Abstract: The present invention encompasses embodiments in which a therapeutic antibody is conjugated to ?-1,6-glucan oligomers. Thus, the present invention includes, among other things, compositions including a therapeutic antibody conjugated to one or more ?-1,6-glucan oligomers. The present invention further includes, among other things, methods of making and/or using such ?-1,6-glucan conjugates. In certain embodiments, a ?-1,6-glucan conjugate of the present invention is useful as a therapeutic or in a method of therapy.

Abstract: An electromagnetic device includes a substrate, magnetic cores, transmission line layers, and conductive members. The substrate is provided with annular receiving grooves for accommodating the magnetic cores; the substrate is divided into a central portion and a peripheral portion; inner and outer via holes are respectively formed on the central portion and the peripheral portion, respectively; the transmission line layers each including wire patterns are respectively provided on opposite sides of the substrate; and the conductive members are sequentially connected to the wire patterns on both sides of the substrate to form a transformer and/or a filter; the electromagnetic device has a first side provided with a slot and a second side parallel to the transmission line layers; and first conductive pins electrically connected to the at least one transmission line layers are provided on at least one of the side wall surrounding the slot and a second side.

Abstract: The present disclosure provides an adapter board, a for manufacturing the same and a circuit board assembly. The adapter board includes a board body, a first component buried in the board body, a first connector located on a first surface of the board body and configured to be connected with a circuit board and a second component, a second connector located on a second surface of the board body and configured to be connected with a second component, a first conductive body and a second conductive body buried in the board body. One end of the first conductive body is connected with the first component. The other end of the first conductive body is connected with the first connector. One end of the second conductive body is connected with the first component. The other end of the second conductive body is connected with the second connector.

Abstract: A circuit board, a preparation method thereof, and an electronic device are provided. The circuit board includes: a substrate, defining a first through-hole; a metal block, embedded in the first through-hole and fixedly connected to the substrate; a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and a conductive channel, penetrating the conductive line layer and the metal block in turn. The conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.

Abstract: Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

Abstract: The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Abstract: An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire.

Abstract: The present application relates to the technical field of circuit boards. In particular, disclosed are an optical fiber circuit board assembly and an electro-optical circuit board. The optical fiber circuit board assembly comprises a substrate, which comprises a substrate body, the substrate body at least being provided with a first window; and a plurality of optical fiber units, which are arranged on the substrate, wherein one end of each of the plurality of optical fiber units extends to the first window and is used for being coupled to a plurality of optical devices, and the other end of each of the plurality of optical fiber units extends to the outside of the substrate. By the means, according to the present application, the assembly of optical interconnection and electrical interconnection can be simplified, thereby greatly improving efficiency.

Abstract: The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Abstract: A graded-index polymer waveguide (30) and a manufacturing method thereof are provided. The method includes providing a waveguide substrate (1); manufacturing a waveguide lower cladding layer (2) on a surface of the waveguide substrate (1); coating a material of a waveguide core layer (3) having UV photosensitivity on a surface of the waveguide lower cladding layer (2) away from the waveguide substrate (1); performing a hot imprinting process for the material of the waveguide core layer by means of a flexible transfer film mold and forming a waveguide core layer (3) having an imprinted waveguide link structure; performing a heat treatment process for the waveguide core layer (3); performing a pre-exposure process for the waveguide core layer; coating a waveguide upper cladding layer on a surface of a waveguide core layer (3); and curing the waveguide core layer (3) and the waveguide upper cladding layer (4).

Abstract: The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Abstract: The present invention provides compounds and compositions thereof which are useful as inhibitors of Bruton's tyrosine kinase and which exhibit desirable characteristics for the same.

Abstract: The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Abstract: Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

Abstract: The present disclosure provides an adapter board, a for manufacturing the same and a circuit board assembly. The adapter board includes a board body, a first component buried in the board body, a first connector located on a first surface of the board body and configured to be connected with a circuit board and a second component, a second connector located on a second surface of the board body and configured to be connected with a second component, a first conductive body and a second conductive body buried in the board body. One end of the first conductive body is connected with the first component. The other end of the first conductive body is connected with the first connector. One end of the second conductive body is connected with the first component.

Abstract: A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

Abstract: A flexible optical waveguide board and a method of manufacturing the same are provided. The flexible optical waveguide board includes: a flexible substrate, wherein a surface of a side of the flexible substrate is a rough surface; an optical waveguide, disposed on the rough surface of the flexible substrate; a cover layer, disposed on a surface of a side of the optical waveguide away from the flexible substrate. In this way, structural reliability and environmental ageing resistance of the flexible optical waveguide board is improved.

Abstract: An integrated transformer and an electronic device are disclosed. The integrated transformer includes at least one first base plate and at least one second base plate. Each of the first and second base plate defines multiple annular accommodating grooves. The annular accommodating grooves divide each of the first and second base plate into multiple central parts and a peripheral part Each central part defines multiple inner via holes there through. The peripheral part defines multiple outer via holes there through. The integrated transformer further includes multiple magnetic cores disposed in the respective annular accommodating groove and transmission wires disposed on both sides of the first and second base plates. Transformers and the filters are arranged on two base plates respectively, and the thickness of the transmission wire layers of the filters is less than that of the transformers. Thus, the structure of the electromagnetic device may be more compact.

Abstract: The present invention provides compounds and compositions thereof which are useful as inhibitors of Bruton's tyrosine kinase and which exhibit desirable characteristics for the same.

Abstract: The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.