Abstract: A method for treating, suppressing or alleviating cough or cough impulse in the field of biomedicine, comprising: administering to a subject in need thereof a therapeutically effective amount of a diaminopyrimidine compound of formula (I) or a pharmaceutically acceptable salt, ester, stereoisomer, polymorph, solvate, N-oxide, isotope-labeled compound, metabolite or prodrug thereof.

Abstract: The present invention relates to a solid form of 5-((2-ethynyl-5-isopropylpyridin-4-yl)oxy)pyrimidine-2,4-diamine or a hydrate thereof, a method for preparing the solid form, a pharmaceutical composition comprising the solid form, and a use of the solid form for the prevention or treatment of a disease modulated by P2X3 and/or P2X2/3 receptor antagonists.

Abstract: The present invention relates to a salt of 5-((2-ethynyl-5-isopropylpyridin-4-yl)oxy)pyrimidine-2,4-diamine and a solid form thereof, a method for preparing the solid form and a pharmaceutical composition comprising the solid form, as well as a use of the solid form for preventing or treating diseases modulated by P2X3 and/or P2X2/3 receptor antagonists.

Abstract: A sensor system includes an optical aperture, a light source configured to generate a light pulse along a first optical path, a reflective surface configured to reflect the light pulse from the first optical path to a second optical path for passing through the optical aperture, a beam steering device positioned in the optical aperture and configured to steer the light pulse along different directions to one or more objects in an angle of view of the sensor system, a detector configured to receive a reflected light pulse and convert the reflected light pulse into an electrical signal, the reflected light pulse being reflected back from the one or more objects and passed through the beam steer device, and a spatial filtering device positioned between the beam steering device and the detector to block undesirable light in both the light pulse and the reflected light pulse.

Abstract: A laser-based measurement device includes a laser transmitter; a laser receiver; an optical device configured to guide a laser beam emitted by the laser transmitter out of the laser-based measurement device and guide the laser beam reflected by an external environment in the laser receiver; and a driving device including a first magnetic member connected to the optical device and a second magnetic member. The driving device is configured to drive the optical device to vibrate through interaction between the first magnetic member and the second magnetic member, to change a guiding direction of the laser beam passing through the optical device.

Abstract: A method for fabricating a semiconductor device including a skip via connection between metallization levels includes subtractively etching first conductive material to form a first via and a skip via on a first conductive line. The first via and the first conductive line are included within a first metallization level. The skip via is used to connect the first metallization level to a third metallization level above a second metallization level. The method further includes forming, on the first via from second conductive material, a second via disposed on a second conductive line. The second via and the second conductive line are included within the second metallization level.

Abstract: A ranging device includes a light emission device configured to emit a light pulse sequence, a light guide device, a first light reception device configured to monitor an output optical power of the light emission device, and a second light reception device configured to receive a light pulse signal reflected by an object and determine a distance between the object and the ranging device based on the light pulse signal. The light guide device includes a light incident surface, a reflection surface, and a light emission surface. The reflection surface includes a first reflection surface and a second reflection surface. At least one of the first reflection surface or the second reflection surface has a curved surface shape. The light guide device is configured to receive part of radiation power emitted by the light emission device and conduct the part of the radiation power to the first light reception device.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer, and forming a second dielectric layer stacked on the first dielectric layer. In the method, a plurality of conductive lines are formed in the first and second dielectric layers, and the plurality of conductive lines are recessed to form a plurality of openings in the second dielectric layer. The method also includes forming a plurality of dielectric fill layers on the plurality of conductive lines in the plurality of openings. At least one of the plurality of dielectric fill layers is selectively removed with respect to the second dielectric layer to expose a conductive line of the plurality of conductive lines, and a via is formed in place of the selectively removed dielectric fill layer.

Abstract: Techniques for forming trapezoidal-shaped interconnects are provided. In one aspect, a method for forming an interconnect structure includes: patterning a trench(es) in a dielectric having a V-shaped profile with a rounded bottom; depositing a liner into the trench(es) using PVD which opens-up the trench(es) creating a trapezoidal-shaped profile in the trench(es); removing the liner from the trench(es) selective to the dielectric whereby, following the removing, the trench(es) having the trapezoidal-shaped profile remains in the dielectric; depositing a conformal barrier layer into and lining the trench(es) having the trapezoidal-shaped profile; depositing a conductor into and filling the trench(es) having the trapezoidal-shaped profile over the conformal barrier layer; and polishing the conductor and the conformal barrier layer down to the dielectric. An interconnect structure is also provided.

Abstract: A laser-based measurement device includes a motor comprising a hollow shaft. The laser-based measurement device also includes a laser transmitter disposed in the hollow shaft. The laser-based measurement device also includes an optical device disposed at the motor. The motor is configured to drive the optical device to rotate. The optical device is configured to guide a laser beam transmitted by the laser transmitter out of the hollow shaft, or to guide the laser beam reflected by an external environment into the hollow shaft.

Abstract: The present invention discloses a receptor inhibitor of formula (I), a composition comprising the same and the usage thereof.

Abstract: A method for manufacturing a semiconductor device includes forming a first vertical transistor structure in a first device region on a substrate, and forming a second vertical transistor structure in a second device region on the substrate. The first vertical transistor structure includes a first plurality of fins, and the second vertical transistor structure includes a second plurality of fins. A plurality of first source/drain regions are grown from upper portions of the first plurality of fins, and a contact liner layer is formed on the first source/drain regions. The method further includes forming a plurality of first silicide portions from the contact liner layer on the first source/drain regions, and forming a plurality of second silicide portions on a plurality of second source/drain regions extending from upper portions of the second plurality of fins. The second silicide portions have a different composition than the first silicide portions.

Abstract: A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.

Abstract: A scanning assembly includes a driver and a lens mounted at the driver. The lens is configured to collimate a light beam incident from one side of the lens, and the driver is configured to drive the lens to rotate around a rotation axis that is spaced apart from an optical axis of the lens.

Abstract: Techniques for forming trapezoidal-shaped interconnects are provided. In one aspect, a method for forming an interconnect structure includes: patterning a trench(es) in a dielectric having a V-shaped profile with a rounded bottom; depositing a liner into the trench(es) using PVD which opens-up the trench(es) creating a trapezoidal-shaped profile in the trench(es); removing the liner from the trench(es) selective to the dielectric whereby, following the removing, the trench(es) having the trapezoidal-shaped profile remains in the dielectric; depositing a conformal barrier layer into and lining the trench(es) having the trapezoidal-shaped profile; depositing a conductor into and filling the trench(es) having the trapezoidal-shaped profile over the conformal barrier layer; and polishing the conductor and the conformal barrier layer down to the dielectric. An interconnect structure is also provided.

Abstract: A method for fabricating a semiconductor device includes forming one or more layers including at least one of a liner and a barrier along surfaces of a first interlevel dielectric (ILD) layer within a trench, after forming the one or more liners, performing a via etch to form a via opening exposing a first conductive line corresponding to a first metallization level, and forming, within the via opening and on the first conductive line, a barrier-less prefilled via including first conductive material.

Abstract: A ranging device includes a light source, a transceiver, a detector, and a light path changing element. The light source is configured to emit a light pulse. The transceiver is configured to collimate the light pulse and converge at least part of reflected light of the light pulse reflected by a detection object. The detector is configured to receive and convert the at least part of the reflected light into an electrical signal for measuring a distance between the detection object and the ranging device. The light path changing element is configured to combine emission light path and reception light path. The light path changing element includes an area configured to transmit or reflect part of the light pulse, and a reception solid angle of the area with respect to the light pulse is 20%-40% of a reception solid angle of the detector with respect to the reflected light.

Abstract: A detection method includes obtaining first count data and second count data during rotation of an encoder disc mounted at and configured to rotate together with a rotation object and determining a rotation parameter of the rotation object according to the first count data and the second count data. The encoder disc includes N detection target portions arranged along a circumferential direction of the encoder disc. The N detection target portions include N?K first detection target portions and K second detection target portions. Along the circumferential direction of the encoder disc, a width of one of the N?K first detection target portions is different from a width of one of the K second detection target portions. The first count data is obtained when one detection target portion of the N detection target portions is detected. The second count data is recorded between two neighboring detection target portions.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A distance measuring device includes a scanning module including a rotor assembly, the rotor assembly including a rotor, the rotor including a receiving cavity and an optical element disposed in the receiving cavity, the optical element rotating synchronously with the rotor assembly, the optical element including a first end and a second end, the first end and the second end being respectively positioned at two ends in a radial direction of the optical element, a thickness of the first end being greater than a thickness of the second end, a notch being formed on a side of the first end of the rotor or/and the optical element; and a distance measuring module configured to emit a laser pulse to the scanning module.