Patents by Inventor Hye Yeon Cha

Hye Yeon Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inductor and manufacturing method thereof
    Patent number: 10014102
    Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 3, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woon Chul Choi, Sung Hyun Kim, Hye Yeon Cha
  • COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180158584
    Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
    Type: Application
    Filed: July 31, 2017
    Publication date: June 7, 2018
    Inventors: Ho Sik PARK, Sang Jae LEE, Youn Soo SEO, Yong Sam LEE, Hye Yeon CHA, Jae Ha KIM
  • CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20180148854
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Application
    Filed: January 26, 2018
    Publication date: May 31, 2018
    Inventors: Hye Yeon CHA, Dong Hwan LEE, Jung Hyuk JUNG, Chan Yoon, Hye Min Bang, Tae Young KIM
  • THIN FILM-TYPE INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180137975
    Abstract: A thin film-type inductor includes a body including a support member, a coil disposed. on at least one surface of the support member, and a filler embedding the support member on which the coil is disposed, and an external electrode disposed. on an external surface of the body. An insulating layer is not disposed on an edge portion of the support member and the edge portion is in direct contact with a filler. The insulating layer is only disposed on an upper surface of the coil to conform to a surface of the coil.
    Type: Application
    Filed: August 10, 2017
    Publication date: May 17, 2018
    Inventors: Il Ho CHA, Sang Jae LEE, Ho Sik PARK, Hye Hun PARK, Kwang Jik LEE, Hye Yeon CHA, Jae Ha KIM
  • Chip electronic component and manufacturing method thereof
    Patent number: 9966178
    Abstract: Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: May 8, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Youn-Soo Seo, Myung-Sam Kang, Jin-Soo Kim, Young-Gwan Ko, Woon-Chul Choi, In-Seok Kim, Hye-Yeon Cha
  • COIL COMPONENT
    Publication number: 20180122546
    Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.
    Type: Application
    Filed: August 14, 2017
    Publication date: May 3, 2018
    Inventors: Yong Sam LEE, Eo Jin CHOI, Jae Hun KIM, Ji Hyun EOM, Hye Yeon CHA
  • Chip electronic component and manufacturing method thereof
    Patent number: 9945042
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: April 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
  • Chip electronic component and manufacturing method thereof
    Patent number: 9899143
    Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hee Kim, Tae Young Kim, Myoung Soon Park, Sung Hyun Kim, Hye Yeon Cha
  • INDUCTOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20180033542
    Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
    Type: Application
    Filed: October 9, 2017
    Publication date: February 1, 2018
    Inventors: Woon Chul CHOI, Sung Hyun KIM, Hye Yeon CHA
  • Inductor and method for manufacturing the same
    Patent number: 9852836
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Soo Park, Seong Min Chin, Hwan Soo Lee, Hye Yeon Cha
  • Chip electronic component and manufacturing method thereof
    Patent number: 9773611
    Abstract: A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: September 26, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyun Kim, Myoung Soon Park, Sung Hee Kim, Tae Young Kim, Hye Yeon Cha
  • Power inductor and manufacturing method thereof
    Patent number: 9741490
    Abstract: Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: August 22, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Young Do Kweon, Young Seuck Yoo, Hwan Soo Lee, Woon Chul Choi
  • METAL-POLYMER COMPLEX FILM FOR INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20170200549
    Abstract: Disclosed herein are a metal-polymer complex film for an inductor and a method for manufacturing an inductor, the inductor being manufactured by using the metal-polymer complex film for an inductor, including: a metal powder; and an amorphous epoxy resin, wherein the metal-polymer complex film is made in a film type by using a mixture where a weight ratio of the metal powder is 75˜98 wt %, so that a plurality of inductors can be simultaneously manufactured to thereby improve production efficiency and characteristic values of the inductor can be also improved.
    Type: Application
    Filed: March 27, 2017
    Publication date: July 13, 2017
    Inventors: Moon Soo PARK, Ic Seob KIM, Hwan Soo LEE, Dong Hyeok CHOI, Hye Yeon CHA
  • Chip inductor
    Patent number: 9660013
    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwan Soo Lee, Hye Yeon Cha, Jung Min Park, Kang Heon Hur, Moon Soo Park
  • CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20170047160
    Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.
    Type: Application
    Filed: October 31, 2016
    Publication date: February 16, 2017
    Inventors: Sung Hee KIM, Tae Young KIM, Myoung Soon PARK, Sung Hyun KIM, Hye Yeon CHA
  • COIL COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20160343498
    Abstract: A coil component includes a coil unit surrounded by a magnetic body. The magnetic body includes anisotropic metal powder and isotropic metal powder, and upper and lower cover units with the coil unit interposed therebetween. The anisotropic metal powder is arranged such that one axis of a plate-shaped plane thereof is oriented in a flow direction of magnetic flux, and central regions of the upper and lower cover units comprise the isotropic metal powder.
    Type: Application
    Filed: January 19, 2016
    Publication date: November 24, 2016
    Inventors: Dong Hwan LEE, Chan YOON, Moon Soo PARK, Hye Yeon CHA, Byeong Cheol MOON
  • MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    Publication number: 20160343506
    Abstract: A multilayer ceramic electronic component may include first and second metal frames connected to different external electrodes of a multilayer ceramic capacitor, respectively, and disposed to be spaced apart from a mounting surface of the multilayer ceramic capacitor; and an insulating layer disposed on a surface of the multilayer ceramic capacitor opposing the mounting surface thereof.
    Type: Application
    Filed: January 19, 2016
    Publication date: November 24, 2016
    Inventors: Dong Hwan LEE, Chan YOON, Moon Soo PARK, Hye Yeon CHA, Byeong Cheol MOON
  • COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160343486
    Abstract: A coil electronic component is provided that includes a magnetic body including a core part and a coil wound around the core part. The core part includes metal flakes and a resin, and is formed by injection-molding. Methods of manufacturing the coil electronic component are provided. The methods include injection-molding metal flakes and a resin to prepare a cylindrical structure around which the coil is provided.
    Type: Application
    Filed: January 14, 2016
    Publication date: November 24, 2016
    Inventors: You Na KIM, Moon Soo PARK, Dong Hwan LEE, Hye Yeon CHA, Jong Ho LEE
  • INDUCTOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20160336107
    Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
    Type: Application
    Filed: July 28, 2016
    Publication date: November 17, 2016
    Inventors: Woon Chul CHOI, Sung Hyun KIM, Hye Yeon CHA
  • POWER INDUCTOR AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160329146
    Abstract: There is provided a power inductor including: a lower substrate formed of a magnetic material; an inductor main body formed on an upper surface of the lower substrate; at least one coil portion including a conductive via and formed inside the inductor main body; and external electrodes formed at both ends of the inductor main body and electrically connected to the at least one coil portion.
    Type: Application
    Filed: July 20, 2016
    Publication date: November 10, 2016
    Inventors: Hwan-Soo LEE, Kang Heon HUR, Jung Min PARK, Hye Yeon CHA