Abstract: The present application provides a display panel comprising a substrate, a light-emitting device disposed on the substrate, a first inorganic layer and a second inorganic layer sequentially covering the light-emitting device; wherein the density of the second inorganic layer is larger than that of the first inorganic layer, so as to improve the barrier properties against water and oxygen of the display panel. The present application further provides a manufacturing method of a display panel. The encapsulation for the display panel can be improved in the present application.

Abstract: The present application provides a display panel comprising a substrate, a light-emitting device disposed on the substrate, a first inorganic layer and a second inorganic layer sequentially covering the light-emitting device; wherein the density of the second inorganic layer is larger than that of the first inorganic layer, so as to improve the barrier properties against water and oxygen of the display panel. The present application further provides a manufacturing method of a display panel. The encapsulation for the display panel can be improved in the present application.

Abstract: A flexible organic light emitting diode display and a manufacturing method thereof are provided. The manufacturing method includes steps of forming an active array layer and a photoresist layer sequentially on a flexible substrate, patterning the photoresist layer to form a plurality of pixel units, forming a light emitting main layer between two of the pixel units adjacent to each other, removing the pixel units with an organic solvent, forming a conductive transport layer on the light emitting main layer, and forming an encapsulation layer on the conductive transport layer.

Abstract: The present disclosure discloses an organic light-emitting diode package, a display panel and a method for manufacturing the same. The method may include: providing a substrate comprising a baseplate, a pixel-defining layer disposed on the baseplate and a light-emitting layer disposed in an opening of the pixel-defining layer, wherein the light-emitting layer comprises an organic light-emitting diode; forming a first inorganic layer on the substrate; preparing an ultraviolet absorbing layer on the first inorganic layer; and forming a planarization layer and a second inorganic layer in sequence on the ultraviolet absorbing layer. The implementation of the present disclosure may effectively reduce the damage from external ultraviolet light to the organic light-emitting diode.

Abstract: The present invention relates to a flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same. The present invention includes a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldisiloxane which is an organic material to form the first retaining wall. The hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not mutually dissolve when contacted. The feature can greatly reduce the thickness of the at least one retaining wall. While ensuring that the flexible panel display region is shielded from external water oxygen, covering the particle contaminant of the flexible panel, buffering the stress during bending and folding, and the present invention has more simplified and more reliable features.

Abstract: The disclosure discloses an inorganic film applied for thin film encapsulation of an OLED device. The inorganic film includes inorganic layer units including a first inorganic layer, a second inorganic layer, and a third inorganic layer located between the first inorganic layer and the second inorganic layer, and the third inorganic layer is formed by reacting the first inorganic layer with the second inorganic layer. The inorganic film is used in the thin film encapsulation of the OLED device, which can improve the ability of the device to block the water and oxygen and improve the product quality.

Abstract: A flexible panel is provided. The flexible panel includes a substrate, an organic light-emitting diode device, a thin-film encapsulation layer and a retaining wall. Wherein the organic light-emitting diode device is formed on the substrate, the thin-film encapsulation layer is formed on the substrate and covers the organic light-emitting diode device, the retaining wall is disposed on the substrate and is around an outside of the organic light-emitting diode device. Wherein the first portion is closer to a light-emitting region of the flexible panel than the second portion. A manufacturing method for the flexible panel and a display device using the flexible panel are also disclosed.

Abstract: The present invention relates to a flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same. The present invention includes a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldisiloxane which is an organic material to form the first retaining wall. The hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not mutually dissolve when contacted. The feature can greatly reduce the thickness of the at least one retaining wall. While ensuring that the flexible panel display region is shielded from external water oxygen, covering the particle contaminant of the flexible panel, buffering the stress during bending and folding, and the present invention has more simplified and more reliable features.

Abstract: The present invention relates to a flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same. The present invention includes a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldisiloxane which is an organic material to form the first retaining wall. The hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not mutually dissolve when contacted. The feature can greatly reduce the thickness of the at least one retaining wall. While ensuring that the flexible panel display region is shielded from external water oxygen, covering the particle contaminant of the flexible panel, buffering the stress during bending and folding, and the present invention has more simplified and more reliable features.

Abstract: An OLED thin film encapsulation structure and a method of fabricating the same are provided. The OLED thin film encapsulation structure has: a substrate, a first organic layer disposed on the substrate; a first inorganic layer which is a hydrophobic layer; a second organic layer; a second inorganic layer which is disposed on the first inorganic layer and the second organic layer, and is a hydrophobic layer; and a plurality of first protrusions disposed with intervals on the first organic layer and/or the second organic layer.

Abstract: A flexible OLED display panel is disclosed and includes an encapsulation structure. The encapsulation structure includes: a first inorganic thin film formed on a surface of an OLED display layer and a surrounding region of the surface; a first organic thin film formed on a surface of the first inorganic thin film; and a plurality of dams. Each of the dams has a first sub-dam close to the first inorganic thin film and a second sub-dam away from the first inorganic thin film. A gap is formed between the first sub-dam and the second sub-dam which are located at a same side. The gap is filled with desiccant.

Abstract: The disclosure discloses an inorganic film applied for thin film encapsulation of an OLED device. The inorganic film includes inorganic layer units including a first inorganic layer, a second inorganic layer, and a third inorganic layer located between the first inorganic layer and the second inorganic layer, and the third inorganic layer is formed by reacting the first inorganic layer with the second inorganic layer. The inorganic film is used in the thin film encapsulation of the OLED device, which can improve the ability of the device to block the water and oxygen and improve the product quality.

Abstract: The present disclosure discloses a full color display device and a manufacturing method thereof. The full color display device includes a first electrode layer formed on a first substrate; an light emitting layer formed on the first electrode layer, wherein the light emitting layer includes a first light emitting layer and a second light emitting layer disposed at intervals, the first light emitting layer includes luminescent materials of a first color and a second color, the second light emitting layer includes a luminescent material of a third color, and the first color, the second color, and the third color constitute three primary colors; a second electrode layer formed on the light emitting layer; and a color filter layer formed on the second electrode layer at a position corresponding to the first light emitting layer. The present disclosure can realize full color display and improve the display rate of the panel.

Abstract: This application discloses a display panel and a manufacturing method thereof and a display device. The display panel comprises a first substrate and a second substrate disposed opposite to each other, a first display element is disposed at a side of the first substrate that is close to the second substrate, a second display element is disposed at a side of the second substrate that is close to the first substrate, and both of a light-exiting surface of the first display element and a light-exiting surface of the second display element are towards the second substrate. Sub-pixels of the first display element and sub-pixels of the second display element are disposed in a staggered manner, and regions in the second display element that correspond to the sub-pixels of the first display element are light transmissive regions.

Abstract: The present disclosure relates to the field of liquid crystal display technology, and more particularly, to the flexible display panel and the manufacturing method thereof. The method includes forming the polymer on the anode layer from vapor of the organic dimer as the micro-cavity adjusting layer by the chemical vapor deposition method at the controlled temperature between 650° C. to 750° C. The structural formula of the organic dimer is as shown in Formula 1, wherein R is selected from one of H, F, Cl, and Br. The cathodic protective layer and the encapsulation layer can be formed by the same material and processes. The present disclosure discloses preparing the micro-cavity adjustment layer, the cathodic protective layer, and the encapsulation layer of the flexible OLED with the same material, which can simplify the preparation processes.

Abstract: The present disclosure discloses an organic light-emitting diode package, a display panel and a method for manufacturing the same. The method may include: providing a substrate comprising a baseplate, a pixel-defining layer disposed on the baseplate and a light-emitting layer disposed in an opening of the pixel-defining layer, wherein the light-emitting layer comprises an organic light-emitting diode; forming a first inorganic layer on the substrate; preparing an ultraviolet absorbing layer on the first inorganic layer; and forming a planarization layer and a second inorganic layer in sequence on the ultraviolet absorbing layer. The implementation of the present disclosure may effectively reduce the damage from external ultraviolet light to the organic light-emitting diode.

Abstract: A flexible panel is provided. The flexible panel includes a substrate, an organic light-emitting diode device, a thin-film encapsulation layer and a retaining wall. Wherein the organic light-emitting diode device is formed on the substrate, the thin-film encapsulation layer is formed on the substrate and covers the organic light-emitting diode device, the retaining wall is disposed on the substrate and is around an outside of the organic light-emitting diode device. Wherein the first portion is closer to a light-emitting region of the flexible panel than the second portion. A manufacturing method for the flexible panel and a display device using the flexible panel are also disclosed.

Abstract: The present disclosure discloses an organic light emitting diode package structure and its method of manufacturing, and a display device. The method of manufacturing includes: preparing an inorganic substrate comprising a hydroxyl group; preparing a first atomic transition layer on the inorganic substrate; coating a first organic layer on the first atomic transition layer, the first organic layer is formed by mixing two epoxy resin monomers; and curing the first organic layer so that the first organic layer is chemically bonded to the inorganic substrate through the first atomic transition layer. In the above manner, the present disclosure can increase the adhesion between the organic layer and the inorganic layer and prevent the display device from package failure caused by peeling between the package layers during bending or folding.

Abstract: The present disclosure discloses an organic light emitting diode package structure and its method of manufacturing, and a display device. The method of manufacturing includes: preparing an inorganic substrate comprising a hydroxyl group; preparing a first atomic transition layer on the inorganic substrate; coating a first organic layer on the first atomic transition layer, the first organic layer is formed by mixing two epoxy resin monomers; and curing the first organic layer so that the first organic layer is chemically bonded to the inorganic substrate through the first atomic transition layer. In the above manner, the present disclosure can increase the adhesion between the organic layer and the inorganic layer and prevent the display device from package failure caused by peeling between the package layers during bending or folding.

Abstract: The present invention relates to a flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same. The present invention includes a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldisiloxane which is an organic material to form the first retaining wall. The hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not mutually dissolve when contacted. The feature can greatly reduce the thickness of the at least one retaining wall. While ensuring that the flexible panel display region is shielded from external water oxygen, covering the particle contaminant of the flexible panel, buffering the stress during bending and folding, and the present invention has more simplified and more reliable features.