Patents by Inventor Hyeon Cho

Hyeon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8883016
    Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: November 11, 2014
    Inventors: Jae Joon Lee, Jin Yong Ahn, Suk Hyeon Cho, Ki Hwan Kim, Seok Kyu Lee
  • Patent number: 8815852
    Abstract: There is provided a novel carbamoyloxy arylalkanoyl arylpiperazine derivative compound having abundant racemic or enantiomeric characteristics, represented by the Formula 1, and pharmaceutically available salts or hydrates thereof. Also, there are provided a pharmaceutical composition for treating pain, anxiety or depression including an effective amount of the compound, and a method for treating pain, anxiety or depression in mammals by administering an effective amount of the compound to the mammals in need of treatment thereof.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: August 26, 2014
    Assignee: SK Biopharmaceuticals Co., Ltd.
    Inventors: Ki Ho Lee, Han Ju Yi, Hyeon Cho, Dae Joong Im, Eun Hee Chae, Yeon Jung Choi
  • Publication number: 20140211483
    Abstract: Provided is an optical sheet, the optical sheet comprising: a base film; and a plurality of constructions which are irregularly arranged on one surface of the base film so that an arrangement axis of one construction is out of an arrangement axis of another construction adjacent to one side surface of the base film within a range of 1 to 50% of a length or a width of the another construction. Thus, a protective film and a prism type sheet are removed, and the weakness and workability of processes are improved, thereby being capable of reducing a unit price. Furthermore, a shielding force which is the most weakness of the prism type sheet can be improved.
    Type: Application
    Filed: August 31, 2012
    Publication date: July 31, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Su Hyeon Cho
  • Publication number: 20140166348
    Abstract: Disclosed herein is a printed circuit board capable of suppressing warpage due to a difference in thermal expansion coefficients with circuit patterns in the same layer by way of forming a filling material having a thermal expansion coefficient similar to that of the circuit pattern between the circuit patterns and on the surface. Further, on a surface of the filling material, a laminate having a thermal expansion amount lower than that of the filling material so that overall thermal expansion coefficients of the printed circuit board is lowered, and an insulation material having a lower thermal expansion coefficient and thus rarely flowing is easily attached.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Suk Hyeon Cho
  • Publication number: 20140151095
    Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Hyeon Cho, Tae Hong Min, Seung Yeop Kook, Jung Han Lee, Hye Jin Kim
  • Patent number: 8683684
    Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: April 1, 2014
    Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
  • Publication number: 20140027047
    Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
    Type: Application
    Filed: September 30, 2013
    Publication date: January 30, 2014
    Inventors: Jae Joon LEE, Jin Yong Ahn, Suk Hyeon Cho, Ki Hwan Kim, Seok Kyu Lee
  • Publication number: 20140027163
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 30, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: TAE HONG MIN, SUK HYEON CHO, JONG RIP KIM, JUNG HAN LEE
  • Publication number: 20130286330
    Abstract: An optical film and a liquid crystal display including the same, the optical film including a first compensation layer having a relation of n1z>n1x>n1y between indexes of refraction n1x, n1y, and n1z in x-axis, y-axis, and z-axis directions on a plane; and a second compensation layer having a relation of n2x>n2y>n2z between indexes of refraction n2x, n2y, and n2z in x-axis, y-axis, and z-axis directions on a plane.
    Type: Application
    Filed: June 29, 2013
    Publication date: October 31, 2013
    Inventors: Moon-Yeon LEE, Hyeon CHO, Hyun-Gi KIM, Hae-Ryong CHUNG, Jong-Gyu LA
  • Publication number: 20130279916
    Abstract: Embodiments disclose a server system including a first circuit board which includes a first socket connected to a memory controller via an electrical channel; and a second circuit board which is combined with the first socket such that signals are exchanged with the memory controller via at least one of the electrical channel and an optical channel. The optical channel is combined with the electrical channel via an electrical-to-optical conversion device, the electrical-to-optical conversion device converts an electrical signal into an optical signal or converts an optical signal into an electrical signal.
    Type: Application
    Filed: February 14, 2013
    Publication date: October 24, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-hyeon CHO, You-keun HAN, Seung-jin SEO, Jung-joon LEE, Kyoung-ho HA
  • Patent number: 8563141
    Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: October 22, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Joon Lee, Jin Yong Ahn, Suk Hyeon Cho, Ki Hwan Kim, Seok Kyu Lee
  • Patent number: 8505463
    Abstract: The wheel-type high-speed railway system includes rails provided on a railroad track and configured such that wheels provided in a bogie of a vehicle come into contact with them, a support provided on a tread surface of a railroad track between the rails, a repulsive Linear Synchronous Motor (LSM) provided between the bogie and the support and configured to improve traveling performance by reducing axle load in a high-speed region, first and second steel plates mounted on both sides of the support in inclined positions, and first and second attractive Dynamic Motion Control (DMC) magnets mounted on the bogie of the vehicle in inclined positions to correspond to the first and second steel plates, and configured to generate attractive force.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: August 13, 2013
    Assignee: Korea Railroad Research Institute
    Inventors: Sam-Young Kwon, Hyung-Woo Lee, Chan-Bae Park, Byung-Song Lee, Hyun-June Park, Yong-Hyeon Cho, Nam-Po Kim, Sin-Chu Yang, Jun-Suk Lee, Man-Cheol Kim, Kang-Youn Choe
  • Publication number: 20130188364
    Abstract: The present invention relates to an optical sheet or an optical unit used for a lighting device. In particular, the present invention provides an optical sheet comprising a plurality of lens patterns formed on a base member, where SAG (height H: lens diameter R) of the lens pattern ranges from 0.01 to 0.3. The present invention provides an optical sheet which minimizes total reflection by adjusting SAG of a lens pattern formed on a base member, thereby realizing a high-brightness lighting device.
    Type: Application
    Filed: March 4, 2011
    Publication date: July 25, 2013
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Su Hyeon Cho, Dong Hyun Lee
  • Publication number: 20130163081
    Abstract: A polarizing plate for use with an organic light emitting display includes an adhesive layer, a retardation film, a polarizer, and a protective film sequentially stacked in this order, the polarizing plate further including a positive C plate.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 27, 2013
    Inventors: Hyeon CHO, Do Won KIM, Ran KIM, Jin Sook KIM, Jik Soo SHIN
  • Patent number: 8468949
    Abstract: Provided is a tube railway system that reduces noise and air resistance using a sealed evacuated tube as a passage for a tube railway, thereby allowing a train to run at a higher speed. A vacuum division management system and a vacuum blocking screen device for a tube railway system required to maintain vacuum are provided, in which the vacuum blocking screen device is operated to rapidly block a passage for a tube railway in response to an operation signal, is installed at every certain section or at a designated section of the tube railway, and is operated in a specific section when a vacuum maintenance problem occurs, or when the vacuum needs to be released, or when the train needs to stop immediately, thereby allowing the specific section to be isolated from other sections to have a degree of vacuum different from those of the other sections.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: June 25, 2013
    Assignee: Korea Railroad Research Institute
    Inventors: Sam-Young Kwon, Hyung-Chul Kim, Dong-Wook Jang, Yong-Hyeon Cho, Hyung-Woo Lee, Chan Bae Park
  • Publication number: 20130126215
    Abstract: The present invention relates to a printed circuit board including: a substrate; a circuit pattern formed on a surface of the substrate; a dummy pattern formed on the surface of the substrate, where the circuit pattern is not formed, to be spaced apart from the circuit pattern by a predetermined interval; and a plurality of heat radiating vias formed along an outer edge of the substrate to electrically connect the dummy patterns through the substrate, and it is possible to suppress generation of electromagnetic waves or shield the electromagnetic waves and improve heat radiating characteristics at the same time.
    Type: Application
    Filed: June 5, 2012
    Publication date: May 23, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Hyeon Cho, Francis Sohn
  • Publication number: 20130111685
    Abstract: The present invention relates to a nonwoven fabric for cleaning and to a production method for the same. Provided is a nonwoven fabric for cleaning and a production method therefor, comprising: a raw-material supply step in which between 80 and 90 parts by weight of cotton fibre and between 10 and 20 parts by weight of synthetic fibre are introduced; a step in which the introduced raw materials are mixed by using a blowing and scutching machine; a step in which a web is produced in the form of a sheet by using a carding machine to process the mixed raw materials; a step in which a fibrous web is produced by layering a plurality of the webs and then spraying a water jet so as to join the plurality of webs to each other; and a heat-treatment step in which the fibrous web is subjected to hot drying, and the synthetic fibre is softened and the bond with the cotton fibre is strengthened. Also provided is a production method for the nonwoven fabric.
    Type: Application
    Filed: August 10, 2010
    Publication date: May 9, 2013
    Applicant: WINNERSKOREA CO., LTD.
    Inventor: Hyeon Cho
  • Publication number: 20130088838
    Abstract: A die package includes a substrate, a die mounted on the substrate, and a ZQ resistor disposed in the die package and connected to the substrate and the die. The ZQ resistor may be used to calibrate impedance of the die.
    Type: Application
    Filed: August 6, 2012
    Publication date: April 11, 2013
    Inventors: JAE JUN LEE, Jeong Hyeon Cho, Baek Kyu Choi, Sun Won Kang, Jung Joon Lee
  • Publication number: 20120218703
    Abstract: A circuit board assembly includes a first circuit board having an electrical connection circuit on a surface thereof. A second circuit board is on the surface of the first circuit board. A first memory socket is mounted on the second circuit board. The first memory socket is only electrically connected to the electrical connection circuit through the second circuit board. A second memory socket is mounted on the second circuit board. The second memory socket that is only electrically connected to the electrical connection circuit through the second circuit board.
    Type: Application
    Filed: September 22, 2011
    Publication date: August 30, 2012
    Inventors: Jeong Hyeon Cho, Myung Hee Sung, Kyoung Sun Kim, Seung Jin Seo, Jung Joon Lee
  • Publication number: 20120210576
    Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Inventors: Jin Yong AN, Suk Hyeon CHO, Ji Hong JO