Patents by Inventor Hua He

Hua He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240406406
    Abstract: Bi-directional optical flow (BDOF) may be bypassed, for a current coding block, based on whether symmetric motion vector difference (SMVD) is used in motion vector coding for the current coding block. A coding device (e.g., an encoder or a decoder) may determine whether to bypass BDOF for the current coding block based at least in part on an SMVD indication for the current coding block. The coding device may obtain the SMVD indication that indicates whether SMVD is used in motion vector coding for the current coding block. If SMVD indication indicates that SMVD is used in the motion vector coding for the current coding block, the coding device may bypass BDOF for the current coding block. The coding device may reconstruct the current coding block without performing BDOF if it determines to bypass BDOF for the current coding block.
    Type: Application
    Filed: August 9, 2024
    Publication date: December 5, 2024
    Applicant: InterDigital VC Holdings, Inc.
    Inventors: Jiancong Luo, Xiaoyu Xiu, Yuwen He, Hua Yang
  • Publication number: 20240396148
    Abstract: The present disclosure provides a battery cabinet of a battery box and an energy storage container including the battery cabinet.
    Type: Application
    Filed: May 23, 2024
    Publication date: November 28, 2024
    Inventors: Hui CAO, Si LIU, Chen YU, Qi ZHAO, Hua DAI, Hongtao ZHONG, Bilei HE, Shangmiao YU
  • Publication number: 20240373766
    Abstract: A reversible phase transition in the whole semimetallic 1T?-tungsten disulfide (1T?-WS2) is realizable by proton intercalation and deintercalation, resulting in a newly-discovered semiconducting WS2 with a novel unconventional phase, denoted as 1T?d phase. A transport modulation with an on/off ratio of over 106 is realizable during the phase transition from the 1T?-WS2 to 1T?d-WS2. A transistor utilizing the advantage of reversible phase transition is developed by using a 1T?-WS2 nanosheet as a channel layer. A proton electrolyte contacts an edged circumference of the nanosheet for providing a reservoir of protons for proton intercalation and deintercalation of the nanosheet. The proton electrolyte is controllable by a gate-source voltage to intercalate or de-intercalate the nanosheet with protons for inducing a reversible phase transition over the nanosheet to thereby modify an electrical conductance of the channel layer or a spectral response of the channel layer to light.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 7, 2024
    Inventors: Hua ZHANG, Qiyuan HE, Wei ZHAI
  • Patent number: 12132898
    Abstract: Systems, methods, and instrumentalities may be used for decoding and/or encoding a coding unit (CD), An intra-prediction mode for a CD may be determined. A split mode may be determined based on the intra-prediction mode, to generate a plurality of sub-partitions in the CU. A prediction for a first sub-partition of the plurality of sub-partitions in the CU may be based on a reference sample in a second sub-partition of the plurality of sub-partitions in the CU. The CU may be decoded and/or encoded, for example, based on the determined split mode.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 29, 2024
    Assignee: InterDigital VC Holdings, Inc.
    Inventors: Hua Yang, Yuwen He, Wei Chen
  • Publication number: 20240354658
    Abstract: A method and apparatus for training a question solving model, a question solving method and apparatus, an electronic device and a readable storage medium are disclosed. The method for training a question solving model includes: acquiring a first sample question; inputting the first sample question and a solving step grabbing template into a large language model to obtain a first sample solving step; inputting the first sample question, the first sample solving step and an answer grabbing template into the large language model to obtain a first sample answer; pre-training a step planning model according to the first sample question and the first sample solving step; pre-training the large language model according to the first sample question, the first sample solving step and the first sample answer; and acquiring the question solving model according to the step planning model and the large language model obtained by pre-training.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 24, 2024
    Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Feng HE, Jianhua WANG, Junjie OU, Pingxuan HUANG, Zhifan FENG, Xiaopeng CUI, Qiaoqiao SHE, Hua WU
  • Publication number: 20240349457
    Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Phil Geng, David Shia, Donald Tiendung Tran, James Trevor Goulding, Jeffory L. Smalley, Ralph V. Miele, Sanjoy Kumar Saha, Jing-Hua He, Steven Adam Klein, Ethan Russell Long, Andres Ramirez Macias, Irving Joseph Castro Guzman
  • Patent number: 12101871
    Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: September 24, 2024
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventors: Huan-Yu He, Mei-Hua Huang, Biao Li, Jin-Cheng Wu
  • Patent number: 12095998
    Abstract: Bidirectional optical flow (BDOF) may be bypassed, for a current coding block, based on whether symmetric motion vector difference (SMVD) is used in motion vector coding for the current coding block. A coding device (e.g., an encoder or a decoder) may determine whether to bypass BDOF for the current coding block based at least in part on an SMVD indication for the current coding block. The coding device may obtain the SMVD indication that indicates whether SMVD is used in motion vector coding for the current coding block. If SMVD indication indicates that SMVD is used in the motion vector coding for the current coding block, the coding device may bypass BDOF for the current coding block. The coding device may reconstruct the current coding block without performing BDOF if it determines to bypass BDOF for the current coding block.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: September 17, 2024
    Assignee: VID SCALE, Inc.
    Inventors: Jiancong Luo, Xiaoyu Xiu, Yuwen He, Hua Yang
  • Publication number: 20240292018
    Abstract: Systems, devices, and methods are described herein for symmetric merge mode motion vector coding. Symmetric bi-prediction (bi-pred) motion vectors (MVs) may be constructed from available candidates in a merge candidate list for regular inter prediction merge mode and/or affine prediction merge mode. Available MV merge candidates may be symmetrically extended or mapped in either direction (e.g., between reference pictures before and after a current picture), for example, when coding a picture that allows bi-directional motion compensation prediction (MCP). A symmetric bi-pred merge candidate may be selected among merge candidates for predicting the motion information of a current prediction unit (PU). The symmetric mapping construction may be repeated by a decoder (e.g., based on a coded index of the MV merge candidate list), for example, to obtain the same merge candidates and coded MV at an encoder.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 29, 2024
    Applicant: VID SCALE, INC.
    Inventors: Hua Yang, Yuwen He
  • Patent number: 12056786
    Abstract: An apparatus and method are described for graphics virtualization with late synchronization. For example, a virtualized graphics execution environment is implemented on a host, including a hypervisor to virtualize graphics processing resources for one or more virtual machines (VMs). A plurality of graphics commands are received responsive to execution of a graphics application in one of the VMs. The graphics commands are persisted until a frame triggering event is detected. Upon detection of a frame triggering event, the persisted graphics commands are submitted to the host.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 6, 2024
    Assignee: INTEL CORPORATION
    Inventors: Weihan Wang, Jie He, Junhua Hou, Hua Zhang, Xiangning Ma, Zhi Hong Yu
  • Publication number: 20240195128
    Abstract: An electromagnetic isolation assembly adapted to be inserted into a slit of an insulator of a connector includes a metal isolation component and an electrical isolation component. The metal isolation component is adapted to electromagnetically isolate a power terminal inserted in the insulator from a signal terminal inserted in the insulator. The electrical isolation component is fixed to the metal isolation component and increases a creepage distance between the power terminal and the signal terminal.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 13, 2024
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Hua He, Yingchun (David) Wang, Yong (Chris) Wang, Daokuan (Jeremy) Zhang, Yong Yang
  • Publication number: 20240076407
    Abstract: It is demonstrated herein that inhibitors of immune checkpoints and CHI3L1 are synergistic. Accordingly, described herein are methods and compositions relating to combinatorial therapies for cancer, e.g., comprising an inhibitor of CHI3L1; and an inhibitor of an immune checkpoint protein. In some embodiments, the CHI3L1 inhibitor can be an antibody or antibody reagent as described herein.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 7, 2024
    Inventors: Jack A. ELIAS, Chun Geun LEE, Chuan Hua HE, Bing MA, Suchitra Kamle, Chang-Min LEE
  • Publication number: 20240072472
    Abstract: A connector comprises an insulation housing, a shielding shell, an inner sheath, and an outer sheath. The shielding shell is sheathed on the insulation housing. The inner sheath is formed on the shielding shell by injection molding. The inner sheath includes a front end wrapped on the shielding shell and a retaining portion formed on the front end of the inner sheath and spaced from the shielding shell to form a gap therebetween. The outer sheath is formed on the shielding shell and the inner sheath by injection molding. The outer sheath includes an engaging portion embedded in the gap between the retaining portion and the shielding shell. The retaining portion holds the engaging portion on the shielding shell to prevent the formation of a gap between the front end of the outer sheath and the shielding shell.
    Type: Application
    Filed: August 29, 2023
    Publication date: February 29, 2024
    Applicants: SIBAS Electronics (Xiamen) Co. Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daokuan (Jeremy) Zhang, Weidong (Randy) Huang, Yong (Chris) Wang, Hua He, Xinzheng (Tony) Fan, Jianfei (Fencer) Yu
  • Publication number: 20240064931
    Abstract: An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Jimmy CHUANG, Yuehong FAN, Jing-Hua HE, Sandeep AHUJA, Jay WU, Dongrui XUE, Xiaowei LI
  • Patent number: 11881014
    Abstract: The present invention discloses an intelligent image sensing device for sensing-computing-cloud integration based on a federated learning framework. The device comprises: intelligent image sensors, edge servers and a remote cloud, wherein the intelligent image sensor is used for perceiving and generating images, and uploading the images to the edge server; the edge server is used as a client; the remote cloud is used as a server; the clients train a convolutional fuzzy rough neural network based on the received images and the proposed federated learning framework; and the intelligent image sensors download the weight parameters of the trained convolutional fuzzy rough neural network from the clients, and classify and recognize the images based on the trained weight parameters. The present invention searches a lightweight deep learning architecture through neuroevolution, and deploys the lightweight deep learning architecture in the image sensors to automatically discriminate and analyze the perceived images.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: January 23, 2024
    Assignee: HEBEI UNIVERSITY OF TECHNOLOGY
    Inventors: Bin Cao, Jianwei Zhao, Xin Liu, Hua He, Yuchun Chang, Yun Li
  • Publication number: 20230406958
    Abstract: Described herein are methods and compositions relating to anti-Chi3L1 antibodies, antibody reagents, and antigen-binding fragments thereof which display superior properties, e.g., high sensitivity, high specificity, high binding affinity, neutralization activity ex vivo and in vivo (e.g., blocks Chi3L1-induced MAPK and AKT signaling). Methods of treatment, e.g., of treating cancer, obesity, and/or asthma by administering the compounds described herein are also provided.
    Type: Application
    Filed: April 20, 2023
    Publication date: December 21, 2023
    Inventors: Jack A. Elias, Chun Geun Lee, Chuan Hua He, Bing Ma, Suchitra Kamle, Chang-Min Lee
  • Publication number: 20230360384
    Abstract: The present invention discloses an intelligent image sensing device for sensing-computing-cloud integration based on a federated learning framework. The device comprises: intelligent image sensors, edge servers and a remote cloud, wherein the intelligent image sensor is used for perceiving and generating images, and uploading the images to the edge server; the edge server is used as a client; the remote cloud is used as a server; the clients train a convolutional fuzzy rough neural network based on the received images and the proposed federated learning framework; and the intelligent image sensors download the weight parameters of the trained convolutional fuzzy rough neural network from the clients, and classify and recognize the images based on the trained weight parameters. The present invention searches a lightweight deep learning architecture through neuroevolution, and deploys the lightweight deep learning architecture in the image sensors to automatically discriminate and analyze the perceived images.
    Type: Application
    Filed: January 17, 2023
    Publication date: November 9, 2023
    Inventors: Bin CAO, Jianwei ZHAO, Xin LIU, Hua HE, Yuchun CHANG, Yun LI
  • Patent number: 11811170
    Abstract: A connector assembly comprising a male connector, and a female connector mateable to the male connector. Each of the male and female connectors include a shielding shell having two identical shielding half shells each comprising a bottom wall and a pair of side walls, a protrusion formed on one of the pair of side walls, and a latch formed on the other of the pair of side walls. The latch of one of the two shielding half shells engages with the protrusion of the other of the two shielding half shells for locking the two shielding half shells together. A terminal module is installed in each of the shielding shells. The terminal module and shielding shell of the male connector is adapted to be received within and electrically connected to the female connector.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: November 7, 2023
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Japan G.K.
    Inventors: Yingchun (David) Wang, Yusuke Okada, Yong (Chris) Wang, Liqiang (Gino) Yao, Daokuan (Jeremy) Zhang, Hua He, Haibo (Robert) Gan
  • Patent number: D1051220
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: November 12, 2024
    Assignee: Zhuhai Pantum Electronics Co., Ltd.
    Inventors: Aiguo Yin, Xining Ding, Xinchao He, Juzheng Xia, Hua Tang
  • Patent number: D1052646
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: November 26, 2024
    Assignee: Zhuhai Pantum Electronics Co., Ltd.
    Inventors: Aiguo Yin, Xining Ding, Xinchao He, Juzheng Xia, Hua Tang