Patents by Inventor Hou-Ching Yang

Hou-Ching Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature heat shrinkable polymer material
    Patent number: 4596728
    Abstract: A heat shrinkable polymer material is particularly adapted for implanted biomedical use. A polycrystalline polymer is irradiated to produce crosslinking of its intramolecular structure to thereby impart viscoelasticity. The material is biocompatible and suitable for implanted use, from the standpoints of very low toxicity, ability to retain structural integrity and being non-carcinogenic and, moreover, is heat shrinkable at a temperature compatible with such implanted use.
    Type: Grant
    Filed: February 1, 1985
    Date of Patent: June 24, 1986
    Assignees: The Johns Hopkins University, University of Maryland
    Inventors: Hou-Ching Yang, Joseph Silverman, John J. Wozniak