Patents by Inventor Hua Yang

Hua Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230380050
    Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 23, 2023
    Applicant: Cisco Technology, Inc.
    Inventors: Yongguo Chen, Yaotsan Tsai, Vic Hong Chia, Hua Yang
  • Publication number: 20230378623
    Abstract: A manufacturing method of a filter, including the following steps: defining an adhesive layer on a surface of a substrate according to a filter pattern; covering the surface of the substrate by a conductive layer, wherein the conductive layer comprises a first covering part and a second covering part, wherein the first covering part and the second covering part are non-overlapping. In an aspect, the first covering part of the conductive layer is attached to the adhesive layer according to the filter pattern and the second covering part is not attached to the adhesive layer. In an aspect, the second covering part of the conductive layer is attached to the surface of the substrate to form the filter pattern.
    Type: Application
    Filed: December 16, 2022
    Publication date: November 23, 2023
    Applicant: National Tsing Hua University
    Inventors: Shang-Hua Yang, Yi-Chun Hung
  • Patent number: 11823194
    Abstract: A biometric authentication platform (10) uses fault-tolerant distributed computing to determine if a supplied biometric sample and a sample stored in a registry are from the same person. A collection of reference samples is maintained in a distributed ledger (115) with immutable history of modifications. Results of matching are stored in a separate distributed ledger (125) providing an immutable history log. Coordinated use of both ledgers (115, 125) enable biometric authentication of registered users (140) in real time. Users (140) may interact with providers (150) and/or trusted circles of other users in order to recover user records from the user ledger (115).
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: November 21, 2023
    Assignee: REDROCK BIOMETRICS, INC.
    Inventors: Hua Yang, Leonid Kontsevich, Kevin Horowitz, Igor Lovyagin
  • Publication number: 20230345704
    Abstract: A method of forming a capacitor structure includes following operations. A first electrode is formed. A hafnium-zirconium oxide (HZO) layer is formed over the first electrode under a first temperature. An interface dielectric layer is formed over the HZO layer under a second temperature greater than the first temperature. A second electrode is formed over the interface dielectric layer. The HZO layer and the interface dielectric layer are annealed.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Jyun-Hua YANG, Kai Hung LIN
  • Patent number: 11798836
    Abstract: A semiconductor isolation structure includes a silicon-on-insulator wafer, a first deep trench isolation structure and a second deep trench isolation structure. The silicon-on-insulator wafer includes a semiconductor substrate, a buried insulation layer disposed on the semiconductor substrate, and a semiconductor layer disposed on the buried insulation layer. The semiconductor layer has a functional region. The first deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional region. The second deep trench isolation structure penetrates semiconductor layer and the buried insulation layer, and surrounds the first deep trench isolation structure.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: October 24, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Yu Yang, Po-Wei Liu, Yun-Chi Wu, Yu-Wen Tseng, Chia-Ta Hsieh, Ping-Cheng Li, Tsung-Hua Yang, Yu-Chun Chang
  • Patent number: 11798700
    Abstract: A method of separating actinium and/or radium from proton-irradiated thorium metal. The thorium metal is irradiated to produce isotopes including thorium, actinium and/or radium. The resultant product is dissolved in solution and a selective precipitant is used to precipitate a bulk portion of the thorium. The precipitated thorium can be recovered. Chromatography is carried out on the remaining solution to remove residual thorium and to separate the actinium from the radium.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: October 24, 2023
    Assignees: THE UNIVERSITY OF BRITISH COLUMBIA, TRIUMF INC.
    Inventors: Andrew Kyle Henderson Robertson, Hua Yang, Stefan Zeisler, Paul Schaffer
  • Publication number: 20230334738
    Abstract: The present disclosure relates to the field of electronic card books, and more particularly, to a method for generating and using an electronic card book, the method may include: at a first step, purchasing a physical card book, at a second step, downloading APP, at a third step, verifying the physical card book, at a fourth step, generating an electronic card book, at a fifth step, generating an electronic card, at a sixth step, searching for electronic cards, and generating the electronic card book by downloading the APP, wherein the electronic card book corresponds to the physical card book, and the same electronic card book as the physical card book can be generated directly by scanning the QR code, the appearance and card format of the electronic card book are consistent with the physical card book.
    Type: Application
    Filed: July 29, 2022
    Publication date: October 19, 2023
    Applicant: DONGGUAN SENGTOR PLASTICS PRODUCTS CO., LTD.
    Inventors: Xuefen REN, Liangfeng GAO, Xiaoshan FENG, Hua YANG
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Patent number: 11788129
    Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: October 17, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Min-Yuan Chou, Kuang-Chi Cheng, Ming-Hua Yang, Jiun-Lin Guo
  • Patent number: 11782516
    Abstract: A method for detecting a finger is provided. The method includes obtaining a plurality of digital images including a first digital image captured by a camera from a field of view containing a background and a hand including at least one finger, and obtaining an identification of pixels of the plurality of digital images that correspond to at least one finger that is visible in the plurality of digital images rather than to the background, the pixels being identified by: obtaining, from the digital images, a Gaussian brightness falloff pattern indicative of at least one finger, identifying an axis of the at least one finger based on the obtained Gaussian brightness falloff pattern indicative of the at least one finger without identifying edges of the at least one finger, and identifying the pixels that correspond to the at least one finger based on the identified axis.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: October 10, 2023
    Assignee: Ultrahaptics IP Two Limited
    Inventors: David S. Holz, Hua Yang
  • Patent number: 11778725
    Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 3, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Yongguo Chen, Yaotsan Tsai, Vic Hong Chia, Hua Yang
  • Patent number: 11778771
    Abstract: Embodiments for providing cooling airflow through electronic in two different directions is described. An airflow control louver system in an electronic device provides for cooling airflow to be efficiently routed through the electronic device in the two different directions which in turn allows for multiple installation configurations for electronic devices with high powered heat sensitive components.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 3, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Vic Hong Chia, Wei Qi, Yong Hong Luo, Hua Yang
  • Patent number: 11778809
    Abstract: A method of forming a capacitor structure includes following operations. A first electrode is formed. A hafnium-zirconium oxide (HZO) layer is formed over the first electrode under a first temperature. An interface dielectric layer is formed over the HZO layer under a second temperature greater than the first temperature. A second electrode is formed over the interface dielectric layer. The HZO layer and the interface dielectric layer are annealed.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: October 3, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Jyun-Hua Yang, Kai Hung Lin
  • Publication number: 20230301465
    Abstract: A stirring-type cooking appliance, comprising a main machine housing, a motor assembled in the main machine housing, and a container cup assembly detachably assembled on the main machine housing; the main machine housing comprises a main machine upper cover and a main machine base which are integrally mounted, mounting positions are provided at corner ends on the main machine base; the container cup assembly and the main machine housing are mutually locked/unlocked by means of container cup fixing structures, the container cup assembly and the motor are mutually linked by means of cover opening protection structures, a cutter assembly in the container cup assembly and the motor are mutually linked by means of cutter fixing structures, and weighing foot assemblies are mounted on the mounting positions in a suspended manner.
    Type: Application
    Filed: April 6, 2021
    Publication date: September 28, 2023
    Inventors: Hua YANG, Huashan CHEN, Tao ZHANG, Xiuqian ZHENG, Youru YANG
  • Publication number: 20230299807
    Abstract: The present disclosure provides a case for an electronic device and a magnetic assembly. The case includes a side wall, a back wall connected with the side wall to define a receiving cavity for receiving the electronic device, and a magnetic assembly, the magnetic assembly includes a support member connected with the side wall or the back wall, and a magnetic alignment member, the support member is capable of moving relative to the side wall or the back wall, so as to support the case, the magnetic alignment member is detachably or fixedly connected with the support member connected with the back wall or the side wall. The case of the present disclosure is convenient to use.
    Type: Application
    Filed: January 19, 2023
    Publication date: September 21, 2023
    Inventors: Hua Yang, Yong Chen, Liren Luo, Jianhua Liu, Zhengfeng Yang, Zhijun Liang, Churong Tang, Haisong Qiu, Zhuoting Ye
  • Patent number: 11758689
    Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: September 12, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Yaotsan Tsai, Yongguo Chen, Hua Yang, Vic Hong Chia
  • Publication number: 20230280020
    Abstract: A wearable device and a head strap module are provided. The wearable device includes a host and a head strap module. Two opposite sides of the host are provided with a first bracket and a second bracket. The first bracket has a first end. The second bracket has a second end. The head strap module includes a first belt, a second belt, and an adjustment mechanism. The first belt has a third end. The second belt has a fourth end. The third end and the fourth end are detachably assembled to the first end and the second end respectively. The adjustment mechanism is arranged at the overlapping position of the first belt and the second belt for adjusting the overlapping length of the first belt and the second belt.
    Type: Application
    Filed: July 25, 2022
    Publication date: September 7, 2023
    Applicant: HTC Corporation
    Inventors: Tsen-Wei Kung, Chung-Ju Wu, Tsung Hua Yang, Chih-Yao Chang, Wei Te Tu
  • Publication number: 20230279989
    Abstract: A wearable device includes a host, a first belt, a second belt, a circuit board, a cable, and an adjustment mechanism. The first belt, one end of which is connected to a first side of the host, has a cable holding part. One end of the second belt is connected to a second side of the host. The circuit board is disposed at an overlap of the first belt and the second belt. A first end and a second end opposite to each other of the cable are connected to the circuit board and the first side respectively, and a holding section of the cable is fixed to the cable holding part. The adjusting mechanism is disposed at an overlap of the first belt and the second belt to adjust an overlapping length of the first belt and the second belt.
    Type: Application
    Filed: July 25, 2022
    Publication date: September 7, 2023
    Applicant: HTC Corporation
    Inventors: Tsen-Wei Kung, Chung-Ju Wu, Tsung Hua Yang, Chih-Yao Chang, Wei Te Tu
  • Publication number: 20230270892
    Abstract: A chelator having the general structure (I) for chelating ra-diometals such as 225Ac under mild conditions is provided. (I) The chelator can be coupled to a biological targeting moiety to facilitate targeted delivery of the chelated radiometal in a mammalian subject.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 31, 2023
    Inventors: Hua YANG, Feng GAO, Paul SCHAFFER, Zheliang YUAN, Chengcheng ZHANG, Francois BENARD, Luke WHARTON
  • Publication number: 20230275131
    Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.
    Type: Application
    Filed: May 3, 2023
    Publication date: August 31, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Wen TSENG, Po-Wei LIU, Hung-Ling SHIH, Tsung-Yu YANG, Tsung-Hua YANG, Yu-Chun CHANG