Abstract: A system for providing automatic feedback and adjusting transmittal pulling force for transporting glass fragment, where the system comprises a delivery machine, a glass broken machine and a recycle box. The glass fragment is transmitted by the delivery machine and triturated by the glass broken machine, and the triturated glass fragment is then transported to the recycle box, the delivery machine comprises a driving motor, a conveyer belt and two driving rollers, where the conveyer belt surrounds the two driving rollers, the driving rollers are driven by the driving motor to rotate the conveyer belt, and the glass fragment on the conveyer belt is transported into the glass broken machine for triturating and recycling.

Abstract: A system for automatic feedback and adjust transmittal pulling force of the glass fragment comprises a delivery machine, a glass broken machine and a recycle box, the glass fragment is transmitted by the delivery machine and triturated by the glass broken machine, and then transported them to the recycle box, the delivery machine comprises a driving motor, a conveyer belt and a driving roller, the conveyer belt is surrounded between the driving rollers, the driving roller is turn round by the driving of the driving motor to lead the conveyer belt rotating at the same time, and then the glass fragment on the conveyer belt could be transported into the glass broken machine for triturating and recycling. Additional, an electromagnetic control system is provided for automatic adjusting transmittal pulling force of the conveyer belt depends on the distance between the two driving rollers, which is connecting with the driving roller.

Abstract: The present invention discloses a substrate machining apparatus, which comprises a clamping means for clamping the substrate and a supporting means for supporting the substrate, wherein both the clamping means and the supporting means comprise a driver for providing driving force. The substrate hold by the clamping means will move synchronously with respect to the supporting means. There is no relative displacement substantially between the substrate and the supporting means.

Abstract: The invention provides a glass substrate cutting apparatus, comprising workbenches, cutting knives and rollers, wherein a glass substrate is transferred on the workbenches; the cutting knives comprise an upper cutting knife and a lower cutting knife that are arranged the upper end and the lower end of the glass substrate respectively with knife edges opposite to each other, so as to cut the glass substrate into two halves from the upper side and the lower side of the glass substrate; the rollers are arranged at the upper end of the glass substrate; and the glass substrate can be pressed to break down along a cutting crack on the glass substrate. The cutting apparatus further comprises high-pressure nozzles that are arranged between the cutting knifes and the rollers and can eject a high-pressure airflow along the cutting crack so as to accelerate the breakage of the glass substrate.

Abstract: A cutter holding device is provided for a cutting machine and includes: a mounting base and a holding member mounted in the mounting base. The mounting base includes a mounting section, iron cores mounted in the mounting section, and a winding wound around an outer circumference of the mounting section. The mounting section includes a mounting trough formed therein. The holding member is mounted in the mounting trough, wherein the iron cores and the winding collectively form first electromagnets, which upon application of electricity thereto, attract and fix the holding member in the mounting trough of the mounting base. The cutter holding device uses magnetic forces applied between the mounting base and the holding member for attraction and fixing so as to easily control fixing and removal of the holding member.

Abstract: The present invention provides a cutter holding device of a cutting machine, which includes: a mounting base and a holding member mounted in the mounting base. The mounting base includes a mounting section, iron cores mounted in the mounting section, and a winding wound around an outer circumference of the mounting section. The mounting section includes a mounting trough formed therein. The holding member is mounted in the mounting trough, wherein the iron cores and the winding collectively form first electromagnets, which upon application of electricity thereto, attract and fix the holding member in the mounting trough of the mounting base. The cutter holding device of the cutting machine of the present invention uses magnetic forces applied between the mounting base and the holding member for attraction and fixing so that it is easy to control the fixing and removal of the holding member and the operation is easy without any need of mechanical retention.

Abstract: A gripping mechanism is disclosed. The gripping mechanism includes a first gripping arm and a second gripping arm movable with respect to each other. Each of the gripping arms includes a fixing arm and a clasping portion connecting to the fixing arm. The clasping portions of the two gripping arms are arranged opposite to each other to form a gripping space therebetween. The clasping portion includes a vacuum hole connecting to a vacuum controlling device, and the vacuum controlling device sucks a gripped target via performing a vacuum suction by the vacuum hole when the gripping mechanism performs a gripping process. In addition, a cutting device of liquid crystal panel including the above gripping mechanism and a cutting method adopting the cutting device are disclosed.