Patents by Inventor Hyeon-hyang KIM

Hyeon-hyang KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10418431
    Abstract: A display device may include a light emitting element, a buffer layer, a gate insulation layer, and a switching element. A refractive index of the gate insulation layer may be equal to a refractive index of the buffer layer. The switching element may be electrically connected to the light emitting element and may include an active layer and a gate electrode. The active layer may be positioned between the buffer layer and the gate insulation layer and may directly contact at least one of the buffer layer and the gate insulation layer. The gate insulation layer may be positioned between the active layer and the gate electrode and may directly contact at least one of the active layer and the gate electrode.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: September 17, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hye-Hyang Park, Joo-Hee Jeon, Seung-Ho Jung, Chaun-Gi Choi, Hyeon-Sik Kim, Hui-Won Yang, Eun-Young Lee
  • Patent number: 10068832
    Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun-bong Han, Hyeon-hyang Kim
  • Publication number: 20180204783
    Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.
    Type: Application
    Filed: December 13, 2017
    Publication date: July 19, 2018
    Inventors: Eun-bong HAN, Hyeon-hyang KIM
  • Publication number: 20170057161
    Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.
    Type: Application
    Filed: August 5, 2016
    Publication date: March 2, 2017
    Inventors: Keon KUK, Eun-bong HAN, Young-dae KO, Hyeon-hyang KIM, O-hyun BEAK, Jun-hee LEE, Yeon-kyoung JUNG
  • Publication number: 20160262292
    Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keon KUK, Young-dae KO, O-hyun BEAK, Eun-bong HAN, Hyeon-hyang KIM, Yeon-kyoung JUNG, Il-ju MUN