Patents by Inventor Horonobu Baba

Horonobu Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5900554
    Abstract: When a compressed air is led into a reference pressure chamber along with a boundary between a resin housing and a terminal, such compressed air may cause a wire breaking. A barrier wall for blocking the compressed air from penetrating toward the wire is disposed. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel in the main chamber. Therefore, the wire breaking caused by the compressed air when connecting a connector therewith can be precluded.
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: May 4, 1999
    Assignee: Nippendenso Co., Ltd.
    Inventors: Horonobu Baba, Tiaki Mizuno, Masahito Imai, Yuichi Yokoyama, Masaki Takakuwa, Yasuki Shimoyama
  • Patent number: 5747694
    Abstract: A pressure sensor has a resin housing containing a pressure sensor positioned between a reference pressure chamber and a pressure to be measured. A terminal extends through the housing toward the sensor. A wire connects the terminal to the sensor. When a connector is connected to the terminal, it may compress air around the terminal. The compressed air may travel along the terminal and break the wire connected to the sensor. To prevent such breakage, a barrier wall is provided to block the compressed air from penetrating toward the wire. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel on the sensor and the wire in the main chamber. Therefore, the wire is protected.
    Type: Grant
    Filed: July 26, 1996
    Date of Patent: May 5, 1998
    Assignee: Nippondenso Co., Ltd.
    Inventors: Horonobu Baba, Tiaki Mizuno, Masahito Imai, Yuichi Yokoyama, Masaki Takakuwa, Yasuki Shimoyama