Patents by Inventor Hsueh Kuo Liao
Hsueh Kuo Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 10806046Abstract: A package structure of a power module is provided. The package structure includes a body having a sidewall, a first protruding structure protruding outward from one end of the sidewall, a second protruding structure protruding outward from another end of the sidewall and opposite to the first protruding structure, and a spring having two ends embedded in the first and the second protruding structures, respectively. The stress is transferred to the first and the second protruding structures via the spring, respectively. The equivalent stiffness of the spring is different from that of the body so that the package structure as a whole suffers the stress uniformly.Type: GrantFiled: October 22, 2019Date of Patent: October 13, 2020Assignee: Delta Electronics, Inc.Inventors: Shao-Chuan Chen, Hung-Yen Chan, Chuan-Chia Cheng, Hsueh-Kuo Liao, Kai-Ti Chang
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Publication number: 20200267867Abstract: A package structure of a power module is provided. The package structure includes a body having a sidewall, a first protruding structure protruding outward from one end of the sidewall, a second protruding structure protruding outward from another end of the sidewall and opposite to the first protruding structure, and a spring having two ends embedded in the first and the second protruding structures, respectively. The stress is transferred to the first and the second protruding structures via the spring, respectively. The equivalent stiffness of the spring is different from that of the body so that the package structure as a whole suffers the stress uniformly.Type: ApplicationFiled: October 22, 2019Publication date: August 20, 2020Inventors: Shao-Chuan CHEN, Hung-Yen CHAN, Chuan-Chia CHENG, Hsueh-Kuo LIAO, Kai-Ti CHANG
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Patent number: 9999145Abstract: A power module having a packaging structure includes a substrate having a first conductive area, a second conductive area, a third conductive area, a first fixing area and a second fixing area. The first, the second and the third conductive areas are electrically connected to a first terminal, a second terminal and a third terminal, and the first and the second fixing areas are electrically connected to a first switch set and a second switch set, so that they are in a parallel arrangement. The first terminal is a current input end, the second terminal is an intermediate end, and the third terminal is a current output end. When a current flows from the current input end to the intermediate end, or from the intermediate end to the current output end, the current flows straightly in order to reduce a crossover area and lower the stray inductance.Type: GrantFiled: August 9, 2016Date of Patent: June 12, 2018Assignee: DELTA ELECTRONICS, INC.Inventors: Wei-Hao Chi, Hsueh-Kuo Liao
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Publication number: 20170374755Abstract: A power module having a packaging structure includes a substrate having a first conductive area, a second conductive area, a third conductive area, a first fixing area and a second fixing area. The first, the second and the third conductive areas are electrically connected to a first terminal, a second terminal and a third terminal, and the first and the second fixing areas are electrically connected to a first switch set and a second switch set, so that they are in a parallel arrangement. The first terminal is a current input end, the second terminal is an intermediate end, and the third terminal is a current output end. When a current flows from the current input end to the intermediate end, or from the intermediate end to the current output end, the current flows straightly in order to reduce a crossover area and lower the stray inductance.Type: ApplicationFiled: August 9, 2016Publication date: December 28, 2017Inventors: Wei-Hao CHI, Hsueh-Kuo LIAO
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Patent number: 9848518Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.Type: GrantFiled: April 1, 2013Date of Patent: December 19, 2017Assignee: DELTA ELECTRONICS, INC.Inventors: Te-Wei Yuan, Hsueh-Kuo Liao, Yi-Kai Chou, Ming-Yuan Tsai, Wei-Hao Chi
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Patent number: 9698507Abstract: A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.Type: GrantFiled: January 21, 2016Date of Patent: July 4, 2017Assignee: DELTA ELECTRONICS, INC.Inventors: Kai-Ti Chang, Ching-Chi Yang, Hsueh-Kuo Liao, Chuna-Jia Cheng
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Publication number: 20160218454Abstract: A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.Type: ApplicationFiled: January 21, 2016Publication date: July 28, 2016Inventors: KAI-TI CHANG, CHING-CHI YANG, HSUEH-KUO LIAO, CHUNA-JIA CHENG
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Publication number: 20140198454Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.Type: ApplicationFiled: April 1, 2013Publication date: July 17, 2014Applicant: DELTA ELECTRONICS, INC.Inventors: Te-Wei YUAN, Hsueh-Kuo LIAO, Yi-Kai CHOU, Ming-Yuan TSAI, Wei-Hao CHI
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Patent number: 7999450Abstract: An electroluminescent module includes a module substrate, a thermal-conducting carrier substrate and a light-emitting element. The module substrate has an opening, a first surface and a first patterned electrode disposed on the first surface. The thermal-conducting carrier substrate has a carrying element and a second patterned electrode disposed on the carrying element. The carrying element is disposed opposite to the first surface of the module substrate, and the second patterned electrode is disposed facing to the first patterned electrode and electrically connected to the first patterned electrode. The light-emitting element is located at the opening and disposed on the thermal-conducting carrier substrate. The light-emitting element has a first electrode and a second electrode, both of which are respectively electrically connected to the corresponding portions of the second patterned electrode of the thermal-conducting carrier substrate.Type: GrantFiled: November 21, 2007Date of Patent: August 16, 2011Assignee: Delta Electronics, Inc.Inventors: Ching-Chuan Shiue, Hsueh-Kuo Liao, Huang-Kun Chen
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Patent number: 7897988Abstract: An electroluminescent device includes a conduction substrate, a reflection layer, a patterned transparent conduction layer, at least one light emitting diode (LED) element, a first contact electrode and a second contact electrode. The reflection layer is disposed on the conduction substrate, and the patterned transparent conduction layer is formed on the reflection layer. The LED element is formed on the patterned transparent conduction layer, and the LED element includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The second semiconductor layer is disposed on the patterned transparent conduction layer and the reflection layer. The first contact electrode is disposed at one side of the first semiconductor layer, and the second contact electrode is disposed at one side of the conduction substrate.Type: GrantFiled: May 27, 2009Date of Patent: March 1, 2011Assignee: Delta Electronics, Inc.Inventors: Shih-Peng Chen, Ching-Chuan Shiue, Hsueh-Kuo Liao, Chuan-Chia Cheng, Huang-Kun Chen
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Publication number: 20090294790Abstract: An electroluminescent device includes a conduction substrate, a reflection layer, a patterned transparent conduction layer, at least one light emitting diode (LED) element, a first contact electrode and a second contact electrode. The reflection layer is disposed on the conduction substrate, and the patterned transparent conduction layer is formed on the reflection layer. The LED element is formed on the patterned transparent conduction layer, and the LED element includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The second semiconductor layer is disposed on the patterned transparent conduction layer and the reflection layer. The first contact electrode is disposed at one side of the first semiconductor layer, and the second contact electrode is disposed at one side of the conduction substrate.Type: ApplicationFiled: May 27, 2009Publication date: December 3, 2009Inventors: Shih-Peng CHEN, Ching-Chuan Shiue, Hsueh-Kuo Liao, Chuan-Chia Cheng, Huang-Kun Chen
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Patent number: 7625769Abstract: An electroluminescent device includes a conduction substrate, a reflection layer, a patterned transparent conduction layer, at least one light emitting diode (LED) element, a first contact electrode and a second contact electrode. The reflection layer is disposed on the conduction substrate, and the patterned transparent conduction layer is formed on the reflection layer. The LED element is formed on the patterned transparent conduction layer, and the LED element includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The second semiconductor layer is disposed on the patterned transparent conduction layer and the reflection layer. The first contact electrode is disposed at one side of the first semiconductor layer, and the second contact electrode is disposed at one side of the conduction substrate.Type: GrantFiled: November 16, 2007Date of Patent: December 1, 2009Assignee: Delta Electronics, Inc.Inventors: Shih-Peng Chen, Ching-Chuan Shiue, Hsueh-Kuo Liao, Chuan-Chia Cheng, Huang-Kun Chen
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Patent number: 7528472Abstract: A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.Type: GrantFiled: November 17, 2005Date of Patent: May 5, 2009Assignee: Delta Electronics, Inc.Inventors: Hsueh-Kuo Liao, Hsin-Chang Tsai, Tai-Kang Shing
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Publication number: 20080143245Abstract: An electroluminescent module includes a module substrate, a thermal-conducting carrier substrate and a light-emitting element. The module substrate has an opening, a first surface and a first patterned electrode disposed on the first surface. The thermal-conducting carrier substrate has a carrying element and a second patterned electrode disposed on the carrying element. The carrying element is disposed opposite to the first surface of the module substrate, and the second patterned electrode is disposed facing to the first patterned electrode and electrically connected to the first patterned electrode. The light-emitting element is located at the opening and disposed on the thermal-conducting carrier substrate. The light-emitting element has a first electrode and a second electrode, both of which are respectively electrically connected to the corresponding portions of the second patterned electrode of the thermal-conducting carrier substrate.Type: ApplicationFiled: November 21, 2007Publication date: June 19, 2008Inventors: Ching-Chuan SHIUE, Hsueh-Kuo Liao, Huang-Kun Chen
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Publication number: 20080142824Abstract: An electroluminescent device includes a substrate, a reflection layer, a patterned transparent conductive layer, at least one LED element, a first contact electrode and a second contact electrode. The reflection layer is formed on the substrate. The patterned transparent conductive layer is disposed on the reflection layer. The LED element is formed on the patterned transparent conductive layer and includes a first semiconductor layer, an electroluminescent layer and a second semiconductor layer. The second semiconductor layer is disposed on the patterned transparent conductive layer and the reflection layer. The first contact electrode is electrically connected to the first semiconductor layer. The second contact electrode is electrically connected to the second semiconductor layer.Type: ApplicationFiled: November 16, 2007Publication date: June 19, 2008Inventors: Shih-Peng CHEN, Ching-Chuan Shiue, Hsueh-Kuo Liao, Chuan-Chia Cheng, Huang-Kun Chen
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Publication number: 20080142825Abstract: An electroluminescent device includes a conduction substrate, a reflection layer, a patterned transparent conduction layer, at least one light emitting diode (LED) element, a first contact electrode and a second contact electrode. The reflection layer is disposed on the conduction substrate, and the patterned transparent conduction layer is formed on the reflection layer. The LED element is formed on the patterned transparent conduction layer, and the LED element includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The second semiconductor layer is disposed on the patterned transparent conduction layer and the reflection layer. The first contact electrode is disposed at one side of the first semiconductor layer, and the second contact electrode is disposed at one side of the conduction substrate.Type: ApplicationFiled: November 16, 2007Publication date: June 19, 2008Inventors: Shih-Peng Chen, Ching-Chuan Shiue, Hsueh-Kuo Liao, Chuan-Chia Cheng, Huang-Kun Chen
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Publication number: 20080142826Abstract: An electroluminescent device includes a heat-conductive substrate, a heat-conductive adhering layer, a heat-conductive insulating layer, a reflective layer, a light-emitting diode element, a first contacting electrode and a second contacting electrode. The heat-conductive adhering layer is formed on the heat-conductive substrate. The heat-conductive insulating layer is formed on the heat-conductive adhering layer. The reflective layer is formed on the heat-conductive insulating layer. The light-emitting diode element is formed on the reflective layer, and a part of the reflective layer is exposed from the light-emitting diode element. The first contacting electrode is disposed on the light-emitting diode element. The second contacting electrode is disposed on the exposed reflective layer. A manufacturing method of the electroluminescent device is also disclosed.Type: ApplicationFiled: November 21, 2007Publication date: June 19, 2008Inventors: Chuan-Chia Cheng, Shih-Peng Chen, Hsueh-Kuo Liao, Ching-Chuan Shiue, Huang-Kun Chen
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Publication number: 20070224720Abstract: A manufacturing method of a suspended microstructure includes the steps of providing a substrate having a surface; forming a first depositing layer over a part of the surface; forming a second depositing layer over the first depositing layer and another part of the surface wherein an adhesion between the first depositing layer and the substrate is weaker than that between the second depositing layer and the substrate; forming a hole through the second depositing layer to partially expose the surface of the substrate; and filling the hole with an etchant to remove a part of the substrate so as to form a cavity.Type: ApplicationFiled: December 19, 2006Publication date: September 27, 2007Inventors: Cheng-Chang Lee, Hsueh-Kuo Liao, Shih-Peng Chen, Tai-Kang Shing, Huang-Kun Chen
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Publication number: 20060113660Abstract: A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.Type: ApplicationFiled: November 17, 2005Publication date: June 1, 2006Inventors: Hsueh-Kuo Liao, Hsin-Chang Tsai, Tai-Kang Shing