message from the network, transmit a second message for requesting a parameter for an operation cycle of the second communication circuit to the network, receive a second response message to the second message from the network, and change the operation cycle of the second communication circuit to a value corresponding to a current state of the electronic device.
    Type: Application
    Filed: October 18, 2023
    Publication date: March 14, 2024
    Inventors: Ji Young CHA, Hye Jeong KIM, Jung Hoon AHN
  • Patent number: 11913541
    Abstract: In a vehicle including a shift-by-wire (SBW) transmission which may be parked in the neutral gear position of the transmission, method for controlling parking thereof includes determining whether the vehicle is in a situation in which neutral parking is required according to sensor information, when the vehicle is stopped, outputting first information configured to get a confirmation on whether a driver intends to perform the neutral parking from the driver, when the controller concludes that the vehicle is in the situation in which the neutral parking is required and when a park (P) gear position is input or an ignition of the vehicle is turned off, and controlling the SBW transmission to shift to a neutral (N) gear position, when there is an agreement input as a response to the first information.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: February 27, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventor: Jong Hoon Ahn