Abstract: A static random access memory (SRAM) that includes a memory cell comprising at least two p-type pass gates. The SRAM also includes a first data line connected to the memory cell, a second data line connected to the memory cell and a voltage control unit connected to the first data line, wherein the voltage control unit is configured to control the memory cell.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: In one embodiment, a static random access memory (SRAM) device is provided. The SRAM device comprises a plurality of memory cells, a bit line coupled to a first set of the plurality of memory cells at data nodes, and a first voltage supply line coupled to a second set of the plurality of memory cells. The SRAM device further comprises a first switch for selectively coupling the first voltage supply line to a first voltage source to charge the first voltage supply line to a first voltage level and a second switch for selectively coupling the first voltage supply line to the bit line for pre-charging the bit line to a bit line voltage level that is less than the first voltage level.

Abstract: A device is disclosed that includes a memory bit cell, a first word line, a pair of metal islands and a pair of connection metal lines. The first word line is disposed in a first metal layer and is electrically coupled to the memory bit cell. The pair of metal islands are disposed in the first metal layer at opposite sides of the word line and are electrically coupled to a power supply. The pair of connection metal lines are disposed in a second metal layer and are configured to electrically couple the metal islands to the memory bit cell respectively.

Abstract: A method, of writing to a memory cell, includes: causing a pulling device of the memory cell to pull a voltage level at a first data node of the memory cell toward a first supply voltage level responsive to a voltage level at a second data node of the memory cell; causing a pass gate of the memory cell to pull the voltage level at the first data node of the memory cell toward a second supply voltage level responsive to a word line signal, the second supply voltage level being different from the first supply voltage level; and limiting a driving capability of the pulling device by a resistive device, the resistive device being electrically coupled between the pulling device and a supply voltage source configured to provide a first supply voltage, the first supply voltage having the first supply voltage level.

Abstract: Some embodiments relate to an SRAM cell layout including upper and lower cell edges and left and right cell edges. A first power rail extends generally in parallel with and lies along the left cell edge or the right cell edge. The first power rail is coupled to a first power supply. A second power rail extends generally in parallel with the first power rail and is arranged equidistantly between the left and right cell edges. A first bitline extends in parallel with the first power rail and the second power rail and is arranged to a first side of the second power rail. A second bitline, which is complementary to the first bitline, extends in parallel with the first power rail and the second power rail and is arranged to a second side of the second power rail.

Abstract: A system includes a net-identifying module and a false path-eliminating module. The net-identifying module is configured to receive first and second electronic lists associated with a circuit unit, to identify a net of the circuit unit based on the first electronic list, and to provide a net information output that includes information associated with the net. The false path-eliminating module is coupled to the net-identifying module and is configured to select, in the second electronic list, a path of the circuit unit that does not traverse through the net and provide a path information output that includes information associated with the path.

Abstract: A memory cell comprises a first word line in a first layer on a first level. The memory cell also comprises a second word line having a first portion in the first layer and a second portion in a second layer. The second layer is on a second level different from the first level. The memory cell further comprises a first via layer coupling the first portion of the second word line with the second portion of the second word line.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: A static random access memory (SRAM) includes a bit cell that includes a p-type pass gate, a bit information path connected to the bit cell by the p-type pass gate, and a write multiplexer connected to the bit information path. The write multiplexer includes a p-type transistor configured to selectively couple the bit information path to a flip-flop.

Abstract: A system includes a net-identifying module and a false path-eliminating module. The net-identifying module is configured to receive first and second electronic lists associated with a circuit unit, to identify a net of the circuit unit based on the first electronic list, and to provide a net information output that includes information associated with the net. The false path-eliminating module is coupled to the net-identifying module and is configured to eliminate a false path of the circuit unit in the second electronic list based on the net information output.

Abstract: Arrays of static random access memory (SRAM) cells and methods of fabricating the same are provided. A first communication path is disposed a first distance from an edge of the array and is operable to control access to SRAM cells of a first row of the array for write operations. A second communication path is disposed a second distance from the edge of the array and is operable to control access to SRAM cells of a second row of the array for write operations. The second distance is different than the first distance. A first conductive structure is disposed a third distance from the edge of the array and is operable to control access to the SRAM cells of the first row for read operations. A second conductive structure is disposed the third distance from the edge of the array and is operable to control access to the SRAM cells of the second row for read operations.

Abstract: Some embodiments relate to an SRAM cell layout including upper and lower cell edges and left and right cell edges. A first power rail extends generally in parallel with and lies along the left cell edge or the right cell edge. The first power rail is coupled to a first power supply. A second power rail extends generally in parallel with the first power rail and is arranged equidistantly between the left and right cell edges. A first bitline extends in parallel with the first power rail and the second power rail and is arranged to a first side of the second power rail. A second bitline, which is complementary to the first bitline, extends in parallel with the first power rail and the second power rail and is arranged to a second side of the second power rail.

Abstract: A hybrid timing analysis method includes: receiving a pre-layout netlist, a post-layout netlist and a configuration file associated with an integrated circuit design; generating a first measurement script and an input stimulus waveform file according to the configuration file; performing a first dynamic timing analysis upon the pre-layout netlist by using the first measurement script and the input stimulus waveform file to generate a pre-layout simulation result; identifying at least one data path and at least one clock path according to the pre-layout simulation result; generating a second measurement script according to the at least on data path and at least one clock path; and performing a second dynamic timing analysis upon the post-layout netlist by using the second measurement script and the input stimulus waveform file to generate a first post-layout simulation result. Associated system and non-transitory computer readable medium are also provided.

Abstract: In some embodiments, a semiconductor memory device includes an array of semiconductor memory cells arranged in rows and columns. The array includes a first segment of memory cells and a second segment of memory cells. A first pair of complementary local bit lines extend over the first segment of memory cells and is coupled to multiple memory cells along a first column within the first segment of memory cells. A second pair of complementary local bit lines extend over the second segment of memory cells and is coupled to multiple memory cells along the first column within the second segment of memory cells. A pair of switches is arranged between the first and second segments of memory cells. The pair of switches is configured to selectively couple the first pair of complementary local bit lines in series with the second pair of complementary local bit lines.

Abstract: A circuit includes a column of memory cells, a first read data line coupled exclusively with a first subset of memory cells of the column of memory cells, a second read data line coupled exclusively with a second subset of memory cells of the column of memory cells, and a plurality of read word lines. Each read word line of the plurality of read word lines is coupled with a memory cell of the first subset of memory cells and with a memory cell of the second subset of memory cells.

Abstract: Systems and methods for a bit-cell are presented. The bit-cell comprises a read-port circuit and a write-port circuit. The read-port circuit comprises four transistors, wherein the read-port circuit is activated by a first threshold voltage. The write-port circuit comprises eight transistors, wherein the write-port circuit is activated by a second threshold voltage. The write-port circuit is coupled to the read-port circuit. The first threshold voltage and the second threshold voltage may be different and may be provided by a single supply voltage.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A memory array includes a column of cells arranged along a first direction and a bit line extending along the first direction over the column of cells. The column of cells includes a set of memory cells and a set of strap cells. The bit line includes a first conductor in a second conductor. The first conductor extends in the first direction and is in a first conductive layer. The second conductor extends in the first direction and is in a second conductive layer different from the first conductive layer.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.