Patents by Inventor Hsin-Hung Chou

Hsin-Hung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220346018
    Abstract: A method for a UE to monitor a PDCCH comprises receiving a first configuration from a base station to configure the UE with a first search space of the PDCCH, where the first search space is used for monitoring a scheduling signal used for indicating scheduling information, receiving a second configuration from the base station to configure the UE with a second search space of the PDCCH, wherein the second search space is used for monitoring a power saving signal used for indicating wake-up information associated with a DRX functionality, monitoring the first search space in response to the UE being in a DRX active time of the DRX functionality, wherein the DRX active time is a time during which the UE monitors the PDCCH, and not monitoring the second search space in response to the UE being in the DRX active time of the DRX functionality.
    Type: Application
    Filed: May 12, 2022
    Publication date: October 27, 2022
    Inventors: Hsin-Hsi Tsai, Chia-Hung Wei, Chie-Ming Chou
  • Patent number: 11476981
    Abstract: A method for wireless communication performed by a user equipment (UE) is provided. The method includes: receiving, from a base station (BS), a radio resource control (RRC) message that includes a first configuration indicating a first parameter associated with a first bandwidth part (BWP) and a second configuration indicating a second parameter associated with a second BWP; receiving, from the BS, downlink control information (DCI) having a DCI format, the DCI indicating either a data reception or a data transmission on a BWP, and the DCI including a field indicating a hybrid automatic repeat request (HARQ) process number to be applied by the UE for the data reception or the data transmission; determining whether a bit length of the field is fixed or variable according to the DCI format; and in a case that the bit length of the field is variable, determining the bit length of the field according to one of the first parameter and the second parameter that is associated with the BWP.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: October 18, 2022
    Assignee: Hannibal IP LLC
    Inventors: Chia-Hung Wei, Hsin-Hsi Tsai, Chie-Ming Chou
  • Publication number: 20220310894
    Abstract: The disclosure provides a light emitting diode structure, including a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer, a semiconductor contacting layer, a first conductive layer and a second conductive layer. The first semiconductor layer is disposed on the substrate. The first semiconductor includes a first thickness structure and a second thickness structure, in which the first thickness structure is thicker than the second thickness structure. The light emitting layer is disposed on the first thickness structure. The second semiconductor layer is disposed on the light emitting layer The semiconductor contacting layer is disposed on the second thickness structure, in which the vertical projections of the semiconductor contacting layer and the light emitting layer on the substrate don't overlap nor contact. A doping type of the semiconductor contacting layer is the same as the first semiconductor layer.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 29, 2022
    Inventors: Hsin-Chuan WANG, Tzong-Liang TSAI, Hsiu-Mei CHOU, Chin-Hung LUO
  • Publication number: 20220303904
    Abstract: A method for a UE for performing a dormant operation is provided. The method includes receiving, from a BS, an RRC configuration indicating a set of one or more dormancy cell groups, wherein a group of serving cells belongs to a specific dormancy cell group in the set of one or more dormancy cell groups; receiving, from the BS, a signal including a bitmap, each bit of the bitmap being associated with a respective dormancy cell group in the set of one or more dormancy cell groups; and switching, based on a bit in the bitmap that is associated with the specific dormancy cell group, active BWPs of all serving cells included in the group of serving cells to a dormant BWP or to a non-dormant BWP.
    Type: Application
    Filed: June 10, 2022
    Publication date: September 22, 2022
    Inventors: HSIN-HSI TSAI, CHIA-HUNG WEI, YU-HSIN CHENG, WAN-CHEN LIN, CHIE-MING CHOU
  • Patent number: 11443095
    Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Shuo Liu, Chih-Chun Hsia, Hsin Ting Chou, Kuanhua Su, William Weilun Hong, Chih Hung Chen, Kei-Wei Chen
  • Publication number: 20220264545
    Abstract: A method performed by a UE for repetition transmissions is provided. The method includes receiving DCI scheduling an uplink transmission; identifying a DCI format of the DCI; selecting, from a plurality of sets of preconfigured values, a set of preconfigured values that is mapped to the DCI format; and determining a number of times the uplink transmission is required to be repeated from the selected set of preconfigured values. A UE applying the same method is also provided.
    Type: Application
    Filed: May 6, 2022
    Publication date: August 18, 2022
    Applicants: FG Innovation Company Limited, FG Innovation Company Limited
    Inventors: CHIA-HUNG WEI, HENG-LI CHIN, HSIN-HSI TSAI, CHIE-MING CHOU
  • Patent number: 11405868
    Abstract: A method performed by a User Equipment (UE) for power saving operations includes the UE receiving a first Radio Resource Control (RRC) configuration indicating at least one dormancy cell group, receiving a second RRC configuration indicating a first Bandwidth Part (BWP), on which the UE is configured with a dormant operation, for a serving cell, receiving a third RRC configuration indicating a second BWP, on which the UE is not configured with the dormant operation, for the serving cell, receiving a Power Saving Signal (PSS) including a bitmap, determining an active BWP of the serving cell as the first BWP after determining that a bit associated with the dormancy cell group in the bitmap is set to a first value, and determining the active BWP of the serving cell as the second BWP after determining that the bit is set to a second value.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: August 2, 2022
    Assignee: FG Innovation Company Limited
    Inventors: Hsin-Hsi Tsai, Chia-Hung Wei, Yu-Hsin Cheng, Wan-Chen Lin, Chie-Ming Chou
  • Publication number: 20220224378
    Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Inventors: TZU-YU LIN, SHANG-HO TSAI, YU-HENG YOU, HSIN-HUNG CHOU, WEI-HAN HSIAO
  • Patent number: 11335568
    Abstract: A method for forming a semiconductor structure is provided. The method includes: forming first and second hard mask layers and a target layer on a substrate; patterning the second hard mask layer to form patterned second hard masks including a second wide mask and second narrow masks; and forming spacers on sidewalls of the second wide mask and the second narrow masks. Then, a photoresist layer is formed to cover the second wide mask and the spacers on the sidewalls of the second wide mask. The second narrow masks and the photoresist layer are removed. And, the first hard mask layer is etched with the spacers and the second wide mask together as a mask to form patterned first hard masks on the target layer, wherein the spacers define a first line width, and the second wide mask and the pair of spacers define a second line width.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 17, 2022
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Ting-Wei Wu, Cheng-Ta Yang, Hsin-Hung Chou
  • Publication number: 20220149905
    Abstract: A method and a system for processing uplink signals in cloud radio access networks are disclosed The system comprising a baseband unit and a number of remote radio heads. The baseband unit and the remote radio heads are connected through fronthaul links. When one remote radio head receives a signal transmitted from a user equipment, the remote radio head first encodes the received signal according to a post-coding matrix, then quantizes the encoded signal according to a number of quantization bits allocated to the user equipment, and finally transmits the quantized signal to the baseband unit.
    Type: Application
    Filed: November 4, 2021
    Publication date: May 12, 2022
    Inventors: XIANG-QUAN SER, CHI-CHEN WANG, SHANG-HO TSAI, HSIN-HUNG CHOU, WEI-HAN HSIAO
  • Patent number: 11329700
    Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: May 10, 2022
    Assignee: HON LIN TECHNOLOGY CO., LTD.
    Inventors: Tzu-Yu Lin, Shang-Ho Tsai, Yu-Heng You, Hsin-Hung Chou, Wei-Han Hsiao
  • Patent number: 11322438
    Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 3, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Chun-Hung Lin
  • Publication number: 20220108894
    Abstract: A method for forming a semiconductor memory structure includes sequentially forming an active layer, a hard mask layer and a core layer over a substrate, and etching the core layer to form a core pattern. The core pattern includes a first strip, a second strip, and a plurality of supporting features abutting the first and second strips. The method also includes forming a spacer layer alongside the core pattern, removing the core pattern, forming a photoresist pattern above the spacer layer, etching the hard mask layer using the photoresist pattern and the spacer layer to form a hard mask pattern, and transferring the hard mask pattern into the active layer to form a gate stack.
    Type: Application
    Filed: September 21, 2021
    Publication date: April 7, 2022
    Inventors: Hsin-Hung CHOU, Tsung-Wei LIN, Kao-Tsair TSAI
  • Publication number: 20220077051
    Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Applicant: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Chun-Hung Lin
  • Publication number: 20210358764
    Abstract: A method for forming a semiconductor structure is provided. The method includes: forming first and second hard mask layers and a target layer on a substrate; patterning the second hard mask layer to form patterned second hard masks including a second wide mask and second narrow masks; and forming spacers on sidewalls of the second wide mask and the second narrow masks. Then, a photoresist layer is formed to cover the second wide mask and the spacers on the sidewalls of the second wide mask. The second narrow masks and the photoresist layer are removed. And, the first hard mask layer is etched with the spacers and the second wide mask together as a mask to form patterned first hard masks on the target layer, wherein the spacers define a first line width, and the second wide mask and the pair of spacers define a second line width.
    Type: Application
    Filed: May 12, 2020
    Publication date: November 18, 2021
    Inventors: Ting-Wei WU, Cheng-Ta YANG, Hsin-Hung CHOU
  • Patent number: 11063010
    Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: July 13, 2021
    Assignee: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Jin-Neng Wu, Hsin-Hung Chou, Chun-Hung Lin
  • Publication number: 20210126675
    Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.
    Type: Application
    Filed: September 25, 2020
    Publication date: April 29, 2021
    Inventors: TZU-YU LIN, SHANG-HO TSAI, YU-HENG YOU, HSIN-HUNG CHOU, WEI-HAN HSIAO
  • Publication number: 20200350268
    Abstract: A wire bonding structure and a method of manufacturing the same are provided. The wire bonding structure includes a bonding pad structure, a protection layer and a bonding wire. The bonding pad structure includes a bonding pad and a conductive layer. The bonding pad has an opening. The conductive layer is electrically connected to the bonding pad. At least a portion of the conductive layer is located in the opening of the bonding pad and laterally surrounded by the bonding pad. The protection layer at least covers a portion of a surface of the bonding pad structure. The bonding wire is bonded to the conductive layer of the bonding pad structure.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 5, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Jin-Neng Wu, Chun-Hung Lin, Hsin-Hung Chou
  • Patent number: 10818497
    Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: October 27, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Ming-Chih Tsai
  • Publication number: 20200251434
    Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 6, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Jin-Neng Wu, Hsin-Hung Chou, Chun-Hung Lin