Abstract: A method for thinning a wafer is provided. The method includes placing a wafer on a support assembly, and the support assembly includes a plurality of pin. The method includes securing an etching mask to a backside of the wafer, and the etching mask has an extending portion which covers a peripheral portion of the wafer. The etching mask has a plurality of circular bores extended along a vertical direction, and the etching mask is secured to the support assembly by connecting the circular bores and the pins. The method also includes performing a wet etching process on the backside of the wafer to foil a thinned wafer, wherein the thinned wafer has a peripheral portion with a first thickness and a central portion having a second thickness smaller than the first thickness.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, and a redistribution structure. The semiconductor device includes a chamfer disposed on one of a plurality of side surfaces of the semiconductor device. The encapsulating material encapsulates the semiconductor device. The redistribution structure is disposed over the encapsulating material and electrically connected to the semiconductor device.

Abstract: Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Abstract: A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.

Abstract: A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.

Abstract: A semiconductor package structure includes a molding compound, a micro pin extending through the molding compound, and a die surrounded by the molding compound. The micro pin has a top surface, a bottom surface, and a sidewall extending from the bottom surface to the top surface of the micro pin. The sidewall of the micro pin has a first portion and a second portion. The first portion of the sidewall is adjacent to the bottom surface of the micro pin and free of the molding compound. The second portion of the sidewall is adjacent to the top surface of the micro pin and in contact with the molding compound.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a first semiconductor die, at least one first conductive connector disposed beside the first semiconductor die and electrically coupled to the first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die and the at least one first conductive connector, and a redistribution structure disposed on the insulating encapsulation and being in contact with the first semiconductor die and the at least one first conductive connector. A thickness of the at least one first conductive connector is less than a thickness of the insulating encapsulation.

Abstract: A method for thinning a wafer is provided. The method includes placing a wafer on a support assembly, and the support assembly includes a plurality of pin. The method includes securing an etching mask to a backside of the wafer, and the etching mask has an extending portion which covers a peripheral portion of the wafer. The etching mask has a plurality of circular bores extended along a vertical direction, and the etching mask is secured to the support assembly by connecting the circular bores and the pins. The method also includes performing a wet etching process on the backside of the wafer to foil a thinned wafer, wherein the thinned wafer has a peripheral portion with a first thickness and a central portion having a second thickness smaller than the first thickness.

Abstract: A semiconductor package structure includes a molding compound, a micro pin extending through the molding compound, and a die surrounded by the molding compound. The micro pin has a top surface, a bottom surface, and a sidewall extending from the bottom surface to the top surface of the micro pin. The sidewall of the micro pin has a first portion and a second portion. The first portion of the sidewall is adjacent to the bottom surface of the micro pin and free of the molding compound. The second portion of the sidewall is adjacent to the top surface of the micro pin and in contact with the molding compound.

Abstract: A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.

Abstract: A semiconductor device includes a carrier having a first central axis extending along a first direction and a second central axis extending along a second direction, a plurality of dies disposed on a surface of the carrier, and a plurality of scribing lines separating the plurality of dies from each other. The plurality of scribing lines include a plurality of continuous lines along the first direction and a plurality of discontinuous lines along the second direction, at least one of the plurality of continuous lines overlaps the first central axis, at least one of the plurality of discontinuous lines overlaps the second central axis. The plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.

Abstract: A method for thinning a wafer is provided. The method includes placing a wafer on a support assembly and securing an etching mask to a backside of the wafer. The etching mask covers a peripheral portion of the wafer. The method further includes performing a wet etching process on the backside of the wafer to form a thinned wafer, and the thinned wafer includes peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. A system for forming the thinned wafer is also provided.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, and a redistribution structure. The semiconductor device includes a chamfer disposed on one of a plurality of side surfaces of the semiconductor device. The encapsulating material encapsulates the semiconductor device. The redistribution structure is disposed over the encapsulating material and electrically connected to the semiconductor device.

Abstract: A semiconductor package includes a carrier, at least and adhesive portion, a plurality of micro pins and a die. The carrier has a first surface and second surface opposite to the first surface. The adhesive portion is disposed on the first surface, and the plurality of the micro pins is disposed in the adhesive portions. The die is disposed on the remaining adhesive portion free of the micro pins.

Abstract: Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a first semiconductor die, at least one first conductive connector disposed beside the first semiconductor die and electrically coupled to the first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die and the at least one first conductive connector, and a redistribution structure disposed on the insulating encapsulation and being in contact with the first semiconductor die and the at least one first conductive connector. A thickness of the at least one first conductive connector is less than a thickness of the insulating encapsulation.

Abstract: A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

Abstract: Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

Abstract: A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.

Abstract: A method for fabricating an integrated fan-out package is provided. The method includes the following steps. A plurality of conductive posts are placed in apertures of a substrate. A carrier having an adhesive thereon is provided. The conductive posts are transferred to the carrier in a standing orientation by adhering the conductive posts in the apertures to the adhesive. An integrated circuit component is mounted onto the adhesive having the conductive posts adhered thereon. An insulating encapsulation is formed to encapsulate the integrated circuit component and the conductive posts. A redistribution circuit structure is formed on the insulating encapsulation, the integrated circuit component, and the conductive posts, wherein the redistribution circuit structure is electrically connected to the integrated circuit component and the conductive posts. The carrier is removed. At least parts of the adhesive are removed (e.g. patterned or entirely removed) to expose surfaces of the conductive posts.