Abstract: A polarizer plate includes a polarizer that includes polyvinyl alcohol and a dichroic material, the polarizer having a degree of orientation of 15 or more as represented by Equation 1: Degree of orientation=RD/RPVA×100, where RPVA represents a phase difference of the polyvinyl alcohol and RD represents a phase difference of the dichroic material.

Abstract: The invention is directed to a method and system for automatically processing multimedia files in a cloud-based multi-media application server. The processing comprises parsing metadata from the multimedia files and automatically generating a description. The system comprises a file system, a content detector; and a content processor.

Abstract: Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.

Abstract: There is provided a novel carbamoyloxy arylalkan arylpiperazine derivative compound having abundant racemic or enantiomeric characteristics, represented by the formula 1, and pharmaceutically available salts or hydrates thereof. Also, there are provided a pharmaceutical composition for treating pain (i.e., acute or chronic pain, neuropathic pain, inflammatory pain, diabetic pain, postherpetic neuralgia, etc.), anxiety or depression including an effective amount of the compound, and a method for treating pain, anxiety or depression in mammals by administering an effective amount of the compound to the mammals in need of treatment thereof.

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract: The present invention provides a printed circuit board including: an insulating member having a through via hole; a circuit pattern disposed on the insulating member; a solder resist disposed on the insulating member while exposing a portion of the circuit pattern; a via plating pad connected to the circuit pattern, disposed inside the via hole, and covering a lower opening of the via hole along an inner wall of the via hole; and an external connection means having a center portion coinciding with a center portion of the via hole and disposed on the via plating pad, and a method of manufacturing the same.

Abstract: Provided is a tube railway system that minimizes noise and air resistance using a sealed evacuated tube as a passage for a tube railway., thereby allowing a train to run at a very high speed. More particularly, provided is a vacuum division management system and vacuum blocking screen device for a tube railway system required to maintain vacuum (1/3 to 1/1000 of atmospheric pressure), in which the vacuum blocking screen device serves to rapidly block a passage for a tube railway with an operation signal, is installed in every fixed section or in some designated sections of the tube railway, and is driven in a specific section where problems with maintenance of the vacuum occur, where the vacuum is intentionally released, for instance, due to maintenance, or where a train is urgently stopped, thereby allowing the specific section to be isolated from the other sections and to be managed with a degree of vacuum different from those of the other sections.

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

Abstract: The wheel-type high-speed railway system includes rails provided on a railroad track and configured such that wheels provided in a bogie of a vehicle come into contact with them, a support provided on a tread surface of a railroad track between the rails, a repulsive Linear Synchronous Motor (LSM) provided between the bogie and the support and configured to improve traveling performance by reducing axle load in a high-speed region, first and second steel plates mounted on both sides of the support in inclined positions, and first and second attractive Dynamic Motion Control (DMC) magnets mounted on the bogie of the vehicle in inclined positions to correspond to the first and second steel plates, and configured to generate attractive force.

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.

Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.

Abstract: Pairs of registers with reduced pins are disposed to overlap on front and back surfaces of a memory module. An input signal INS is transferred through the registers in series in a daisy chain fashion to avoid divergence of the input signal INS for preserved signal integrity. Each register buffers the input signal INS to memory banks disposed closely to sides of the register for reduced wiring area.

Abstract: There is provided a novel carbamoyloxy arylalkanoyl arylpiperazine derivative compound having abundant racemic or enantiomeric characteristics, represented by the Formula 1, and pharmaceutically available salts or hydrates thereof. Also, there are provided a pharmaceutical composition for treating pain, anxiety or depression including an effective amount of the compound, and a method for treating pain, anxiety or depression in mammals by administering an effective amount of the compound to the mammals in need of treatment thereof.

Abstract: A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.