Abstract: An electrically controllable viewing angle switch device is provided with a first substrate, a second substrate, a liquid crystal layer, multiple spacers, and multiple light-shielding patterns. The first substrate and the second substrate are overlapped with each other. The liquid crystal layer and the multiple spacers are disposed between the first substrate and the second substrate. The multiple light-shielding patterns are disposed on the second substrate. The orthographic projection area of each spacer on the second substrate is less than or equal to the orthographic projection area of each light-shielding pattern on the second substrate. The orthographic projection of each spacer on the second substrate is located within the orthographic projection of each light-shielding pattern on the second substrate. A display apparatus using an electrically controllable viewing angle switch device is also provided, in which light leakage near the spacer is extremely slight.

Abstract: A method for measuring a thickness of a thin film layer disposed on a piece of glass is implemented using a computer device that stores a thin film image of the thin film layer, a surface dataset associated with a surface of the thin film layer, and a plurality of reference parameter sets each being associated with a specific thickness of the thin film layer, the method including: generating a spectral image dataset that includes spectral data associated with different pixels of the thin film image using a spectral transformation matrix; performing regression analysis on the surface dataset and the spectral image dataset, so as to obtain a thickness parameter set including a plurality of thickness parameters; and determining a thickness of the thin film layer using the thickness parameter set and the plurality of reference parameter sets.

Abstract: An electronic device including a substrate and a pixel circuit is provided. The substrate includes an active area and a peripheral area. The peripheral area is adjacent to the active area. The pixel circuit is disposed in the active area on the substrate. The pixel circuit includes an amplifier circuit and a tunable element. The amplifier circuit includes a non-inverting input terminal, an inverting input terminal, and an output terminal. The output terminal is electrically connected to the inverting input terminal, so that the amplifier circuit is a negative feedback circuit. The tunable element is electrically connected to the output terminal of the amplifier circuit.

Abstract: A method includes forming a transistor over a front side of a substrate, in which the transistor comprises a channel region, a gate region over the channel region, and source/drain regions on opposite sides of the gate region; forming a front-side interconnect structure over the transistor, wherein the front-side interconnect structure includes a dielectric layer and conductive features; and bonding the front-side interconnect structure to a carrier substrate via a bonding layer, in which the bonding layer is between the front-side interconnect structure and the carrier substrate, and the bonding layer has a higher thermal conductivity than the dielectric layer of the front-side interconnect structure.

Abstract: An electronic circuit is provided. The electronic circuit includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first compensation transistor, and a second compensation transistor. The first compensation transistor includes a first terminal, a second terminal, and a third terminal. The first terminal of the first compensation transistor is coupled to the second terminal of the first compensation transistor and a first connection node between the first transistor and the second transistor. The third terminal of the first compensation transistor receives one of a scan signal and a reset signal. The second compensation transistor includes a first terminal, a second terminal, and a third terminal. The second terminal of the second compensation transistor is coupled to a second connection node between the third transistor and the fourth transistor. The third terminal of the second compensation transistor receives a reference low voltage signal.

Abstract: A coffee bean grinder is provided, comprising a housing assembly, a shaft component, and a securing member. The shaft component is assembled in the housing assembly. When a coffee bean grinding complex is formed by an inner grinding member of the shaft component and an outer grinding member of the housing assembly, the shaft component and the housing assembly can be easily assembled and secured through the structural configuration of the securing member, and also through which, the shaft component and the housing assembly can also be disassembled for cleaning and maintenance after grinding operation.

Abstract: A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.

Abstract: Etching composition suitable for etching titanium nitride and molybdenum from a microelectronic device, which includes, consists essentially of, or consists of, in effective amounts: water; HNO3; optionally, at least one chloride ion source selected from the group of NH4Cl and HCl; a base selected from the group of an alkanolamine, NH4OH, a quaternary ammonium hydroxide, and mixtures thereof; optionally, at least one fluoride ion source; optionally, at least one heteroaromatic compound; and optionally, at least one water-miscible solvent selected from the group of diethylene glycol butyl ether, sulfolane, and propylene carbonate.

Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.

Abstract: In some embodiments, a keyboard key structure includes: a substrate; a key switch, which includes a top housing, a bottom housing. and a key stem. The top housing covers the key stem and is coupled to the bottom housing to form a cavity. The bottom housing is coupled to the substrate. The keyboard key structure further include a keycap including a light transmissive region, the keycap being configured to be coupled to the top housing of the key switch; and a light guide coupled to one side of the cavity of the key switch, the light guide comprising: a flat bottom surface; and a flat top surface wider than and parallel to the bottom surface. The top surface includes uncontinuous, trapezoidal-shaped Fresnel structures at end portions at both ends thereof. A light emitting element is coupled to the substrate and disposed under the bottom surface.

Abstract: A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.

Abstract: An infusion liquid heating and flow-velocity-monitoring system for clinical use is provided. The system includes a dynamic heating module, a measurement and analysis module for average velocity in infusion tubes, a velocity adjustment module, an alarming and automatic clipping module, a mobile-phone-computer remote monitoring module, an operable shared module, and a micro control module. A method of determining average velocity on a cross section of a tube according to a solution to Fourier series in a dynamic thermal dispersion equation of a steady flow in the tube is provided. Moreover, functions including monitoring infusion rate, automatic heating, monitoring whether infusion fluid in the infusion tube is empty, and automatic clipping and closing of the tube for preventing blood backflow, etc. are achieved. Lastly, specific applications developed which is connected with mobile phones by 5G network, Bluetooth and WIFI are used to display status of the infusion fluid.

Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.

Abstract: A coffee bean grinder is provided, comprising a housing assembly, a shaft component, and a securing member. The shaft component is assembled in the housing assembly. When a coffee bean grinding complex is formed by an inner grinding member of the shaft component and an outer grinding member of the housing assembly, the shaft component and the housing assembly can be easily assembled and secured through the structural configuration of the securing member, and also through which, the shaft component and the housing assembly can also be disassembled for cleaning and maintenance after grinding operation.

Abstract: A method for fabricating a semiconductor device is provided. The method includes forming an alignment mark in a material layer, wherein the alignment mark has a step sidewall in the material layer, and the step sidewall of the alignment mark has a floor surface portion; forming a feature material over the material layer; and performing a planarization process at least on the feature material, wherein the planarization process stops at a level higher than the floor surface portion of the step sidewall of the alignment mark.

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

Abstract: A nebulizer includes a main body (1), a spraying head (2) and an engagement structure (4). The main body (1) includes a body (11). The spraying head (2) includes a spraying seat (21) assembled to the body (11). The engagement structure (4) includes a notch (41) formed on one of the body (11) and the spraying seat (21), a T-shaped trench (42) formed on an inner wall of the notch (41), an engaging trench (43) formed on another one of the body (11) and the spraying seat (21), and a movable member (44) received in the notch (41). The movable member (44) is extended with a handle (441) exposed from the notch (41), a T-shaped block (442) slidably received in the T-shaped trench (42) and an engaging block (443) embedded in or separated from the engaging trench (43).