Abstract: During semiconductor wafer inspection, an image of a semiconductor wafer is divided into segments. A standard deviation for each of the segments is determined using a difference image. A threshold is then applied to each of the segments. The threshold can be a multiple of the standard deviation. Pixels in the image that include a defect are determined after applying the threshold. The pixels outside the threshold are then labeled as defects-of-interest using the processor.

Abstract: An image outputting method and an electronic device are provided. The method includes: shooting a scene by using a plurality of different exposure durations to obtain a plurality of images respectively; performing a summation operation according to the images to obtain a first image; adjusting a first brightness of the first image to an output brightness to generate a second image; respectively converting pixel values of a plurality of first pixels in the second image into other corresponding pixel values in another value domain to generate an output image; and outputting the output image.

Abstract: An image outputting method and an electronic device are provided. The method includes: shooting a scene by using a plurality of different exposure durations to obtain a plurality of images respectively; performing a summation operation according to the images to obtain a first image; adjusting a first brightness of the first image to an output brightness to generate a second image; respectively converting pixel values of a plurality of first pixels in the second image into other corresponding pixel values in another value domain to generate an output image; and outputting the output image.