Abstract: The present disclosure provides embodiments of semiconductor structures and method of forming the same. An example semiconductor structure includes a first source/drain feature and a second source/drain feature and a hybrid fin disposed between the first source/drain feature and the second source/drain feature and extending lengthwise along a first direction. The hybrid fin includes an inner feature and an outer layer disposed around the inner feature. The outer layer includes silicon oxycarbonitride and the inner feature includes silicon carbonitride.

Abstract: A modified naphthol resin having a structure as shown in [Formula 3] is provided.

Abstract: A preparation method of a modified naphthol resin includes the following. A nitration reaction and a hydrogenation reaction are sequentially performed on a naphthol resin to form a modified naphthol resin with an amino group in a structure. A solvent used in the hydrogenation reaction includes tetrahydrofuran, toluene, isopropanol, an amide solvent, or an above-mentioned co-solvent.

Abstract: A resin composition includes a resin mixture. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene; a second resin including polyphenylene ether resin modified by bismaleimide; a third resin block polymerized by a monomer mixture including styrene and butadiene; and an acenaphthylene.

Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.

Abstract: A resin composition includes a copolymer. The copolymer includes an aromatic monomer and an alicyclic monomer. A molecular weight of the copolymer is in a range of 2000 to 5000. Compared with the copolymer, a proportion of the alicyclic monomer is 1% to 30%. A manufacturing method of the resin composition is also provided.

Abstract: An interface device and a signal transceiving method thereof are provided. The interface device includes a master circuit and a slave circuit. The slave circuit includes a second receiver, a clock generator, a sampler, and a comparator. The first receiver and second receiver respectively receive input data and a clock signal from the master circuit. The clock generator delays the clock signal according to a delay value to generate a delayed clock signal, and generates a plurality of sampling signals according to the delayed clock signal. The sampler samples the input data according to the sampling signals to generate a plurality of sampling results. The comparator compares the sampling results to generate a comparison result. The clock generator adjusts the delay value according to the comparison result.

Abstract: A resin composition includes resin and inorganic filler. The resin includes CE resin and BMI resin, and a purity of the inorganic filler is at least greater than 99%.

Abstract: A resin composition includes an epoxy resin, a benzoxazine resin, a BMI resin, and a modified polyphenylene ether resin has a structure represented by the following formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups, and n is an integer ranging from 3 to 25.

Abstract: A resin composition is provided, which includes diamine, a BMI resin, and a modified polyphenylene ether resin having a following structural formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: A resin composition includes CE resin, BMI resin, and a modified polyphenylene ether resin has a following general formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: A resin composition includes SBS resin, BMI resin, a crosslinking agent, and a modified polyphenylene ether resin has a following general formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: An interposer device comprises two bump regions, a channel region, a plurality of signal lines and a plurality of ground lines. The two bump regions are respectively coupled to two semiconductor devices. The channel region is connected between the two bump regions. The plurality of signal lines are embedded in the two bump regions and the channel region, and electrically connected to the two semiconductor devices for transmitting circuit signals. The plurality of ground lines are embedded in the two bump regions and the channel region for shielding the plurality of signal lines. In each bump region, each signal line comprises a trunk portion, a turning portion, and a signal turning point connected between the trunk portion and the turning portion. The trunk portion extends parallel to a first direction, and the turning portion extends parallel to a second direction.

Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.

Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.

Abstract: A portable controller with replaceable module includes: a main body having a touchable display screen; a control system installed in the main body; a power supply system installed in the main body and connected to the control system to detect and adjust the power supply; a functional module, detachably connected to the main body to provide data, wherein, the control system is used to display data on the touchable display screen relative to the function module and to control the function module through the touchable display screen. Therefore, the portable controller with replaceable module could be applied to different functional modules to achieve wide area use purpose.

Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.

Abstract: A resin composition and use thereof, wherein the resin composition includes a resin base, an inorganic filler and a siloxane coupling agent. The resin base includes bismaleimide resins, benzoxazine resins, and naphthenic epoxy resins, and the inorganic filler includes strontium titanate or calcium-doped strontium titanate.

Abstract: A modified dicyclopentadiene-based resin and a preparation method thereof are provided. The preparation method of the modified dicyclopentadiene-based resin includes sequentially performing nitration reaction and hydrogenation reaction of a dicyclopentadiene phenolic resin to form a modified dicyclopentadiene-based resin for which the structure has at least two amino groups. The hydrogenation reaction is performed in a solvent at a temperature of 50° C. to 120° C.