Patents by Inventor Hsin-Shu Peng

Hsin-Shu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120156583
    Abstract: A dual-material co-injection molded bipolar plate and its manufacturing method are disclosed, in which the manufacturing method comprises the steps of: injecting a skin polymer melt containing a first conductive material into a mold cavity of a bipolar plate mold; sequential or simultaneous injecting a core polymer melt containing a second conductive and the skin polymer melt into the mold cavity; molding a bipolar plate, being a sandwich structure having a core layer packed inside a skin layer, while enabling a conductive grid composed of the first conductive material and the second conductive material to be formed between the core layer and the skin layer for improving the through-plane conductivity of the bipolar plate.
    Type: Application
    Filed: May 9, 2011
    Publication date: June 21, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Shia-Chung Chen, Hsin-Shu Peng, Ming-Yi Shih