Patents by Inventor Hwa Yoon Song

Hwa Yoon Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210234072
    Abstract: A semiconductor light emitting device includes a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a transparent electrode layer on the second conductivity-type semiconductor layer and spaced apart from an edge of the second conductivity-type semiconductor layer, a first insulating layer on the light emitting structure to cover the transparent electrode layer and including a plurality of holes connected to the transparent electrode layer, and a reflective electrode layer on the first insulating layer and connected to the transparent electrode layer through the plurality of holes.
    Type: Application
    Filed: April 9, 2021
    Publication date: July 29, 2021
    Inventors: JuHeon Yoon, Jung Hwan Kil, Tae Hun Kim, Hwa Ryong Song, Jae In Sim
  • Publication number: 20210203092
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 1, 2021
    Inventors: Kyung Hun JUNG, Hwa Yoon SONG, Young Jo KIM, Yu Jin LEE, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Publication number: 20210203093
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 1, 2021
    Inventors: Kyung Hun JUNG, Hwa Yoon SONG, Young Jo KIM, Yu Jin LEE, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Publication number: 20210143596
    Abstract: The present invention relates to a connection having a joint with a limited range of motion, the connector including: a connection connector including a connection signal pin, a connection dielectric surrounding the connection signal pin, and a connection ground electrically insulated from the connection signal pin by the connection dielectric; and a first fixed connector into which one side of the connection connector is inserted and which allows a joint of the connection connector to move on the basis of the inserted one side of the connection connector, wherein the connection ground includes a connection protruding portion formed so that one end of the connection ground protrudes outward, a connection limiting portion which is adjacent to the connection protruding portion, has a thickness smaller than a thickness of the connection protruding portion, and comes in contact with an inner side of the first fixed connector to limit a range of motion of the joint of the connection connector, a connection elastic
    Type: Application
    Filed: September 30, 2020
    Publication date: May 13, 2021
    Inventors: Kyung Hun JUNG, Sun Hwa CHA, Hwa Yoon SONG, Chang Hyun YANG, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Publication number: 20210028567
    Abstract: A board mating connector includes a signal contact unit, a first ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit, a second ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit and at least a portion of the first ground portion, and an elastic member disposed between the first ground portion and the second ground portion to provide an elastic restoring force in a first direction. The first ground portion includes a first protrusion protruding outward or inward from a lower end portion thereof, and the second ground portion includes a second protrusion protruding from an upper end portion thereof in a direction different from that of the first protrusion. The first protrusion is engaged with the second protrusion in the hollow portion of the second ground portion.
    Type: Application
    Filed: June 19, 2020
    Publication date: January 28, 2021
    Inventors: Sun Hwa Cha, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10804635
    Abstract: In one example, a board mating connector, in which a signal contact unit and a ground contact unit are interlocked, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a ground portion and another ground portion which is relatively moved in contact with the ground portion so as to be coupled to and interlocked with a connection portion through the dielectric unit.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: October 13, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10790604
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: September 29, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20200259282
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10700456
    Abstract: A board-mating connector with a reduced coupling height includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10622765
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 14, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20200021049
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: January 16, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10530099
    Abstract: In one example, a board mating connection, which includes a ground unit in which a tapered portion is formed, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a first ground portion which has a first ground hollow portion and includes a second ground portion of which the other side is partially inserted into the first ground hollow portion and which has a second ground hollow portion, the first ground portion includes a first ground tapered portion formed on a wall thereof so as to have an inclined shape such that an inner diameter thereof is gradually decreased toward the other side thereof, and the second ground portion has t
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: January 7, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: D908097
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: January 19, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908637
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908638
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908639
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D909311
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: February 2, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D913945
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 23, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Jin Uk Lee, Hee seok Jung, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D914606
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 30, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D915286
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: April 6, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim