Patents by Inventor Hsin-Hua Hu

Hsin-Hua Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11101405
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 24, 2021
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Publication number: 20210257350
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Application
    Filed: March 2, 2021
    Publication date: August 19, 2021
    Inventor: Hsin-Hua Hu
  • Patent number: 11011390
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: May 18, 2021
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Patent number: 10950591
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: March 16, 2021
    Assignee: Apple Inc.
    Inventor: Hsin-Hua Hu
  • Publication number: 20210050337
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: October 16, 2020
    Publication date: February 18, 2021
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20210028153
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: August 20, 2020
    Publication date: January 28, 2021
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10833058
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: November 10, 2020
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10784236
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: September 22, 2020
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20200258875
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 13, 2020
    Inventor: Hsin-Hua Hu
  • Publication number: 20200251614
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 6, 2020
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Publication number: 20200219840
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: March 4, 2020
    Publication date: July 9, 2020
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10665578
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: May 26, 2020
    Inventors: Edzer Huitema, Vaibhav Patel, Tore Nauta, Xia Li, Hsin-Hua Hu
  • Patent number: 10607961
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 31, 2020
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Publication number: 20200091127
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10593832
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: March 17, 2020
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Patent number: 10546796
    Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: January 28, 2020
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Jaein Choi, James E. Pedder, Ion Bita, Hairong Tang, Chin Wei Hsu, Sandeep Chalasani, Chih-Lei Chen, Sunggu Kang, Shinya Ono, Jung Yen Huang, Lun Tsai
  • Patent number: 10510736
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: December 17, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20190371623
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 5, 2019
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Patent number: 10497682
    Abstract: Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: December 3, 2019
    Assignee: Apple Inc.
    Inventors: Imran Hashim, Vaibhav D. Patel, Hsin-Hua Hu, Kapil V. Sakariya, Ralph E. Kauffman
  • Patent number: 10483253
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: November 19, 2019
    Assignee: Apple Inc.
    Inventor: Hsin-Hua Hu