Patents by Inventor Hui Yang

Hui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Publication number: 20240110585
    Abstract: Provided are a structure with a screw, a screw fixing structure and a display device. The structure with a screw includes a limiting structure, an assembly member, an elastic member and a screw, the limiting structure is connected to the assembly member and provided with an operating hole, the assembly member is provided with a through hole for accommodating the screw and the elastic member, an abutting step is provided in the through hole, an end of the elastic member abuts against the abutting step and the other end of the elastic member abuts against the screw, a head portion of the screw has an operating portion and an abutting portion, the abutting portion abuts against the limiting structure, and the operating portion is exposed through the operating hole.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Applicant: Wuhu Tianma Automotive Electronics Co., Ltd.
    Inventors: Zhijun Hu, Hui Yang, Wenyi Yin
  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Patent number: 11942532
    Abstract: A method includes fabricating a semiconductor device, wherein the method includes depositing a coating layer on a first region and a second region under a loading condition such that a height of the coating layer in the first region is greater than a height of the coating layer in the second region. The method also includes applying processing gas to the coating layer to remove an upper portion of the coating layer such that a height of the coating layer in the first region is a same as a height of the coating layer in the second region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao-Hsuan Chen, Ming-Chia Tai, Yu-Hsien Lin, Shun-Hui Yang, Ryan Chia-Jen Chen
  • Patent number: 11942015
    Abstract: A source driver, including a plurality of channel circuits, each of the plurality of channel circuits including a first digital-to-analog converter (DAC), a second DAC, a first switch, a second switch and an output buffer circuit, is provided. The output terminal of the output buffer circuit is configured to be coupled to a data line of a display panel. An output terminal of the first DAC is coupled to a first input terminal among the input terminals of the output buffer circuit. An output terminal of the second DAC is coupled to a second input terminal among the input terminals of the output buffer circuit. The first switch is disposed along a first signal path between the output terminal of the first DAC and the output terminal of the output buffer circuit. The second switch is disposed along a second signal path between the output terminal of the second DAC and the output terminal of the output buffer circuit.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: March 26, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Yen-Cheng Cheng, Hsiu-Hui Yang
  • Patent number: 11942775
    Abstract: A high voltage battery cluster, and an overcurrent protection circuit and a switch box of the high voltage battery cluster are provided. The overcurrent protection circuit includes a first fusing module and a second fusing module. Since a withstand current-time curve of the first fusing module is different from a withstand current-time curve of the second fusing module, in a case that an overcurrent fault occurs in a high voltage battery cluster, one fusing module can cause an open circuit in the high voltage battery cluster prior to another fusing module, thereby preventing the high voltage battery cluster from being broken by a large current when an overcurrent fault occurs in the high voltage battery cluster, thus ensuring an electrical safety of the high voltage battery cluster.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: March 26, 2024
    Assignee: SUNGROW POWER SUPPLY CO., LTD.
    Inventors: Jianjie Zhou, Renxian Cao, Yilei Gu, Shanming Yang, Hui Tong, Xiaohu Xu, Jinsheng Li
  • Patent number: 11940658
    Abstract: An optical fiber module is provided and includes an optical fiber structure, a light-absorbing area and a photoelectric sensor in a housing. The optical fiber structure collectively arranges a plurality of first optical fibers to form at least one optical fiber bundle with a tapered end, and a second optical fiber is connected to the tapered end of the optical fiber bundle to converge the optical fiber bundle to the second optical fiber. The light-absorbing area corresponds to an end of the second optical fiber, such that the light-absorbing area absorbs scattering signals escaped and scattered when signals are transmitted from the plurality of first optical fibers to the second optical fiber. The photoelectric sensor is arranged corresponding to the plurality of first optical fibers to receive target signals escaped and refracted when the signals are transmitted from the second optical fiber to the plurality of first optical fibers.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Chia Su, Ying-Hui Yang, Yu-Cheng Song, Tsung-Jun Ho
  • Publication number: 20240098271
    Abstract: An encoding method includes: a first matching block of a current block is determined; motion compensation enhancement is performed on the first matching block to obtain at least one second matching block; motion information of the current block is determined according to the at least one second matching block; and the current block is encoded according to the motion information.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Hui YUAN, Dongran JIANG, Yanhan CHU, Ye YANG, Ming LI
  • Publication number: 20240095425
    Abstract: Systems and methods are provided for predicting microhardness properties of a weld that defines a weld joint between at least two workpieces. The system includes a processor programmed to: receive temperature data that includes temperature values each attributed to a corresponding one of a plurality of points of the weld at corresponding times during a welding process used to produce the weld, determine peak temperature values and cooling rate values for each of the points of the weld based on the temperature values, predict a three-dimensional (3D) distribution of microhardness values of the weld based on a machine learning method that evaluates the peak temperature values and the cooling rate values, and generate display data based on the 3D distribution of microhardness values.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicants: GM GLOBAL TECHNOLOGY OPERATIONS LLC, Arizona Board of Regents on behalf of Arizona State University
    Inventors: Ying Lu, Junjie Ma, Hui-ping Wang, Mitchell Poirier, Baixuan Yang, Jay Oswald
  • Publication number: 20240095930
    Abstract: A machine learning method includes: distinguishing foregrounds and backgrounds of a first image to generate a first mask image; cropping the first image to generate second and third images; cropping the first mask image to generate second and third mask images, wherein a position of the second mask image and a position of the third mask image correspond to a position of the second image and a position of the third image, respectively; generating a first feature vector group of the second image and a second feature vector group of the third image by a model; generating a first matrix according to the first and second feature vector groups; generating a second matrix according to the second and third mask images; generating a function according to the first and second matrices; and adjusting the model according to the function.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 21, 2024
    Inventors: Shen-Hsuan LIU, Van Nhiem TRAN, Kai-Lin YANG, Chi-En HUANG, Muhammad Saqlain ASLAM, Yung-Hui LI
  • Publication number: 20240095155
    Abstract: Embodiments of the invention are directed to computer-implemented methods of analyzing a web-based software application. A non-limiting example of the computer implemented method includes generating, using a processor system, a set of to-be-tested element-event pairs of the web-based software application. A set of compatibility tests is received at the processor system, where the set of compatibility tests is operable to perform compatibility testing of a corresponding set of element-event pairs. A comparison is performed between the set of to-be-tested element-event pairs and the corresponding set of element-event pairs. A compatibility testing recommendation is generated based at least in part on a result of the comparison.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Hong Liang Zhao, Qi Li, Yan Hui Wang, Jia Lei Rui, Qun Wei, Yun Juan Yang
  • Patent number: 11935864
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • Patent number: 11935468
    Abstract: A display substrate and a display device are provided. The display substrate includes a plurality of driving circuits, wherein each of the driving circuits includes: a first sub-circuit, respectively coupled to a gate signal terminal, a data signal terminal and a light-emitting power source terminal, and configured to store a drive voltage based on a voltage at the data signal terminal when the gate signal terminal receives a gate drive signal, and output a drive current to a light-emitting device based on the stored drive voltage under power supply provided by the light-emitting power source terminal; and a second sub-circuit, configured to regulate an equivalent resistance value of the second sub-circuit in an output path through which the drive current is output to the light-emitting device, based on a voltage division control signal received by the voltage division control signal terminal.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: March 19, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Hui Wang, Pengcheng Lu
  • Patent number: 11935106
    Abstract: A method and a system for recommending a target garment matching an inputted garment. The method includes: extracting attributes from text description and image of the inputted garment to obtain extracted attributes; querying a knowledge graph using the extracted attributes to obtain matched attributes; retrieving candidate products from a garment pool using the matched attributes; extracting features from the inputted garment and the candidate products; determining the target garment from the candidate products based on grading scores between the features of the inputted garment and the features of the candidate products; and recommending the target garment. The knowledge graph includes nodes corresponding to type of clothes, category of clothes, attribute keys, values of attribute keys, context keys, values of context keys, combination of the values of the attribute keys and the type of clothes, and combination of the value of the attribute keys and the category of clothes.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: March 19, 2024
    Assignees: BEIJING WODONG TIANJUN INFORMATION TECHNOLOGY CO., LTD., JD.COM AMERICAN TECHNOLOGIES CORPORATION
    Inventors: Shanglin Yang, Shizhu Liu, Min Li, Huiman Hou, Qin Wang, Jixing Wang, Yuhao Zhang, Zizhen Wang, Xin Li, Hui Zhou
  • Publication number: 20240085587
    Abstract: In a logging identification method for a small fault based on stress anisotropy and crustal stress types, a magnitude and direction of a current crustal stress are determined by means of logging calculation of the crustal stress, and a transformation location of a crustal stress type is determined; a development location of the small fault is determined according to the transformation location of the crustal stress type; and an included angle between the current crustal stress and the fault is determined according to an amplitude of variation of stress anisotropy. The present disclosure provides the logging identification method for a small fault based on stress anisotropy and crustal stress types. According to the method, prediction cost is low, operability is high, and a prediction result has a reference value for guiding exploration and development of a complex oil and gas reservoir and construction of a gas storage.
    Type: Application
    Filed: May 10, 2023
    Publication date: March 14, 2024
    Applicant: CHINA UNIVERSITY OF GEOSCIENCES (WUHAN)
    Inventors: Jingshou LIU, Chuanbo SHEN, Lianfu MEI, Hui ZHANG, Ke XU, Zhonghu WU, Ruyue WANG, Wenlong DING, Haimeng YANG, Hejuan LIU
  • Publication number: 20240090348
    Abstract: A quantum device, a manufacturing method thereof, and an electronic device are provided. The quantum device includes: a quantum chip, wherein a signal transmission element and a connecting segment electrically connected to the signal transmission element are formed on the quantum chip; a package substrate, wherein a lead-out segment and a lead-out signal line configured to be electrically connected to a signal connector are formed on the package substrate, and the lead-out signal line is electrically connected to the lead-out segment; and a ball grid array configured to electrically connect the connecting segment to the lead-out segment corresponding to each other. The ball grid array electrically connects the connecting segment to the lead-out segment whose signal transmission properties correspond to each other, thereby realizing electrically connecting the quantum chip to the transmission line, and leading out the connecting segment to an external signal connector.
    Type: Application
    Filed: October 17, 2023
    Publication date: March 14, 2024
    Inventors: Hui YANG, Ye Li
  • Publication number: 20240087103
    Abstract: A vision inspection system for laser welds includes a scanning station to support a workpiece including one or more laser welds. A vision sensing assembly includes a top surface, a bottom surface, side surfaces, a light source, and a sensor. The light source illuminates the workpiece while the sensor generates an image of the one or more laser welds of the workpiece. A shield is arranged around the top surface and the side surfaces of the vision sensing assembly. The bottom surface of the vision sensing assembly is arranged above a lower edge of the shield by a first predetermined distance.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Guangze LI, Hui-ping WANG, Christopher WARMACK, Robert S. BUCCHI, Robert T. SZYMANSKI, Paolo A. NOVELLETTO, Baixuan YANG, Weitian ZHOU
  • Publication number: 20240085866
    Abstract: The present disclosure provides a method and device for intelligent control of heating furnace combustion based on a big data cloud platform, which relates to the technical field of artificial intelligence control. The method includes: construction of big data cloud platform based on production and operation parameters of the heating furnace; identification of key factors in the production process of the heating furnace by using big data mining technology; independent deployment of traditional heating furnace combustion control systems based on the mechanism model; and integration of cloud platform big data expert knowledge base and the heating furnace combustion intelligent control system.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Applicant: University of Science and Technology Beijing
    Inventors: Qing LI, Fengqin LIN, Hui LI, Li WANG, Chengyong XIAO, Xu YANG, Jiarui CUI, Chunqiu WAN, Qun YAN, Yan LIU, Lei MIAO, Jin GUO, Boyu ZHANG, Chen HUANG, Yaming XI, Yuxuan LIN
  • Publication number: 20240086362
    Abstract: A key-value store and a file system are integrated together to provide improved operations. The key-value store can include a log engine, a hash engine, a sorting engine, and a garbage collection manager. The features of the key-value store can be configured to reduce the number of I/O operations involving the file system, thereby improving read efficiency, reducing write latency, and reducing write amplification issues inherent in the combined key-value store and file system.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 14, 2024
    Inventors: Hao Wang, Jiaxin Ou, Sheng Qiu, Yi Wang, Zhengyu Yang, Yizheng Jiao, Jingwei Zhang, Jianyang Hu, Yang Liu, Ming Zhao, Hui Zhang, Kuankuan Guo, Huan Sun, Yinlin Zhang
  • Patent number: 11926914
    Abstract: Provided is a tungsten electrode for molten salt electrolysis for rare earth metals preparation, including an open tungsten shell and a copper alloy body; wherein the copper alloy body is arranged inside the open tungsten shell; a tungsten buffer layer is provided between a side wall of the copper alloy body and the open tungsten shell; and a bottom of the copper alloy body is in contact with an inner bottom of the open tungsten shell.
    Type: Grant
    Filed: August 28, 2023
    Date of Patent: March 12, 2024
    Assignee: Ganzhou Chenguang Rare Earths New Material Co., Ltd.
    Inventors: Shaohua Yang, Zhenhong Cui, Hui Li, Senlin Ouyang, Yao Xie, Fangsong He, Guangdong Wu, Kangwei Xie