Patents by Inventor Hozumi Yasuda

Hozumi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170173756
    Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 22, 2017
    Inventors: Satoru YAMAKI, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI, Shintaro ISONO
  • Patent number: 9676076
    Abstract: A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: June 13, 2017
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Shingo Togashi
  • Patent number: 9662764
    Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: May 30, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Publication number: 20170144267
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Satoru YAMAKI, Shintaro ISONO
  • Publication number: 20170106497
    Abstract: Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 20, 2017
    Inventors: Shingo Togashi, Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
  • Publication number: 20170057049
    Abstract: A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 2, 2017
    Inventors: Makoto Fukushima, Hozumi Yasuda, Shingo Togashi
  • Patent number: 9573241
    Abstract: A polishing apparatus capable of eliminating a variation in film thickness along a circumferential direction of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a polishing head including an elastic membrane for pressing the substrate against the polishing surface and a retainer ring arranged so as to surround the substrate, the retainer ring being capable of contacting the polishing surface; a rotating mechanism configured to rotate the polishing head about its own axis; a rotation angle detector configured to detect a rotation angle of the polishing head; and a polishing controller configured to periodically change a polishing condition of the substrate in synchronization with the rotation angle of the polishing head.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: February 21, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki
  • Patent number: 9573244
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: February 21, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 9550271
    Abstract: A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: January 24, 2017
    Assignee: Ebara Corporation
    Inventors: Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya, Masahiko Kishimoto
  • Publication number: 20160368115
    Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 22, 2016
    Inventors: Hozumi YASUDA, Makoto FUKUSHIMA, Osamu Nabeya
  • Publication number: 20160250735
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Application
    Filed: May 9, 2016
    Publication date: September 1, 2016
    Inventors: Osamu NABEYA, Tetsuji TOGAWA, Makoto FUKUSHIMA, Hozumi YASUDA
  • Publication number: 20160243670
    Abstract: According to one embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring, wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 25, 2016
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI
  • Patent number: 9403255
    Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: August 2, 2016
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: 9399277
    Abstract: A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: July 26, 2016
    Assignee: Ebara Corporation
    Inventors: Hiroshi Yoshida, Makoto Fukushima, Hozumi Yasuda
  • Publication number: 20160176009
    Abstract: A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Hiroshi YOSHIDA, Makoto FUKUSHIMA, Hozumi YASUDA
  • Publication number: 20160074989
    Abstract: A polishing apparatus capable of eliminating a variation in film thickness along a circumferential direction of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a polishing head including an elastic membrane for pressing the substrate against the polishing surface and a retainer ring arranged so as to surround the substrate, the retainer ring being capable of contacting the polishing surface; a rotating mechanism configured to rotate the polishing head about its own axis; a rotation angle detector configured to detect a rotation angle of the polishing head; and a polishing controller configured to periodically change a polishing condition of the substrate in synchronization with the rotation angle of the polishing head.
    Type: Application
    Filed: September 15, 2015
    Publication date: March 17, 2016
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI
  • Patent number: D766849
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: September 20, 2016
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D769200
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: October 18, 2016
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D770990
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: November 8, 2016
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D793976
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 8, 2017
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki