Patents by Inventor Hui-Chen Hsu

Hui-Chen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210225741
    Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Jen CHEN, Guo-Cheng LIAO, Jyun-Chi JHAN, Hui-Chen HSU
  • Patent number: 10410942
    Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: September 10, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tsan-Hsien Chen, Ian Hu, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu
  • Publication number: 20190164859
    Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsan-Hsien CHEN, Ian HU, Jin-Feng YANG, Shih-Wei CHEN, Hui-Chen HSU
  • Patent number: 9768414
    Abstract: A display device is provided. The display device includes a first substrate, a first barrier layer disposed on the first substrate, a second substrate, a second barrier layer disposed on the second substrate, an display medium disposed between the first barrier layer and the second barrier layer, and a metal enclosing wall connecting the first substrate to the second substrate and surrounding the display medium. The metal enclosing wall includes a first metal layer having a first opening and connected to the first substrate, a second metal layer connected to the second substrate, and a third metal layer formed between the first metal layer and the second metal layer.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 19, 2017
    Assignee: INNOLUX CORPORATION
    Inventors: Chi-Che Tsai, Po-Ching Lin, Wei-Yen Wu, Hui-Chen Hsu
  • Publication number: 20160204380
    Abstract: A display device is provided. The display device includes a first substrate, a first barrier layer disposed on the first substrate, a second substrate, a second barrier layer disposed on the second substrate, an display medium disposed between the first barrier layer and the second barrier layer, and a metal enclosing wall connecting the first substrate to the second substrate and surrounding the display medium. The metal enclosing wall includes a first metal layer having a first opening and connected to the first substrate, a second metal layer connected to the second substrate, and a third metal layer formed between the first metal layer and the second metal layer.
    Type: Application
    Filed: March 24, 2016
    Publication date: July 14, 2016
    Inventors: Chi-Che Tsai, Po-Ching Lin, Wei-Yen Wu, Hui-Chen Hsu
  • Publication number: 20160072100
    Abstract: An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.
    Type: Application
    Filed: November 13, 2015
    Publication date: March 10, 2016
    Inventors: Chi-Che Tsai, Po-Ching Lin, Wei-Yen Wu, Hui-Chen Hsu
  • Patent number: 9246128
    Abstract: An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: January 26, 2016
    Assignee: INNOLUX CORPORATION
    Inventors: Chi-Che Tsai, Po-Ching Lin, Wei-Yen Wu, Hui-Chen Hsu
  • Publication number: 20150062842
    Abstract: An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed.
    Type: Application
    Filed: August 11, 2014
    Publication date: March 5, 2015
    Inventors: Chi-Che TSAI, Hui-Chen HSU, Wei-Yen WU, Wei-Yun CHANG
  • Publication number: 20140231767
    Abstract: An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.
    Type: Application
    Filed: January 28, 2014
    Publication date: August 21, 2014
    Applicant: Innolux Corporation
    Inventors: Chi-Che Tsai, Po-Ching Lin, Wei-Yen Wu, Hui-Chen Hsu
  • Publication number: 20060104951
    Abstract: The administration of an Akt inhibitor in a suitable carrier to a rheumatoid arthritis synovial fibroblast affords a process for inducing rheumatoid arthritis synovial fibroblast apoptosis. The Akt inhibitor is administered either as an active molecule or as a gene sequence expressible within rheumatoid arthritis synovial fibroblast cells. The gene sequence can be encompassed within a gene vector such as an adenovirus. A process for assaying rheumatoid arthritis drug candidates for apoptosis affect includes exposing a culture of rheumatoid arthritis synovial fibroblast cells to a drug candidate and monitoring apoptosis in the culture in the presence of the drug candidate. Apoptosis in the culture is compared to apoptosis induced in a duplicate culture in the presence of a known Akt inhibitor.
    Type: Application
    Filed: November 16, 2004
    Publication date: May 18, 2006
    Inventors: John Mountz, Huang-Ge Zhang, Hui-Chen Hsu
  • Publication number: 20020022262
    Abstract: The present invention relates to a type of plant tissue culture vessels which comprises a container and a cover, wherein the container is made of transparent synthetic polymers and has a opening, a stress concentration seams which be formed on the circumferential surface and/or bottom of the container and which can be focused the distribution of stresses in certain way that can be safely and easily avulsion before seedlings are removed from the culture vessel.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 21, 2002
    Inventors: Wen-Yi Wang, Hui-Chen Hsu