Patents by Inventor Hung-Fai Stephen Law

Hung-Fai Stephen Law has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200219840
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: March 4, 2020
    Publication date: July 9, 2020
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10607961
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 31, 2020
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10478857
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: November 19, 2019
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Publication number: 20190259907
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10297712
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 21, 2019
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Publication number: 20190096846
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10121864
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 6, 2018
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Publication number: 20180297080
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Application
    Filed: June 20, 2018
    Publication date: October 18, 2018
    Applicant: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Patent number: 10022750
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: July 17, 2018
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Patent number: 9919342
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: March 20, 2018
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Patent number: 9831383
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 28, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • Patent number: 9773750
    Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: September 26, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
  • Patent number: 9620478
    Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Publication number: 20170018613
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 19, 2017
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 9463613
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: October 11, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 9375850
    Abstract: Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: June 28, 2016
    Assignee: FUJIFILM DIMATIX, INC.
    Inventors: Arman Hajati, Dimitre Latev, Deane Gardner, Hung-Fai Stephen Law
  • Publication number: 20150298174
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Application
    Filed: June 29, 2015
    Publication date: October 22, 2015
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Publication number: 20150298173
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Application
    Filed: June 29, 2015
    Publication date: October 22, 2015
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
  • Patent number: 9070861
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: June 30, 2015
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-Fai Stephen Law, Kevin Von Essen, Mats G. Ottosson
  • Patent number: 9070862
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: June 30, 2015
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-Fai Stephen Law, Kevin Von Essen, Mats G. Ottosson